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IC Packaging and testing industry to move into stagnation in 2008, says SPIL chairman

Ingrid Lee, Taipei; Steve Shen, DIGITIMES Asia Friday 2 May 2008 0

The IC packaging and testing industry is expected to enter a year of 'stagnation' in 2008 before staging an upturn in 2009, Bough Lin, chairman of Siliconware Precision Industries (SPIL), said during an investors conference held on April 30.

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