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A "Renaissance" in IC testing and packaging: Q&A with ASE R&D chief officer Ho-Ming Tong

Ingrid Lee, Taipei; Esther Lam, DIGITIMES Asia Thursday 24 April 2008 0

Already holding a secure foothold in the flip-chip (FC) IC packaging sector, Advanced Semiconductor Engineering (ASE) believes that a Renaissance in the testing and packaging industry has arrived, with a wide array of new packages to hit the market...

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