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Chipbond to see losses in 4Q08 with only 50% utilization

Ingrid Lee, Taipei; Meiling Chen, DIGITIMES Asia Friday 5 December 2008 0

Backend packaging and testing company Chipbond Technology is facing difficulties with a utilization rate of only 50% currently mainly due to the impact of weak panel demand on the IC sector. Chipbond is likely to see losses in the fourth quarter as...

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