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NEWS TAGGED PACKAGING AND TESTING
Friday 16 August 2024
Applied Materials upbeat despite Intel's capex cuts; expects strong Chinese demand for packaging and testing despite lower sales contribution
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Wednesday 24 July 2024
PTI engaged in FOPLP, seeking collaboration
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...