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NEWS TAGGED PACKAGING AND TESTING
Friday 16 August 2024
Applied Materials upbeat despite Intel's capex cuts; expects strong Chinese demand for packaging and testing despite lower sales contribution
On August 15, Applied Materials held an earnings call, noting that Intel's planned reduction in capital expenditures is expected to have minimal impact on the company. Applied Materials...
Wednesday 24 July 2024
PTI engaged in FOPLP, seeking collaboration
Powertech Technology (PTI) is currently developing fan-out panel-level packaging (FOPLP) and seeking collaboration with fabless chip vendors, according to the Taiwan-based memory...
Friday 7 June 2024
China Resources' acquisition of JCET shares is killing two birds with one stone
In March, China Resources announced the stunning news of acquiring SMIC's shares of JCET Group, a packaging and testing firm invested by China's National IC Industry Investment Fund...
Friday 7 June 2024
Chinese government gaining control of domestic semiconductor industry
China's state-owned capital has been fast expanding its investment in the country's semiconductor industry, taking control of major firms, according to industry sources.
Monday 3 June 2024
SPIL invests US$1.276 billion to build facility in Penang, Malaysia
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Wednesday 8 May 2024
IC backend houses raise 2024 capex
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
Monday 6 May 2024
Southeast Asia and Japan attract OSAT interest amid geopolitical diversification
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
Friday 26 April 2024
ASEH expects core backend biz to post growth in 2Q24
ASE Technology Holding (ASEH) expects its core IC Assembly, Testing, and Material (ATM) business to see sequential revenue growth in the second quarter of 2024.
Thursday 18 April 2024
IC backend firms to embrace strong 2H24
ASE Technology Holding (ASEH) and other Taiwan-based IC backend houses are gearing up for a prosperous second half of 2024, stepping up their capacity expansion pace, according to...
Thursday 28 March 2024
IC packaging materials distributor Niching sees brisk order visibility
Niching Industrial has observed clear order visibility for vapor chambers and silver paste materials.
Monday 25 March 2024
IC packaging and testing suppliers coping with electricity price hike
The Taiwanese government decided to raise electricity prices by an average of about 10% starting in April, with industrial electricity prices up by nearly 14%, the third consecutive...
Friday 22 March 2024
DDI backend firms look to OLED, auto displays for 2024 growth
Display driver IC (DDI) backend houses including ChipMos Technologies and Chipbond Technology are optimistic about the market prospects for OLED and automotive displays.
Thursday 21 March 2024
ASEH acquires land for new factory site in Mexico
Taiwanese OSAT ASE Technology Holding (ASEH) has acquired 37,220 square meters of land in Jalisco, Mexico.
Friday 15 March 2024
IC backend houses see AI fuel next phase of growth
IC backend houses generally believe that the AI boom has kicked off a new growth cycle, with rising demand for advanced packaging set to fuel growth for testing service providers.
Thursday 14 March 2024
OSAT ASEH positive on 2H24 operations propelled by AI
OSAT company ASE Technology Holding (ASEH) expects inventory adjustments at clients to conclude in the first half of 2024, followed by an AI-driven comeback in operations in the second...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research