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NEWS TAGGED CHIPBOND
Wednesday 8 May 2024
IC backend houses raise 2024 capex
Taiwan-based IC backend houses including ASE Technology, Chipbond Technology, ChipMOS Technologies, King Yuan Electronics (KYEC), Powertech Technology (PTI), and Sigurd Microelectronics...
Thursday 2 May 2024
Chipbond expects demand recovery in 2Q24
Chipbond Technology, a semiconductor backend house with a strong focus on Display Driver ICs (DDI), expects demand to improve in the second quarter of 2024 although order momentum...
Friday 22 March 2024
DDI backend firms look to OLED, auto displays for 2024 growth
Display driver IC (DDI) backend houses including ChipMos Technologies and Chipbond Technology are optimistic about the market prospects for OLED and automotive displays.
Friday 13 October 2023
Packaging materials demand decelerates
Packaging materials suppliers have seen customers slow down their pace of orders in the fourth quarter, and may encounter a decline in revenue compared to the previous quarter, according...
Friday 18 August 2023
Tape COF substrate suppliers see modest demand pick-up
Tape chip-on-film (COF) substrate suppliers including Chipbond Technology and JMC Electronics have seen a modest increase in demand and are expected to see their operations improve...
Monday 26 June 2023
Demand recovery for large-size displays benefiting peripheral IC supply chain
Large-size displays such as TVs have seen demand recover earlier than smaller ones for handset, notebook and other consumer electrics devices after becoming the first to enter inventory...
Thursday 1 June 2023
Chipbond puts growing focus on non-DDI products
Display driver IC (DDI) backend specialist Chipbond Technology has shifted its attention to non-DDI chips and devices such as RF components and power amplifiers, which will account...
Monday 10 April 2023
Taiwan-based OSATs see upstream orders increase in 2Q23
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Tuesday 27 December 2022
Taiwan OSATs poised to slightly cut quotes for 2023
Taiwan's OSATs are expected to slightly cut packaging or testing quotes for 2023 to bolster their capacity utilization rates, with price ranges up for negotiation with clients to...
Thursday 3 November 2022
DDI backend firms see warehouses filled with 'wafer bank'
Display driver IC (DDI) backend specialists are finding their warehouses filled with "wafer bank" inventories from fabless chipmaker customers that are keeping their inventory at...
Tuesday 23 August 2022
Tape COF substrate makers conservative about 2H22 prospects
Taiwan's tape COF substrate suppliers JMC Electronics and Chipbond Technology are highly conservative about their business prospects for the second half of 2022 due mainly to sluggish...
Tuesday 12 July 2022
Backend firms see slowdown in orders for OLED DDI
Taiwan-based backend firms have seen capacity utilization rates for OLED display driver IC (DDI) testing slip recently, according to industry sources, noting that inventory adjustments...
Wednesday 22 June 2022
Second-tier OSATs see uncertainty in order visibility for 2H22
Unlike ASE Technology and other first-tier OSATs who still see robust order momentum from their IDM customers, smaller-size players including Greatek Electronics, Lingsen Precision...
Tuesday 14 June 2022
Tape COF substrates in sluggish demand for large-size DDIs
Sluggish sales of large-size panels and continuous uncertainties in TV terminal demand have continued to erode shipments of large-size display driver ICs (DDI), resulting in revenue...
Thursday 2 June 2022
Cutting DDI production orders not an easy deal: Q&A with Chipbond Technology chair Fei-Jain Wu
Taiwan-based Chipbond Technology, now holding the world's largest backend capacity for panel display driver ICs (DDI), continues to deepen cooperation with local OSAT Orient Semiconductor...