CONNECT WITH US
NEWS TAGGED CHIPBOND
Friday 21 May 2021
OSE to expand EMS services, boost partnership with Chipbond
Orient Semiconductor Electronics (OSE) is looking to scale up its EMS business beyond the electronics sector, while strengthening its collaboration with backend house Chipbond Technology...
Thursday 13 May 2021
DDI packaging materials demand stays robust
Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...
Wednesday 12 May 2021
Taiwan OSATs see order preparation times extended
Major Taiwan-based OSATs including ASE Technology, Powertech Technology (PTI), Chipbond Technology and ChipMOS Technologies have seen their order preparation times extended to three...
Wednesday 5 May 2021
Driver IC backend capacity utilization unstable
Display driver IC (DDI) backend specialists Chipbond Technology and ChipMOS Technologies have seen unstable capacity utilization for processing small- to medium-size applications...
Wednesday 31 March 2021
Tape COF substrate supply to become tight for processing OLED DDI
The supply of tape COF substrates is expected to fall short of demand in 2021, due to growing COF packaging demand for OLED display driver ICs (DDI) , according to industry sources...
Wednesday 10 March 2021
Packaging materials vendors gaining from strong DDI demand
Packaging materials suppliers have seen a surge in orders from display driver IC (DDI) backend specialists, and are poised to enjoy strong DDI demand throughout 2021, according to...
Friday 19 February 2021
Tape COF substrate demand picking up
Taiwan-based Chipbond Technology and JMC Electronics have both seen orders for tape COF substrates pick up substantially, reflecting limited capacity supply for such substrates and...
Wednesday 17 February 2021
Backend houses to thrive on strong demand for 5G, Wi-Fi 6 chips in 2021
Taiwan's IC backend supply chain players are poised to embrace another robust year in 2021 driven by strong demand for 5G and Wi-Fi 6 applications, after logging full capacity utilization...
Tuesday 9 February 2021
Chipbond, ChipMOS to enjoy strong 1H21
Display driver IC backend specialists Chipbond Technology and ChipMOS Technologies are both poised to enjoy a strong first half of 2021, driven by continued strong demand for small-size...
Tuesday 2 February 2021
DDI backend houses to further raise quotes later in 1Q21
Display driver IC (DDI) backend specialists including Chipbond Technology and ChipMOS Technologies plan to enforce a second wave of price hikes in late February or early March to...
Tuesday 19 January 2021
Lead times extend for wirebonding packaging equipment
Delivery lead times for wirebonding packaging equipment have extended to over six months, according to industry sources in Taiwan.
Tuesday 12 January 2021
Equipment makers eyeing strong demand from Taiwan OSAT firms
As Taiwan's OSAT output value is estimated to hit another record high in 2021, domestic equipment and materials suppliers are poised to embrace robust demand from the sector, according...
Monday 11 January 2021
IC foundries, designers strengthening tie-up with backend houses
With demand for diverse chips solutions continuing to grow robustly, Taiwan's foundry houses, IC designers and even EMS providers are all strengthening tie-up with backend houses...
Thursday 7 January 2021
OSE seeking logic chips backend orders after allying with Chipbond
Orient Semiconductor Electronics (OSE), which has struck a long-term strategic alliance with Chipbond Technology, is expected to soon land new logic chips packaging orders from Taiwan's...
Wednesday 30 December 2020
Delivery lead time for cantilever probe cards extends
IC test interface suppliers have seen delivery lead times for cantilever probe cards extended to 2-3 months from 3-4 weeks, due to strong demand for display driver ICs for handsets...