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Traditional Chinese firms foray into semiconductors

Precision machinery set to benefit from robotics boom

GaNrich launches mass production of sapphire-based GaN components, introduces pin-to-pin solution

Taiwan annual smartphone shipments hit 5 million as Android gains ground

Taiwan firms pivot to high-end security chips amid rising competition

China SiC capacity expansions continue despite mounting supply-chain losses

J&V Energy partners with ESPRO to develop solar power in Thailand

GaNrich begins mass production of sapphire GaN components, intros pin to pin solution

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IDF San Francisco: Intel unveils new mobile chips and technologies

Press release, September 24; Joseph Tsai, DIGITIMES Asia Thursday 24 September 2009 0

David Perlmutter, executive vice president and general manager, Architecture Group of Intel has debuted three new Intel Core i7 processors for notebooks based on Intel's Nehalem microarchitecture at IDF San Francisco 2009.

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Pegatron 5G partners with Hewlett Packard Enterprise to deliver next-generation private network solutions

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