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TSMC to double CoWoS capacity in 2025; Nvidia will use 60%

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Drone developer Thunder Tiger eyes strategic tie with NextVision

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HBM memory supply to scale in 2025

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China solar energy market remains plagued by low prices

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Despite start of new AI server shipments, server ODMs see gross margins fall

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Server component providers welcome new era with Nvidia GB200 mass production

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PCB and CCL firms gearing up for AI server boom

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GB200 peripheral chip suppliers delighted with Blackwell cooling issues addressed

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First Dimensity 9400 AI mobile phone debut; Vivo expects X200 sales to treble

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Home Tech ICT

USB 3.0 chipmakers to push into new AMD platform

Monica Chen, Taipei; Joseph Tsai, DIGITIMES Asia Monday 3 January 2011 0

USB 3.0 chipmakers have recently started to push their chips in AMD's new Ontario and Zacate platform, which do not support USB 3.0 natively, and since AMD will not launch a platform with native USB 3.0-support until July, while Intel is set to launch...

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SK Hynix starts mass production of world's first 321-high NAND

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