To accommodate the trend of thinner and lighter consumer electronics products, Ultrabook standards clearly define the specifications and requirements, such as short boot time, all-time access to the Internet, thickness below 0.8-inch, retail price below US$1,000 per unit, and longer usage and standby time. Intel hopes to push notebook sales to another peak through the introduction of Ultrabook. At the DTF 2012 Ultra Mobile & Ecosystem Forum that took place on April 25, representatives of industry leading firms - including Intel; Samson Hu, vice president and general manager of Asustek; Dr. TK Wu, vice president and general manager of AU Optronics (AUO); Allen Yu, Ph.D., director of Product Marketing at Kingston Technology; and Todd Yeh, Ph.D., CTO of TeamChem Company – were invited to give speeches or presentations on topics such as the trend of ultra mobile architecture, evolution of thinner and lighter portable products, 0.1mm-thin touch panels, the latest development in heat dissipation materials for tablet PCs, etc.
ACF replaces connectors to make mobile devices lighter, thinner and more flexible
The anisotropic conductive film (ACF) has great potential to replace miniature connectors that are found in large numbers in ultra mobile devices. The almost height-less ACF enables the production of devices that are super light and thin in a more user-friendly way. The latest development has allowed ACF to be compressed on PET film in low temperature, opening the door for developing bendable and rollable ultra mobile devices. Compared to ordinary conductive film, ACF shows the biggest difference in the fact that it is simple to handle and less likely to be affected by pressure, temperature and bloating factors. Also, ACF has low electricity resistance, high stability, and high tolerance of heat and humidity. The product can form the heat-seal connection between the flexible flat cables and various substrate materials, such as PET film, ITO glass, and others found in digital cameras, e-papers and so forth. On AC42's engineering characteristics, Todd Yeh, Ph.D., CTO, TeamChem Company, explained that TeamChem ACF AC42 is particularly suitable for use on materials whose surfaces are microscopically uneven. When the conductive particles of AC42 are pressed by heat seal equipment, they will effectively fill the cavities of the uneven surfaces to effectively increase conductivity and lower electrical resistance.
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