According to Digitimes Research, the global production capacity of 3D NAND flash in 2017 is expected to show a whopping 118% increase from 2016 and the yearly growth in 2018 is also likely to top 64%. Although memory vendors from Korea, Japan and the US are scrambling to join the game, due to slow improvement in production yield, the worldwide flash memory market is still experiencing a supply shortage and rising costs as the limited supply cannot keep up with the demand.
Due to the promising development of 3D NAND flash, memory chips produced with the new fabrication process start from a high density of 128Gb and even 256Gb in 2017. Low density 64Gb flash chips are hard to find and even lower density 32Gb flash chips will soon to be discontinued. Bono Yuan, deputy manager, product marketing, Macronix, pointed out in an interview that the shortage of low density flash memory has the most significant impact on the embedded system market.
Low density eMMC flash memory are needed in a wide range of embedded system applications, including smart TV, set-top boxes, networking equipment, surveillance systems, smart wearable devices, burgeoning smart IoT devices and Industry 4.0 IIoT applications.
Flash memory for data storage is available in different standards, including CF, MMC, SM and SD. Among these, the eMMC standard (derived from MMC) is the most suitable for use as embedded memory - originally designed for smartphones and tablets. The simplified memory design integrates the NAND flash chip with the controller chip in a MCP package, which saves component footprint on the PCB, and improves system security and data integrity. As such, eMMC memory has gradually become a memory solution of choice in embedded systems.
eMMC memory in embedded applications is mainly used for high capacity code storage, i.e. operating systems and application programs, which differs from that for smartphones and tablets. Memory vendors often overlook such requirement. To meet the embedded application demand, Macronix is introducing a series of low to medium density eMMC memory to fill the memory gap.
Three major advantages and guaranteed five-year availability make Macronix eMMC memory the top choice for embedded systems
The two key components in eMMC memory are the NAND flash and the controller chip, both of which Macronix developed with its own independent R&D. Macronix eMMC memory series has three major advantages. First of all, Macronix eMMC memory is available in 1GB, 2GB, 4GB and 8GB densities in a standard 153-ball BGA package, offering system architects better options for their embedded system designs, and potentially lowering their system cost.
Furthermore, Macronix eMMC memory can save system architectures time needed to spend on product design, development and testing. This is particularly valuable to industrial control system manufacturers that have to deal with extreme and special requirements. For example, video surveillance systems often need to write a large amount of data in a short period of time so the firmware needs to be optimized. In fact, Macronix’s extensive experience in embedded systems can be leveraged to help system architects to easily deal with their special applications and use cases. Macronix’s expertise in engineering design and technical support for NAND flash, controller chips and firmware is what differentiates its eMMC memory from other memory vendors. Customers that choose Macronix eMMC memory will be able to take advantage of solid semiconductor fabrication and access to critical software and firmware support.
Macronix eMMC memory is offered in a standard 11.5x13mm, 153-ball BGA package. However, the third advantage is that the 1GB and 2GB eMMC modules is also offered in an even smaller 9x9 mm, 153-ball BGA package, allowing use in space limited applications, such as wearable devices. Both 11.5x13mm and 9x0mm BGA packages are footprint compatible.
To further meet embedded systems’ requirements in terms of product quality and reliability, Macronix eMMC memory has enhanced write endurance, data integrity,, and power failure protection features. Macronix also guarantees a minimum of five-year availability for its eMMC memory; considering that typical embedded systems such as smart appliances and IIoT devices usually have very long service life. Macronix ensures continuing supply of its semiconductor solutions so that manufacturers can benefit from the longer product lifecycle. This also paves the way for memory products targeting automotive applications, which Macronix is planning to begin next year in its second phase of development.
Macronix effectively leverages its own fabrication capacity and technology to provide eMMC products with high quality, high reliability, long-term availability and support. In terms of the delivery timeline, 4GB eMMC memory will be available for sampling in the fourth quarter of 2017. 1GB and 2GB eMMC memories will begin sampling in the second quarter of 2018.
Bono Yuan, deputy manager, product marketing, MXIC
Macronix's new eMMC solution for emerging embedded applications.