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Unigroup starts mass production of 3D NAND backend lines

Shinee Wu, Taipei; Willis Ke, DIGITIMES Asia Monday 14 January 2019 0

Unimos Microelectronics, a re-invested memory backend service affiliate of China's Tsinghua Unigroup, has recently kicked off volume production at its 3D NAND memory chips packaging and testing lines, marking a great stride by the group toward building...

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