Marvell Technology has unveiled its first 2nm silicon IP for advanced AI and cloud infrastructure. The silicon, fabricated using TSMC's 2nm process, is integral to the Marvell platform...
At Dassault Systèmes' SolidWorks and 3DEXPERIENCE World 2025 in Houston, CEO Pascal Daloz outlined his 2025 market outlook, predicting strong growth in the US and Asia despite...
Dassault Systèmes launched SOLIDWORKS and 3DEXPERIENCE World 2025 on February 23 in Houston, Texas, uniting industry leaders, engineers, and innovators to showcase the latest...
Dassault Systèmes has announced that 3DExperience World 2025, its annual event dedicated to the SolidWorks and 3DExperience platform user community, is taking place in the...
Dassault Systèmes has been embedding artificial intelligence (AI) into its platforms and software for nearly a decade. As generative AI (GenAI) reshapes industries, the company...
South Korea's NAND flash leaders, Samsung and SK Hynix, face a potential threat as Yangtze Memory Technologies Corp. (YMTC) takes the lead in hybrid bonding for 400+ layer 3D NAND...
The Taiwan Semiconductor Research Institute (TSRI), under the National Science and Technology Council (NSTC), announced at a press conference held by Taiwan's National Applied Research...
Samsung Electronics has reportedly signed a patent licensing agreement with Chinese NAND Flash manufacturer Yangtze Memory Technology Corp (YMTC) to license its Hybrid Bonding technology...
Japanese NAND Flash manufacturer Kioxia unveiled its latest advancement in NAND flash memory technology on February 20, featuring an impressive increase to 332 layers, up from the...
Xintec, a TSMC-affiliated semiconductor packaging house, anticipates that increased geopolitical uncertainties, declining market demand, and shifts in customer-supplier strategies...
Macronix International, a Taiwan-based manufacturer of mask ROM and flash memory, is strengthening its competitive product portfolio while anticipating its in-house developed 3D NOR...
Samsung Electronics plans to convert part of its 3D NAND production at its Xi'an plant in China to the company's most advanced 286-layer stacked products.
In a significant advancement for China's semiconductor industry, Yangtze Memory Technologies Co. (YMTC) has achieved a new milestone with its fifth-generation 3D TLC NAND flash memory...
Recently, South Korean testing equipment provider Nextin is reportedly in discussions to supply testing equipment to Japanese NAND Flash manufacturer Kioxia. If the negotiations work...
Global Unichip Corp. (GUC), a leading provider of cuttingedge ASIC (Application-Specific Integrated Circuit) design services, today announced it is joining the Arm Total Design ecosystem...
