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    Commentary: Samsung’s Taylor 2nm ramp-up is critical to closing the gap with TSMC
    2h 4min ago
    Global auto downturn creates risks and opportunities for Taiwan suppliers
    2h 4min ago
    Chip inflation accelerates smartphone brands’ retreat from low-end devices
    2h 4min ago
    Analysis: What China's proposed export controls for AI foundation models and agents means
    2h 4min ago
    Analysis:Why has China expanded export control to AI chip design and computing technologies now
    2h 4min ago
    NEWS TAGGED 3D
    Monday 19 October 2026
    SK Hynix advances chip inspection technology as 3D memory pushes conventional metrology to its limits
    SK Hynix is strengthening its metrology and inspection (MI) capabilities as the transition toward 3D DRAM architectures and increasingly complex NAND stacking creates new challenges...
    Thursday 15 October 2026
    Column: 3D memory could redraw chip competition, weaken US sanctions on China
    In October 2022, the US Bureau of Industry and Security (BIS) imposed a package of export restrictions on China, including controls on equipment and components for manufacturing 3D...
    Wednesday 14 October 2026
    ASE expands PowerSiP platform to improve AI data center power efficiency
    ASE has expanded its PowerSiP platform with a 3D system-in-package solution aimed at vertical voltage regulator modules (VRMs) for AI data centers and high-performance computing systems...
    Wednesday 14 October 2026
    Huawei's Kirin 9050 Pro delivers 53.5% density gain; tighter 3D bonding next for 2027
    Huawei has begun mass-producing its Kirin 9050 series with LogicFolding, a 3D chip architecture that improves transistor density and computing efficiency without relying solely on...
    Wednesday 14 October 2026
    CXMT targets 4F² DRAM production two years ahead of Samsung, but can China close technology gap?
    China's ChangXin Memory Technologies (CXMT) plans to mass-produce next-generation 4F² DRAM by the end of 2026, potentially ahead of South Korean rivals Samsung Electronics and...
    Tuesday 13 October 2026
    Column: From 3D NAND to 3D DRAM — how vertical stacking is reshaping memory chip manufacturing
    After 2013, planar NAND flash memory began reaching its scaling limits at the 15–16nm process node. Capacitive coupling between the floating gates of adjacent memory cells increasingly...
    Friday 9 October 2026
    Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
    AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
    Monday 5 October 2026
    Nanya Tech expands 3D OSAT to chase HBM-like demand
    Nanya Technology is stepping up investment in new factory capacity to expand packaging and testing as some customers move into trial production for specification-based designs. The...
    Friday 2 October 2026
    Nanya Technology wins approval for Southern 3D packaging plant
    The Science Park Review Committee under Taiwan's National Science and Technology Council (NSTC) approved 13 investment projects at its 35th meeting on the 1st, including Nanya Technology's...
    Thursday 1 October 2026
    Applied Materials' EPIC Center adds Kioxia for AI memory, 3D stacking push
    Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite

    Speed 3D Inc., a Taiwan-based AI software company specializing in computer vision, generative AI and hardware integration, will showcase Picbot Edge at Snapdragon Summit...

    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
    Tuesday 29 September 2026
    AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
    AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the...
    Monday 28 September 2026
    Column: For physical AI, maps are turning into memory
    A robot that can map a factory floor still cannot necessarily find the box it has been asked to move, or remember what it saw on its last visit. For autonomous robots, building the...
    Tuesday 22 September 2026
    China's memory race turns inward — CXMT, YMTC head toward patent showdown

    Global memory shortages remain severe, with AI and cloud applications intensifying demand for scarce supply. Prices for both DRAM and...

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    BIZ FOCUS
    Oct 19, 08:00
    MKS' Atotech and ESI to Showcase Advanced PCB Solutions at TPCA 2026
    Monday 19 October 2026
    GMIF2026: AI Inference Drives Token Factory and System Memory Rethinking
    Monday 19 October 2026
    Breaking free from keyword constraints: How GeoGraph elevates job matching
    Thursday 15 October 2026
    Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI