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NEWS TAGGED 3D
Thursday 14 March 2024
Server air cooling turning to 3D VC solutions for better efficiency, says DIGITIMES Research
With air cooling being the mainstream solution at data centers, 3D Vapor Chambers (VCs) have successfully broken through the theoretical heat dissipation limitations of air cooling...
Thursday 1 February 2024
Samsung's 3D DRAM R&D team sets foot in Silicon Valley
Samsung Electronics has set up a new memory research and development (R&D) organization to advance 3D DRAM technologies and secure competitiveness through technology differenti...
Tuesday 30 January 2024
LG Innotek is rumored to be the exclusive supplier of Vision Pro's 3D sensing module
LG Innotek is rumored to be the exclusive supplier of the 3D sensing module for Apple's Vision Pro.
Friday 26 January 2024
Intel reportedly to integrate Samsung's LPDDR5X in Lunar Lake CPU by 3D packaging
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...
Tuesday 28 November 2023
SKMP develops high-thickness KrF photoresist to enhance competitiveness of 3D NAND processes
SK Group's KRW40 billion (US$31 million) acquisition of Kumho Petrochemical's electronic material business in 2020 is bearing fruit. SK Materials Performance (SKMP), the new subsidiary...
Tuesday 28 November 2023
Healthcare Expo Taiwan - Wincomm with Brain Navi demo leading 3D brain navigation surgical robot
In 2023, Intel announced a new achievement on AI-empowered advancing precision medicine and Wincomm was invited to demonstrate AI-based brain surgical and GI endoscopy solutions to...
Wednesday 25 October 2023
Faraday expects 4-6% revenue drop in 4Q23
Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Wednesday 25 October 2023
Samsung unveils new-gen memory solutions for GenAI applications
Samsung Electronics has recently released its new-generation memory solutions aimed at the generative AI and large language model (LLM) markets, including the fifth-generation high-band...
Tuesday 17 October 2023
Hybrid bonding technology crucial for realizing 3D DRAM
Some predictions suggest that as DRAM technology development is gradually approaching a bottleneck, hybrid bonding technology may be introduced into future DRAM manufacturing processes...
Monday 16 October 2023
TSMC says OIP ecosystem collaboration brings 15 years of innovation
TSMC introduced its open innovation platform (OIP) in 2008, when 40nm was the most advanced node on the market.
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research