On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.

Samsung Electronics attended Gamescom 2024, held in Cologne, Germany. With an alleged largest-ever exhibition hall of about 800 square meters, Samsung unveiled its new gaming monitor,...

As smartphone camera resolutions continue to improve, lenses inevitably become thicker, impacting the weight of the devices. Market rumors suggest that Apple has been researching...

Packaging firm Xintec Technology is optimistic about upcoming demand for 3D sensing components packaging and 12-inch wafer testing in the third quarter, the traditional peak season...

Enovix, a next-generation 3D silicon-lithium battery design and manufacturing company founded in 2007, is a global leader in high-performance battery technology. On August 8, it announced...

DRAM chipmaker Nanya Technology and Winbond Electronics, a maker of specialty DRAM and flash memory, both saw their July revenue decrease by 18.4% and nearly 4%, respectively, compared...