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    China’s 15th five-year plan elevates PCB role in AI supply chains
    1h 28min ago
    Huawei’s Kirin 9050 Pro reveals new logic folding chip design
    1h 28min ago
    Huawei says 381 tau chips are already in mass production
    1h 28min ago
    Samsung accelerates HBM thermal management push as AI packaging scales up
    1h 28min ago
    South Korean PCB exports ride AI demand, set to surpass 2022 peak in 2026
    1h 28min ago
    NEWS TAGGED 3D
    Wednesday 6 May 2026
    SoftBank, Intel target HBM limits with 9-layer memory
    SoftBank's memory unit SAIMEMORY is preparing to present a new 3D DRAM technology developed with Intel, as the AI hardware industry seeks ways to ease the power and heat constraints...
    Tuesday 5 May 2026
    Kioxia, SanDisk to unveil 3D flash architecture targeting 1,000-layer milestone
    Kioxia and SanDisk are set to present a new 3D flash memory architecture aimed at extending NAND scaling beyond 1,000 stacked layers, as memory makers seek ways to overcome the physical...
    Wednesday 29 April 2026
    Osense develops baseball hawk-eye system to capture US$10 billion sports tech market
    Taiwanese artificial intelligence (AI) software company Osense Technology is targeting the rapidly growing sports technology market — valued at more than US$10 billion —...
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    NEO Semiconductor advances 3D DRAM with POC validation
    Driven by AI, demand for high-bandwidth memory (HBM) is surging, causing a supply shortage in DRAM and prompting cloud service providers to pre-book capacity for the next two years...
    Sunday 26 April 2026
    Samsung reportedly advances sub-10nm DRAM as SK Hynix targets HBM4E sampling
    Samsung Electronics has reportedly produced a working die for sub-10nm DRAM, marking a potential breakthrough below the 10-nanometer threshold, according to The Elec. SK Hynix,...
    Wednesday 22 April 2026
    SJSemi's blockbuster IPO reorders China's chip packaging landscape
    Shares of SJSemi surged on their trading debut on Shanghai's SSE STAR Market on Monday, underscoring investor enthusiasm for advanced chip packaging technologies as demand for artificial...
    Monday 20 April 2026
    Odisha to break ground on India's first advanced 3D chip packaging unit
    Odisha broke ground on India's first advanced 3D chip packaging unit on April 19, 2026, a move that could reshape global semiconductor supply chains by adding high-end heterogeneous...
    Tuesday 14 April 2026
    JCET advances CPO, glass substrates to capture AI packaging demand
    JCET, China's leading outsourced semiconductor assembly and test (OSAT) provider, is accelerating its push into advanced packaging, sharpening its position in AI servers, data centres,...
    Thursday 2 April 2026
    Kioxia sets cutoff for legacy NAND, phases out SLC and MLC lines by 2026
    Japan-based NAND flash maker Kioxia has formally issued an end-of-life (EOL) notice for a wide range of legacy NAND products, underscoring an industry-wide shift toward advanced 3D...
    Monday 30 March 2026
    DRAM scaling hits limits as next-generation memory faces delays

    The global DRAM industry is approaching a structural inflection point, as traditional scaling methods struggle to deliver the performance...

    Sunday 29 March 2026
    SK Hynix and Kioxia targeted in US ITC memory chip probe
    On March 27, the US International Trade Commission (ITC) launched an investigation into memory chip imports by SK Hynix Inc. and KIOXIA Holdings Corporation following a patent complaint...
    Thursday 26 March 2026
    Alibaba‑backed Tripo AI draws investor confidence, led by exec from Minimax
    Tripo AI, founded in 2023, is rapidly emerging in AI-driven 3D content creation, turning text prompts or 2D images into production-ready 3D models in seconds. Backed by major investors...
    Thursday 26 March 2026
    China's Naura and AMEC lead China's push into advanced chip packaging
    As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
    Friday 20 March 2026
    As NAND makers move on, MLC memory nears the end of the line

    As global NAND flash makers shift toward higher-layer 3D architectures, legacy MLC NAND is slipping into a severe supply-demand imbalance...

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    GlobalExhibition
    BIZ FOCUS
    Oct 5, 08:00
    AI Family Digital Twins Bridge Elder Care Gaps
    Friday 2 October 2026
    Digital Divide: Hackathon Team Debuts Senior-Friendly 'AI Butler'
    Thursday 1 October 2026
    Speed 3D Showcases On-Device AI Generation with Snapdragon X2 Elite
    Thursday 1 October 2026
    From Excel to Editable Presentations: AI Streamlines Financial Reporting
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