News tagged 3D at DIGITIMES

NEWS TAGGED 3D

Tuesday 16 June 2026

Murata and Synopsys deepen simulation integration as electronics design complexity grows

Murata Manufacturing has partnered with Synopsys to make its latest electromagnetic and thermal simulation models directly accessible...

Tuesday 16 June 2026

AI chip race sends WF6 prices soaring after Japan supply shock

Global expansion in AI chips, advanced logic processes, and multilayer 3D NAND flash memory is driving demand for tungsten hexafluoride (WF6), a critical electronic specialty gas used...

Friday 12 June 2026

SK Hynix readies 375-layer NAND as US listing plan advances

SK Hynix is preparing to begin mass production of its next-generation 375-layer 3D NAND flash memory by year-end, while pushing ahead...

Thursday 4 June 2026

Tripo AI raises nearly US$200 million to expand 3D and world model research

Tripo AI said it has completed its Series A+ and Series A++ financing rounds, raising nearly US$200 million as it pushes deeper into AI 3D foundation models and world models.

Thursday 4 June 2026

Huawei's Tau Law shifts AI chip race to glass substrates, advanced packaging

Huawei's recently proposed "Tau Law" suggests that reducing signal transmission distance, combined with heterogeneous integration and system-level optimisation, can enhance computing...

Wednesday 3 June 2026

COMPUTEX 2026 highlights spatial AI for homes and turnkey enterprise edge solutions

At COMPUTEX 2026 in Taipei, HOMEE AI, Osense Technology, and Senao International unveiled new AI products aimed at shifting deployment from cloud training to real-world inference and...

Wednesday 3 June 2026

oToBrite and Turing Drive partner on visual AI for autonomous vehicles

oToBrite and Turing Drive announced a technology collaboration on June 2 to develop real-world autonomous vehicle applications using vehicle-grade vision AI, which combines oToBrite's...

Monday 1 June 2026

Exclusive: TSMC SoIC deepens AI chipmaker lock-in while Huawei hits process wall

The global semiconductor industry is at an inflection point, split between those who can still shrink transistors and those who can no longer do so. US export controls and the denial...

Wednesday 27 May 2026

Huawei Tau Law series 2: Advanced packaging, AI interconnects, EDA lead the way

Huawei's Tau Law proposal is rapidly redirecting attention across China's semiconductor industry away from pure lithography competition and toward advanced packaging, 3D stacking,...

Tuesday 26 May 2026

Powerchip unveils 3D AI Foundry with 3D WoW DRAM stacking at COMPUTEX 2026

Powerchip announced it will present a "3D AI Foundry" showcase at COMPUTEX 2026 to demonstrate 3D wafer-on-wafer (WoW) DRAM stacking, interposers, and Si-cap integrated passive devices...

Tuesday 26 May 2026

Kioxia targets 2027 BiCS 10 NAND production as Samsung, SK Hynix hold back investment

Kioxia is targeting 2027 production of its 10th-generation BiCS 10 NAND, a move that could help the Japanese memory maker narrow its technology gap with Samsung Electronics and SK...

Monday 25 May 2026

Huawei bypasses 3D NAND limits with 122TB AI SSD packaging breakthrough

Huawei is using self-developed packaging technology to build ultra-high-capacity enterprise SSDs, underscoring how Chinese technology companies...

Wednesday 20 May 2026

China's top NAND flash chipmaker YMTC begins IPO tutoring with Chinese banks

China's leading memory chipmakers are accelerating their push into public capital markets, with YMTC Group formally entering IPO guidance on May 19, shortly after domestic DRAM leader...

Thursday 14 May 2026

Samsung reportedly speeds up 3D NAND, packaging, and substrate plans

Samsung Electronics is reportedly reviving delayed semiconductor initiatives across next-generation NAND flash, compound semiconductors, advanced packaging, and substrates —...

Wednesday 13 May 2026

Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide

Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...

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Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

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