Micro-Star International (MSI) has announced the launch of the upgrade version of WindBOX III (MS-9A35) to the industrial PC (IPC) market.
Following the fanless design of the WindBOX series, MSI debuts the WindBOX III based on the Intel Core 2 Duo processor and the Intel GS45 + ICH9M chipset to provide an ultra-low power and slim form factor for solid embedded applications.
The WindBOX III (MS-9A35) offers 3D graphics performance for a high definition up to 1080P. It supports DirectX 10, shader model 4.0 and Intel clear video technology. It features six USB 2.0 ports, two powered COM ports, and multiple video output (DVI-I for VGA and DVI-D, HDMI) for dual independent display. There are two mini-PCIe slots, and the WindBOX III comes with a module that has a built-in Wi-Fi 802.11b/g/n and a Bluetooth module, the company said.
MSI WindBOX III supports VESA wall-mount interface for easily mounting flat panel monitors and TVs and various scenarios like digital signage, thin client, and POS, the vendor added.
Samsung HKMG DDR5
Samsung Electronics has expanded its DDR5 DRAM memory portfolio with a 512GB DDR5 module...
Photo: Company
Nvidia GeForce RTX 30 series GPUs
Nvidia's GeForce RTX 30 series GPUs are powered by the company's Ampere architecture. The...
Photo: Company
Apple HomePod mini
Apple's HomePod mini is the newest addition to the HomePod family. At just 3.3 inches tall,...
Photo: Company
Apple 13-inch MacBook Pro with Magic Keyboard
Apple has updated the 13-inch MacBook Pro with the new Magic Keyboard for an improved typing...
Photo: Company
Apple iPad Pros
Apple's new iPad Pros comes with the latest A12Z Bionic chip, an ultra-wide camera, studio-quality...
Photo: Company
- Silicon photonics set for takeoff (Oct 30) - EE Times
- TikTok founder becomes China's richest man (Nov 1) - BBC News
- Nvidia to take Intel's spot on Dow Jones Industrial Average (Nov 1) - Reuters
- Huawei's latest AI processors were made by TSMC (Oct 22) - Bloomberg
- Arm to scrap Qualcomm chip design license in feud escalation (Oct 23) - Bloomberg
- Embedded World brings 3,500 visitors to 1st US outing (Oct 11) - EE Times
- Preparing electronics engineering students for industry (Oct 8) - EETimes Europe
- Former Apple hardware chief Dan Riccio is retiring (Oct 11) - Ars Technica
![]()
Microsoft's custom chip sets new industry benchmark while deepening AI partnerships across sectorsAs Microsoft transitions from a software giant to a cloud leader, with its cloud business now accounting...
![]()
GeoWatchEssential technology and geopolitical news recap, GeoWatch, focuses on the tech supply chain, providing effortless insights.
CSP in-house development of ASIC accelerators
Google TPUs will see a share of over 70% in the in-house developed cloud ASIC accelerator market in 2024; an all-optical network...
AI chip market outlook 2023-2028: Insights from demand and supply perspectives
The growing demand for AI computational power is accelerating advancements in hardware and chip technology, necessitating innovation...
Automotive CIS tech development, 2024
The popularization of autonomous driving is boosting demand for automotive CIS with LFM and HDR being mainstream development...
