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Friday 17 July 2015
Applied Materials intros ALD system for 3D IC manufacturing
Applied Materials has unveiled the Applied Olympia ALD (atomic layer deposition) system featuring a modular architecture that delivers high-performance ALD technology to manufacturers...
Friday 17 July 2015
TSMC says 10nm on schedule
TSMC has reiterated plans to move 10nm FinFET technology to risk production at the end of 2016, followed by mass production in the first quarter of 2017.
Thursday 2 July 2015
Globalfoundries completes acquisition of IBM microelectronics business
Globalfoundries has completed its acquisition of IBM's microelectronics business, according to the foundry chipmaker.
Tuesday 9 June 2015
Imagination, TSMC collaborate on IoT IP platforms
Imagination Technologies has announced the company will work with TSMC to develop a series of advanced IP subsystems for the Internet of Things (IoT) to accelerate time to market...
Tuesday 9 June 2015
Cadence, TSMC collaborate on IoT IP subsystem
Cadence Design Systems has announced that it is collaborating with TSMC on the development of an Internet of Things (IoT) IP subsystem demonstration platform for TSMC's ultra-low...
Thursday 28 May 2015
TSMC to triple 16nm chip capacity by end-2016, says co-CEO
TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early...
Wednesday 27 May 2015
TSMC to beat Samsung in 10nm race
TSMC is confident that the company will beat Samsung Electronics in ramping up production on its 10nm lines, according to the Taiwan-based foundry.
Tuesday 26 May 2015
TSMC to build 10nm pilot line in June, says report
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to establish a 10nm pilot line at its 12-inch wafer plant in Hsinchu (Fab 12), northern Taiwan, in June, according to...
Thursday 21 May 2015
Applied announces breakthrough technology for patterning copper interconnects at 10nm and beyond
Applied Materials has announced its Applied Endura Cirrus HTX PVD (physical vapor deposition) system with breakthrough technology for patterning copper interconnects at 10nm and beyond...
Tuesday 21 April 2015
Applied intros photomask etch solution for quadruple patterning at 10nm and beyond
Applied Materials has announced the Applied Centura Tetra Z Photomask Etch system for etching next-generation optical lithographic photomasks needed by the industry to continue multiple...
Monday 20 April 2015
TSMC to open new fab for 10nm manufacturing in mid-2016, says chairman
Taiwan Semiconductor Manufacturing Company (TSMC) will break ground for a new fab at its 12-inch wafer plant in central Taiwan in June 2015. The fab is designed to manufacture chips...
Thursday 9 April 2015
Cadence digital and custom/analog tools achieve TSMC certification for 10nm FinFET early design starts
Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...
Monday 16 February 2015
Global Unichip expects 1Q15 sales to grow on-quarter
Global Unichip, an IC design service provider partnering with Taiwan Semiconductor Manufacturing Company (TSMC), expects to report a sequential increase in first-quarter revenues...
Monday 9 February 2015
TSMC set to step up investment in central Taiwan
Taiwan Semiconductor Manufacturing Company (TSMC) has disclosed plans to invest more than NT$500 billion (US$16 billion) in its manufacturing site at the Central Taiwan Science Park...
Tuesday 2 December 2014
HiSilicon expands adoption of Cadence tools and IP for advanced-node FinFET designs
Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research