Cadence Design Systems announced on December 1 that HiSilicon Technologies has signed an agreement to significantly expand its use of the Cadence digital and custom/analog flows for...

With shipments of desktop and notebooks in the doldrums since 2010, Intel's PC processor business has been in decline. Meanwhile, AMD and others are taking aim at the Intel-dominated...

United Microelectronics (UMC) has announced that the company will join the IBM joint technology development alliance to participate in the group's development of 10nm CMOS process...

Samsung Electronics has begun mass producing a 128Gb, 3-bit multi-level-cell (MLC) NAND memory chip using 10nm-class process technology, according to the company. The new Samsung...

Samsung Electronics has announced a next-generation 64GB embedded multimedia card (eMMC) using 10nm-class process technology. The new 64Gb NAND memory went into production late in...

Samsung Electronics has issued a statement disclosing plans to set up a flash memory chip plant in China.

While semiconductor manufacturing processes have been continually upgraded through die shrinks, the development of processes for 10nm and below is expected to face challenges related...

Samsung Electronics has announced that its new memory semiconductor fabrication facility, Line-16, at its Nano City Complex in Hwaseong, Gyeonggi Province, has commenced operations...

Capex spending has been gaining momentum at Taiwan Semiconductor Manufacturing Company (TSMC) recently, and total spending may surpass the company's budget of US$4.8 billion projected...