Production costs for third-generation semiconductor SiC and GaN devices are expected to gradually drop to roughly the same levels as silicon-based components in the next 3-5 years,...

Having already raised its quotes for 28nm process technology, TSMC has moved to maintain the prices throughout the second half of this year, according to industry sources.

TSMC has notified customers about 15-20% price hikes for its 12-inch wafer fabrication services for vendors of LCD driver ICs starting August, which in turn will prompt the vendors...

Taiwan-based IC backend houses are gearing up for robust packaging demand for mature-node chips from foundries in China, as the supply of such chips is increasingly short of demand...

Apple reportedly is set to roll out its third-generation iPhone SE series in the first half of 2022, providing new business opportunities for chip probing specialists including TSMC...

Intel's acquisition of Globalfoundries is unlikely, as GF's manufacturing capability that is more focused on mature and specialty process technology contradicts Intel's ambition of...

TSMC is coming under pressure from the US over its plan to expand foundry capacity in China, according to industry sources.

China-based CanSemi Technology has raised funds to carry out its upcoming capacity expansion project, in which the specialty IC foundry will add an additional 20,000 12-inch wafers...

Foundries including TSMC and UMC, and China's SMIC, have all stepped up their capacity expansions particularly for 28nm process, according to industry sources.

Huawei will set up its first wafer fab in Wuhan, China's Hubei province, with production expected to kick off in phases starting 2022, according to industry sources.

Globalfoundries on June 22 broke ground for a new 12-inch wafer fab at its Singapore campus, according to the pure-play foundry.

Taiwan-based pure-play foundry Powerchip Semiconductor Manufacturing (PSMC) continue to see orders demanding 8- and 12-inch wafer fabrication services pull in, and is in talks with...

Rising specialty DRAM and NOR flash memory prices are set to boost net profits at Winbond Electronics in the second quarter of 2021, which are likely to more than double those generated...

TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.

Demand for packaging materials for processing high-end display driver ICs (DDI) remains strong, as backend houses including Chipbond Technology and ChipMOS Technologies still maintain...