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Wednesday 15 July 2009
Elpida reportedly developing die-shrink 50nm process without expenditure on new tools
Elpida Memory has been quietly developing a technology based on its existing 65nm equipment for DRAM production, to enable a die shrink to 50nm, industry sources have claimed. The...
Tuesday 14 July 2009
Globalfoundries calls for renewed focus on 300mm
The semiconductor industry has long been preoccupied with smaller transistors and larger silicon wafers, in its effort to meet the ever-increasing demands of consumer technology....