In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
Kioxia, currently ranked third in the global NAND market, is reportedly set to go public in Japan in October 2024. The move aims to secure funds for R&D and production capacity...
In early 2023, Samsung Electronics welcomed former TSMC deputy director Jing-cheng "Vic" Lin to lead an advanced packaging task force to compete against TSMC. However, industry insiders...
As Micron and Tata Group's large semiconductor projects are under construction in Gujarat, India-based startup Suchi Semicon has announced its plan to begin providing OSAT (Outsourced...
Repon has announced its approval as a recommended vendor for Nvidia's GB200 AI server slides. The company anticipates beginning mass production in the third quarter, with shipments...
With the increasing implementation and demand for edge AI applications, DRAM manufacturer Innodisk stated that its edge AI projects have been progressing smoothly with AIoT-related...
SK Hynix, which recorded its best performance ever in the first half of 2024, has experienced remarkable growth in the US and Chinese markets. The company managed to revitalize several...
Tongtai Machine & Tool is actively expanding its semiconductor equipment business to meet the increasing demand for AI device applications and anticipates revenue from this segment...
Apaq Technology, a specialist in solid electrolytic capacitors, has acquired land adjacent to its existing plant in Malaysia for a second phase expansion, with construction expected...
Following the UK general election, attention has shifted to the country's national semiconductor strategy. An upcoming report urges the new government to conduct a comprehensive review...
