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Friday 23 October 2026
Western Digital argues AI's longer payoff lies in stored data, not compute
Western Digital argues that demand for hard drives depends less on the current wave of AI spending than investors fear. On its fiscal first-quarter earnings call on October 22, the...
Friday 23 October 2026
Western Digital widens margins on pricing and exabyte growth
Western Digital's fiscal first quarter showed a hard-drive business turning demand into profit faster than into sales. Revenue for the three months ended October 2, 2026 rose 55% from...
Friday 23 October 2026
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform...
Friday 23 October 2026
SK Hynix reportedly engages suppliers to bring 30% more efficient iHBM cooling to HBM5 production

SK Hynix is reportedly working with materials and equipment suppliers to commercialise its next-generation iHBM cooling technology, targeting a...

Thursday 22 October 2026
Micron overhauls pay in Taiwan as unions push for profit sharing
Micron is overhauling how it pays employees, promising quarterly profit-sharing bonuses and better pay and benefits for its Taiwan staff. The changes follow a labor dispute with the...
Thursday 22 October 2026
Samsung reportedly overhauls DRAM, NAND R&D incentives to retain talent and accelerate next-gen memory chips
Samsung Electronics is reportedly restructuring its semiconductor research operations and performance-based compensation system to accelerate next-generation DRAM and NAND flash development,...
Thursday 22 October 2026
Samsung DX division postpones meeting amid bonus tensions
According to reports from Financial News, ETNews, News1 and Yonhap, Samsung Electronics' postponement of an event has intensified scrutiny of internal...
Thursday 22 October 2026
Memory surge drives phone makers from LTPO to LTPS
Soaring memory prices are intensifying cost pressure across the display industry, prompting some smartphone manufacturers to downgrade panel specifications. Market estimates indicate...
Thursday 22 October 2026
Micron skips 4F² for 3D DRAM as CXMT pushes ahead
Micron does not plan to commercialize 4F² DRAM even as Chinese rival ChangXin Memory Technologies (CXMT) advances the technology, saying the architecture offers limited benefits...
Thursday 22 October 2026
GoldKey Technology posts record 3Q26 profit as industrial share rises
Memory module maker GoldKey Technology posted record third-quarter 2026 profit, with net income topping NT$1 billion (approx. US$30.9 million) for the first time at NT$1.03 billion,...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Thursday 22 October 2026
ESMT sees memory price momentum extending through 4Q26, 2027
Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%...
Thursday 22 October 2026
Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages
Russia is reportedly considering reinstating parallel imports of products from Samsung Electronics and SK Hynix to ease shortages of memory and storage devices used in data centers...
Wednesday 21 October 2026
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation...
Wednesday 21 October 2026
Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies
Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will...