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    YMTC targets global NAND lead by 2027 as parent seeks US$5 billion IPO
    2min ago
    TSMC packaging shift could boost AMD CoWoS share and trim Nvidia's allocation
    12min ago
    Southeast Asia mobility shifts put GATE 2026 in focus
    27min ago
    Malaysia mobility sector embraces Chinese firms as investment catalyst
    36min ago
    Silicon Optronics advances high-end BSI products as memory shortage splits CIS demand
    48min ago
    NEWS TAGGED MEMORY CHIPS
    Wednesday 26 August 2026
    Hot Chips 2026: Samsung advances LPDDR5X-PIM as HBM costs mount
    At Hot Chips 2026, Samsung Electronics moved processing-in-memory (PIM) closer to practical deployment, presenting what it described as the industry's first LPDDR-based PIM device...
    Wednesday 26 August 2026
    SK hynix production union rejects stock-heavy pay deal by 25 votes
    SK hynix's production-worker union has rejected the company's tentative 2026 wage and collective bargaining agreement by just 25 votes, sending the two sides back to the negotiating...
    Wednesday 26 August 2026
    Trump weighs Apple China chip deal as CXMT runs full
    Apple is seeking to diversify its supply chain to ease pressure from rising memory costs and has reportedly sought US government clearance to buy memory from blacklisted Chinese chipmaker...
    Wednesday 26 August 2026
    Apple is only the test: Chinese memory makers CXMT, YMTC target North American cloud market
    The memory industry is entering a powerful growth cycle, with Apple seeking to add Chinese suppliers CXMT and YMTC to its memory supply chain. With a meeting between US President Donald...
    Wednesday 26 August 2026
    Samsung, Intel widen AI chip battle into memory, packaging
    Samsung Electronics and Intel are pushing into each other's core businesses as AI semiconductor competition shifts from individual chips to full-system integration. South Korean reports...
    Wednesday 26 August 2026
    SK hynix adds second major customer as Nvidia misses Samsung's top five
    SK hynix added a second customer accounting for more than 10% of revenue in the first half of 2026, while Nvidia remained outside Samsung Electronics' five largest customers, highlighting...
    Tuesday 25 August 2026
    Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
    On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
    Tuesday 25 August 2026
    US voices first complaint over South Korea's KRW800 trillion chip cluster as investment pressure mounts
    The US has informally expressed dissatisfaction with the South Korean government's KRW800 trillion (US$578.5 billion) plan to build a semiconductor cluster in the country's southwest...
    Tuesday 25 August 2026
    China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
    According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production...
    Tuesday 25 August 2026
    Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
    Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
    Tuesday 25 August 2026
    Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

    Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

    Tuesday 25 August 2026
    AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

    Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders...

    Tuesday 25 August 2026
    SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
    The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Tuesday 25 August 2026
    Nvidia memory demand widens the gap between SK Hynix and Samsung

    Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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