Chinese DRAM maker ChangXin Memory Technologies (CXMT) expects global memory supply to remain tight through the second half of 2026, with AI-driven demand supporting prices while the...
Samsung Electronics is allocating more than half of its 4nm foundry capacity to base dies for sixth-generation high-bandwidth memory (HBM4) as it accelerates shipments to major AI...
Memory manufacturers Macronix International, Etron Technology, and Winbond Electronics all reported surging revenue for the first eight months of 2026. As the memory upcycle continues,...
Major Taiwanese memory module manufacturers saw revenue remain at high levels in August 2026, as memory prices continued to rise. Adata Technology and Team Group both posted record-high...
SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES...
Memory inventories at Samsung Electronics and SK Hynix have fallen below 10 days of supply as AI infrastructure spending drives simultaneous demand for HBM, server DRAM and enterprise...
Phison CEO K.S. Pua expects NAND Flash supply to remain tight into 2027 despite capacity expansion across major memory makers, arguing that forecasts of a rapid return to oversupply...
Micron Technology has scored a seventh favorable Patent Trial and Appeal Board (PTAB) outcome in its wide-ranging patent fight with China's Yangtze Memory Technologies (YMTC), while...
SK Hynix is accelerating its shift to sixth-generation 10nm-class 1c DRAM, with the process expected to account for roughly 34% of its DRAM production by the fourth quarter as the...
China's Naura Technology has demonstrated a selective etching process for 64-layer 3D DRAM structures, potentially giving domestic memory makers another route to raise transistor density...
AI infrastructure and semiconductor supply chains led reader interest this week, from Taiwan's manufacturing recovery and Nexperia's legal battle to Sandisk's HBF, Micron's HBM expansion,...
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
The global rush to build semiconductor fabs is creating a historic opportunity for Taiwan's construction and facility engineering supply chain, and Micron Technology is looking to...
