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Wednesday 4 November 2026
Winbond profit surges 12-fold in 3Q26 as gross margin tops 70%
Winbond Electronics reported strong results for the third quarter of 2026, with revenue, including subsidiary Nuvoton Technology, reaching NT$82.33 billion (approx. US$2.51 billion),...
Wednesday 4 November 2026
Macronix sees new memory strategy emerging within 6 months
Macronix (MXIC) chairman Miin Wu said the memory shortage will continue through 2030, with prices unlikely to weaken from current levels as production capacity becomes a scarce resource...
Wednesday 4 November 2026
Team Group expands capacity 50% for AI and industrial control as memory shortage peaks through 2Q27
Taiwanese memory module maker Team Group is gearing up for a major expansion. Chairman Dann-Ning Hsia stated that 2026 has been a pivotal year of strong financial performance and strategic...
Tuesday 3 November 2026
South Korea urged to link chip fab support to local suppliers
South Korea should tie government support for new semiconductor fabs to commitments that benefit domestic chip designers, equipment makers, and packaging suppliers, a state-funded...
Tuesday 3 November 2026
Memory price surge hits smartphones, cutting 2026 mobile SoC shipments nearly 20%
The AI infrastructure boom has driven up memory prices across consumer electronics, dampening sales of smartphones and notebooks while hitting upstream system-on-chip (SoC) developers...
Tuesday 3 November 2026
Japanese distributor turns away new customers as DDR5 prices double
A Japanese electronics distributor has stopped accepting new customers because it cannot fully supply its existing ones, Nikkei reported, as demand from AI data centers tightens...
Tuesday 3 November 2026
ESMT sees higher 4Q26 ASP as DDR2, DDR3 supply tightens
Memory IC designer Elite Semiconductor Microelectronics Technology (ESMT) expects shipments and gross margin to remain stable in the fourth quarter of 2026 despite higher memory wafer...
Tuesday 3 November 2026
Analysis: Beyond iPhone growth, Apple's spending reveals broader cost challenge
Apple is committing more money to research and securing supplies while reducing cash spending on fixed assets, a combination that shows how its AI ambitions and component shortages...
Tuesday 3 November 2026
China's memory chipmakers extend their boom into the third quarter as capacity, policy risks build
China's memory chip industry heads into the final quarter of 2026 riding a global supply shortage: its leading DRAM maker booked more than CNY54 billion (US$8.11 billion) in third-quarter...
Tuesday 3 November 2026
Micron dismisses 4F-squared DRAM as CXMT presses ahead — why Samsung, SK Hynix remain divided
Micron Technology and China's CXMT have taken sharply different approaches to next-generation DRAM scaling, exposing a divide over the commercial viability of 4F-squared memory-cell...
Tuesday 3 November 2026
Apple's record holiday sales outlook faces costly test from memory inflation, AI spending

Apple expects record holiday-quarter revenue, but surging memory prices, supply constraints, and rising Siri AI costs threaten profitability, putting...

Tuesday 3 November 2026
MediaTek, Marvell, Broadcom battle for ASIC supply through 2028
Competition in the AI application-specific integrated circuit (ASIC) market will extend beyond 2028, industry sources said, with MediaTek, Broadcom, and Marvell competing not only...
Tuesday 3 November 2026
Samsung's Young Hyun Jun urges humility, customer trust amid semiconductor profit boom
Despite record profits driven by surging demand for artificial intelligence (AI) and a booming semiconductor industry, Samsung Electronics vice chairman and head of its Device Solutions...
Tuesday 3 November 2026
SK Hynix ramps up SOCAMM2 as material shortages push up PCB prices
SK Hynix is increasing orders for small outline compression attached memory module 2 (SOCAMM2) printed circuit boards (PCBs) as production ramps up for Nvidia's Vera Rubin AI platform,...
Monday 2 November 2026
Samsung's Lee bets on Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...