Micron Technology has sharply raised 2027 prices for high-bandwidth memory (HBM), the stacked DRAM packaged with AI accelerators. The increase comes after a year in which fixed contract...
Applied Materials announced that Kioxia will join its Equipment and Process Innovation and Commercialization (EPIC) Center in Silicon Valley, California. The two companies will collaborate...
Micron told investors on September 30 that it cannot say when memory supply will catch up with demand. It expects the shortage to get worse over the next two years, even though additional...
Applied Materials and Kioxia are joining forces at a Silicon Valley research hub to develop next-generation memory technologies that could shape AI systems used worldwide. The collaboration...
The memory market is entering the fourth quarter of 2026 with a widening split between weak consumer demand and intense server buying, underscoring how artificial intelligence workloads...
Micron Technology's fiscal fourth quarter showed a memory maker whose growth now comes mainly from price rather than volume, with customers committing cash years in advance to secure...
Samsung Electronics' HBM4 ramp is giving its foundry business a timely boost, as rising demand for the memory product translates into more work for the company's 4nm logic lines.
DIGITIMES Intelligence observes that AI applications are moving through a clear progression: from early classification AI focused on feature recognition, to generative AI capable of...
Phison Electronics CEO Pua Khein-Seng says he tells himself every day that the memory shortage will ease tomorrow. In reality, he says, AI-driven demand has opened a gap between memory...
Apple's A20 Pro chip has dropped traditional package-on-package (PoP) packaging in favor of Wafer-Level Multi-Chip Module (WMCM), with memory and processor dies laid out side by side...
Netlist has begun legal proceedings against Micron and downstream customers Nvidia, Broadcom, and Google to stop them from allegedly using the company's patented high-bandwidth memory...
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
