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Friday 31 July 2026
Research Insight: CXMT reaches 7.67% DRAM share with US$4.4B IPO, 2028 tech roadmap
CXMT's IPO marks a shift in China's DRAM strategy from capacity building towards mainstream products, process upgrades, and global competition, according to DIGITIMES Intelligence.
Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
Friday 31 July 2026
Memory shortages deepen as prices climb into the second half of 2026

Memory shortages are tightening across the supply chain, and higher contract prices are set to ripple through global electronics markets...

Friday 31 July 2026
Amazon lifts 2026 capex to US$220 billion, pins the increase on memory prices

Amazon has raised its 2026 capital expenditure plan by roughly US$20 billion and attributed the increase to a single input cost: me...

Friday 31 July 2026
Kioxia begins sampling 1TB 3D flash memory for AI devices
Kioxia has begun shipping samples of 1TB triple-level cell memory devices built with its 9th-generation BiCS FLASH 3D flash memory technology. The move signals faster, lower-cost storage...
Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...

Friday 31 July 2026
Qualcomm, MediaTek set Sept flagship SoC showdown
Qualcomm and MediaTek are preparing to unveil their latest 2nm flagship smartphone system-on-chip (SoC) platforms in September 2026, with both brands expected to launch standard and...
Friday 31 July 2026
Samsung boosts Hwaseong DRAM capacity as it converts older NAND lines
Samsung Electronics completed the shutdown and equipment transfer of an older NAND flash wafer fab at its Hwaseong campus in South Korea and is expanding DRAM production at the site...
Thursday 30 July 2026
Samsung signs five-year memory deals as chip shortage stretches to 2028
Samsung Electronics has signed five-year memory supply agreements with five leading global data center customers and is in the final stages of talks with five more, tying a growing...
Thursday 30 July 2026
South Korean chip exports increasingly flow to Taiwan for TSMC packaging amid rising AI demand

Growing demand for AI chips is sending a larger share of South Korea's semiconductor exports to Taiwan, where Korean-made high-bandwidth...

Thursday 30 July 2026
South Korean suppliers win HBM4 tester orders from SK Hynix
South Korean test-equipment suppliers Digital Frontier and UniTest have secured four orders for HBM4 wafer testers from SK Hynix worth a combined KRW247.84 billion (approx. US$172...
Thursday 30 July 2026
High memory prices could slow China's AI push, analyst says

Memory prices are expected to remain elevated through 2026 as AI and data-center demand strains supply, with meaningful supply relief...

Thursday 30 July 2026
Lam Research raises WFE outlook as AI drives NAND, DRAM, advanced packaging demand
Lam Research delivered record quarterly results and raised its outlook for global wafer fab equipment (WFE) spending, citing accelerating AI-driven demand across memory, advanced logic...
Thursday 30 July 2026
Samsung sees tripled HBM4 sales in 3Q26; HBM share to reach parity with DRAM position

Samsung Electronics expects HBM4 sales to increase more than threefold sequentially in the third quarter of 2026, the company said...

Thursday 30 July 2026
Samsung: memory shortage to worsen in 2027, persist through 2028; locks top customers into multi-year deals

Samsung Electronics expects the global memory shortage to become more severe in 2027 than in 2026 and to persist through 2028, memory...