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    NEWS TAGGED MEMORY CHIPS
    Wednesday 30 September 2026
    Column: Memory and logic collide as AI shifts the balance
    As HBM approaches half the cost of a GPU-HBM CoWoS package, can memory still be viewed as merely a passive component of AI computing? The answer goes back to the "memory wall," a challenge...
    Wednesday 30 September 2026
    Commentary: What risks does China's DRAM capacity face amid tightening market?
    China's continued expansion of DRAM capacity has raised a key question for the global memory market: will supply and demand flip?
    Wednesday 30 September 2026
    CXMT's US$5.2 billion buildout deepens China's push for domestic DRAM equipment
    China's largest dynamic random-access memory (DRAM) maker ChangXin Memory Technologies (CXMT) is accelerating a CNY34.9 billion (US$5.2 billion) expansion aimed at chipmaking equipment,...
    Wednesday 30 September 2026
    CXMT expansion meets surging GigaDevice DRAM demand, sharpening China's memory supply-chain buildout
    CXMT's continued DRAM capacity expansion is coinciding with stronger demand from China's domestic memory sector.
    Wednesday 30 September 2026
    AMD's Lisa Su reportedly revisiting South Korea in October to deepen HBM4, NPU ties
    Advanced Micro Devices (AMD) CEO Lisa Su is reportedly set to visit South Korea again in October 2026, after her March 2026 trip, which formally launched next-generation AI memory...
    Wednesday 30 September 2026
    Memory shortage pushes TV semiconductors above panel costs

    A global memory shortage linked to rising AI infrastructure spending has upended TV manufacturing economics, with semiconductor costs...

    Wednesday 30 September 2026
    Inside China's 3D DRAM push: from lab to fab, and the road ahead
    China's push into 3D DRAM is moving from early-stage research into wafer processes and equipment, with efforts spanning the Institute of Microelectronics of the Chinese Academy of...
    Tuesday 29 September 2026
    CXMT to spend US$5.2 billion on R&D and testing as DRAM supply stays tight
    China's ChangXin Memory Technologies (CXMT) plans to invest CNY34.9 billion (approx. US$5.2 billion) in technology R&D and additional back-end DRAM testing capacity, stepping up...
    Tuesday 29 September 2026
    SoftBank subsidiary Saimemory taps Shinko to bring ZAM closer to commercialization
    Saimemory, a SoftBank subsidiary, has brought Shinko Electric Industries into its effort to commercialize Z-Angle Memory (ZAM), adding packaging-substrate, high-density integration...
    Tuesday 29 September 2026
    Samsung reshuffles DRAM roadmap, prioritizing B1b hybrid bonding for D0a, HBM5
    Samsung Electronics is reshaping its next-generation dynamic random-access memory (DRAM) roadmap, elevating its B1b wafer-to-wafer (W2W) hybrid bonding technology from a project-specific...
    Tuesday 29 September 2026
    Column: Why Micron's US$250M venture fund is about more than HBM margins—Taiwan has a stake in it
    Micron unveiled the Micron Ventures Paradigm Fund, a US$250 million venture vehicle, in mid-August 2026, as the memory maker pairs more than US$25 billion in fiscal 2026 capex with...
    Tuesday 29 September 2026
    Solidigm weighs US IPO as AI storage demand lifts valuation
    SK Hynix's US-based NAND flash and solid-state drive (SSD) subsidiary, Solidigm, is considering a US initial public offering as early as 2027, with reports indicating a potential valuation...
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

    Tuesday 29 September 2026
    SK Hynix tests HBM5 with TSMC as HBM4 enters Nvidia's next platform

    SK Hynix has validated its HBM5 memory with TSMC's CoWoS packaging, the company said in a September 28 post on its corporate newsroom...

    Tuesday 29 September 2026
    HBM to take nearly 30% of DRAM capacity as Samsung speeds up P5
    High-bandwidth memory (HBM) is expected to account for nearly 30% of DRAM makers' total wafer capacity in 2027, up from about 20% currently, as Samsung Electronics moves to accelerate...
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    BIZ FOCUS
    Sep 30, 08:00
    Hackathon Team Optimizes Urban Evacuation Decision-Making
    Wednesday 30 September 2026
    AI Memory & Storage: The 5th GMIF2026 Innovation Summit Concludes
    Wednesday 30 September 2026
    Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future
    Tuesday 29 September 2026
    Breaking free from keyword constraints: GeoGraph elevates job matching
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