SK Hynix began mass-production shipments of 12-layer HBM4 to Nvidia at the end of June and is increasing output ahead of a broader...

SK Group chairman Chey Tae-won said the South Korean conglomerate is preparing a US investment plan that would far exceed US$35 billion—the...

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Flexible circuit board maker Complex Micro Interconnection (CMI) said June 2026 revenue rebounded as consumer electronics shipments...

Global memory chipmakers are heading toward record revenue and profit in the second quarter of 2026, as AI infrastructure demand keeps...

Samsung Electronics has postponed mass production of its CXL 3.1 memory modules after delays to next-generation server processors from...

New figures from Counterpoint Research estimate that the bill of materials (BOM) for the upcoming iPhone 18 Pro Max could rise nearly...

Samsung Electronics, SK Hynix and Micron Technology are taking different manufacturing paths for the logic base die in HBM4, opening...