Winbond Chairman Arthur Chiao said market sentiment in the second half of 2026 would carry the strong momentum seen in the first half, with the overall market remaining in a supply...
SpaceX's IPO prospectus details an early-stage "Terafab" initiative to build large-scale AI chip manufacturing capacity. Still, the company warns of significant execution uncertainty,...
Samsung Electronics and SK Hynix dominate the global memory chip market, but their weaker position in automotive memory is drawing new scrutiny as AI data centers absorb more DRAM...
Samsung Electronics has started shipping samples of its latest high-bandwidth memory (HBM) chip, the 12-layer HBM4E, marking the industry's first delivery of the next-generation AI...
ChangXin Memory Technologies (CXMT), China's top DRAM maker, has been cleared by China's securities regulator for its highly anticipated IPO, which could raise funds worth CNY29.5...
Solidigm, the enterprise storage brand under SK Hynix, announced a leadership reshuffle this spring, naming two executives as co-chief executive officers to divide responsibilities...
SK Hynix is using Big Tech's rush to secure artificial intelligence (AI) memory supply as leverage for tougher long-term contracts, while resisting funding structures that could give...
First Micron, then SK Hynix, join the trillion-dollar club, capping an extraordinary repricing of an industry once dismissed as a commodity play. The milestone is more than a valuation...
Global DRAM revenue climbed sharply in the first quarter of 2026, approaching the US$100 billion threshold as artificial intelligence demand and tight supply conditions pushed prices...
On May 26, Xiaomi Corporation reported first-quarter 2026 revenue of CNY99.1 billion (approx. US$14.6 billion) as it confronts a "super cycle" of rising memory costs. Management characterized...
Transcend announced it will exhibit enterprise solid-state drives, DDR5 7200 memory, and embedded camera modules at COMPUTEX 2026 in the Storage and Management Solutions area, saying...
SK Hynix has unveiled a new high-bandwidth memory technology designed to reduce heat buildup in next-generation AI systems, as rising computing density turns thermal management into...
As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...
The race to dominate next-generation NAND flash memory has long been measured in layers — and Samsung Electronics appears to be pulling ahead. The South Korean chipmaker has...
