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NEWS TAGGED MEMORY CHIPS
Thursday 22 October 2026
GoldKey Technology posts record 3Q26 profit as industrial share rises
Memory module maker GoldKey Technology posted record third-quarter 2026 profit, with net income topping NT$1 billion (approx. US$30.9 million) for the first time at NT$1.03 billion,...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Thursday 22 October 2026
ESMT sees memory price momentum extending through 4Q26, 2027
Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%...
Thursday 22 October 2026
Russia considers reinstating parallel imports of Samsung, SK Hynix products amid memory shortages
Russia is reportedly considering reinstating parallel imports of products from Samsung Electronics and SK Hynix to ease shortages of memory and storage devices used in data centers...
Wednesday 21 October 2026
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation...
Wednesday 21 October 2026
Samsung shifts M2800 modem to 2nm, frees 4nm capacity for HBM base dies
Samsung Electronics is transitioning its 4nm production capacity to HBM, with its next-generation mobile modem, the M2800, set to move to a 2nm process. The freed 4nm capacity will...
Wednesday 21 October 2026
Samsung, SK Hynix reportedly upgrading China NAND fabs to fend off YMTC amid softening US stance
Samsung Electronics and SK Hynix are upgrading their NAND flash factories in China to make chips with more than 200 layers, Reuters reported on October 21, citing four people...
Wednesday 21 October 2026
Micron's Taichung union deal eases Taiwan DRAM strike risk; Taoyuan dispute remains unresolved
With a strike by Micron Taiwan employees looming, Micron Technology said Micron Memory Taiwan and the Taichung chapter of the Taiwan Micron Memory Union had reached agreement on several...
Wednesday 21 October 2026
Micron funds critical minerals processing at Indium Corporation's New York facility
Micron Technology said Tuesday it will fund critical minerals processing and high-purity materials manufacturing at Indium Corporation's facilities in Rome, New York.
Wednesday 21 October 2026
CXMT's next DRAM milestone: 4F² server memory with hybrid bonding by end-2026
Chinese DRAM maker CXMT is targeting higher-density manufacturing. At a recent shareholder meeting, management pledged to enter what it called the "uncharted territory" of extreme...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Micron faces potential Taiwan strike, union cites Samsung, SK Hynix profit-sharing benchmark
Micron Technology's Taoyuan union has announced a one-day warning strike for October 22, coinciding with a second round of labour mediation between the company and its Taichung union...
Wednesday 21 October 2026
Samsung Electro-Mechanics wins KRW360.5 billion memory substrate deal as AI demand drives expansion
Samsung Electro-Mechanics has secured a KRW360.5 billion (US$271.8 million) long-term contract to supply package substrates for memory semiconductors, strengthening its position in...
Wednesday 21 October 2026
Memory chip inflation accelerates smartphone brands' retreat from low-end devices
Rising memory prices are squeezing smartphone makers and consumers, pushing shipments to their lowest third-quarter level since 2012, and accelerating the market's retreat from entry-level...
Wednesday 21 October 2026
Samsung Electro-Mechanics extends long-term contracts to memory substrates, totaling KRW4.3T
Samsung Electro-Mechanics (SEMCO) has signed a long-term supply agreement worth KRW360.487 billion (approximately US$260 million) with a major global company for memory packaging substrates,...