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Tuesday 25 August 2026
Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon
On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...
Tuesday 25 August 2026
US voices first complaint over South Korea's KRW800 trillion chip cluster as investment pressure mounts
The US has informally expressed dissatisfaction with the South Korean government's KRW800 trillion (US$578.5 billion) plan to build a semiconductor cluster in the country's southwest...
Tuesday 25 August 2026
China-based Guangyu Xinchen says 3D-stacked edge AI chip has entered mass-production deployment
According to 36Kr, Shanghai Guangyu Xinchen Technology says its TC1000 series of 3D-stacked near-memory-computing AI processors has moved from silicon validation to mass-production...
Tuesday 25 August 2026
Commentary: Nvidia's 15% hike piles pressure on the AI supply chain, lifts ASIC prospects
Nvidia has reportedly notified major customers that server systems using its AI chips will rise by more than 15%, with the new pricing set to apply to models shipping from early 2027,...
Tuesday 25 August 2026
Samsung, SK Hynix step up China NAND upgrades as US tool risks grow

Samsung Electronics and SK Hynix are stepping up equipment spending at their NAND flash plants in China through 2027, upgrading existing...

Tuesday 25 August 2026
AI infrastructure boom drives Taiwan export orders, exposing power bottleneck, net-zero tech needs

Global artificial intelligence infrastructure buildouts and rising capex by cloud service providers pushed Taiwan's July export orders...

Tuesday 25 August 2026
SK Hynix and Alibaba tackle the next AI bottleneck: getting more value per chip
The AI infrastructure race has been marked by a near-fixated drive to expand AI-powered buildouts, as demand for increasingly complex chip configurations pushes against the physical...
Tuesday 25 August 2026
Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
Tuesday 25 August 2026
Nvidia memory demand widens the gap between SK Hynix and Samsung

Nvidia's AI memory orders helped drive a sharp split between SK Hynix and Samsung Electronics in the first half of 2026. According to...

Monday 24 August 2026
Etron chair sees memory boom extending to 2028-2030
The memory industry is undergoing a structural shift as AI demand surges, and Etron Technology chairman Nicky Lu said the sector's boom will stretch beyond 2027, with shortages likely...
Monday 24 August 2026
Samsung's DRAM capacity lead shrinks as SK Hynix expands faster

Samsung Electronics' DRAM wafer capacity will grow only marginally through 2027, with investment directed at node migration and line...

Monday 24 August 2026
SK Hynix charts advanced HBM packaging path: hybrid bonding, Intel EMIB and 3D integration
Competition in high bandwidth memory (HBM) is shifting from raw memory performance to advanced packaging. As bandwidth, capacity and stack heights keep climbing, thermal management,...
Monday 24 August 2026
Analysis: SK Hynix pushes beyond HBM with HBF and CPO
SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...
Monday 24 August 2026
Nvidia server prices to rise up to 17% as memory costs climb
Prices for some Nvidia-based server systems due for delivery in 2027 are set to rise by more than 15%, with certain flagship configurations increasing about 17%, as higher memory and...
Monday 24 August 2026
Shanghai accepts YMTC's STAR Market listing application
China's largest NAND flash maker is moving toward a major Shanghai listing, but global investors will be watching more than the size of the deal. YMTC's IPO comes as chip demand rises,...