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NEWS TAGGED MEMORY CHIPS
Saturday 26 September 2026
DIGITIMES Insight: China's memory makers seek scale, funding to close the gap with global leaders

China's two leading memory suppliers are moving to raise capital and expand output as demand for chips grows, a shift that could reshape...

Saturday 26 September 2026
Samsung foundry recovery gains pace, but 2nm, Taylor fab remain hurdles

Samsung Electronics' foundry recovery is gaining pace as higher utilization, firmer pricing, and stronger advanced-node demand improve...

Saturday 26 September 2026
Acer, Phison split on DRAM outlook as PC memory supply eases
Acer and Phison Electronics are offering sharply different readings of the DRAM market as supply conditions improve for mainstream PC memory while AI and server demand keep the broader...
Friday 25 September 2026
Samsung, SK Hynix in the running for PS6 GDDR7 orders
Samsung Electronics and SK Hynix are reportedly in the running to supply 24Gb GDDR7 memory for Sony's next-generation PlayStation, as tight memory supply complicates planning for the...
Thursday 24 September 2026
CXMT gains ground in DRAM as Samsung, SK Hynix shift more capacity to HBM
China's ChangXin Memory Technologies (CXMT) is gaining ground in the global DRAM market as Samsung Electronics and SK Hynix allocate more production capacity to high-bandwidth memory...
Thursday 24 September 2026
South Korea chip, panel lines stay on as AI, iPhone demand surges

South Korea's major semiconductor, display, and electronics parts factories are staying open through the Chuseok holiday as AI-driven...

Thursday 24 September 2026
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
Thursday 24 September 2026
Qualcomm adopts 'offset PoP' packaging to cool new flagship phone SoC
Qualcomm unveiled two flagship mobile platforms at the Snapdragon Summit 2026, including the Snapdragon 8 Elite Extreme Gen 6, which changes its packaging approach to improve heat...
Thursday 24 September 2026
Powertech targets quarterly growth in 2026, eyes record high

Powertech Technology expects stronger memory packaging and testing demand, higher average selling prices (ASPs), and ramping high-end...

Thursday 24 September 2026
SK Hynix Indiana HBM plant faces lawsuit

SK Hynix's high-bandwidth memory (HBM) production site under construction in Indiana has been drawn into local litigation as the race...

Thursday 24 September 2026
AMD pushes ROCm for agentic workloads while Intel holds on to OpenVINO

Starting in the second half of 2025, as AI agent programs such as OpenClaw, Hermes, Claude, and DeepSeek Harness were launched one after...

Wednesday 23 September 2026
YMTC wins German injunctions against Micron in latest round of NAND patent battle
Micron is facing fresh pressure on multiple fronts after Germany's Munich I Regional Court sided with Chinese memory maker YMTC and issued two injunctions over alleged infringement...
Wednesday 23 September 2026
Samsung LPDDR6 validated by Qualcomm for next-gen Snapdragon platform
AI workloads are pushing cloud, edge, and mobile devices toward tighter power budgets and heavier data traffic, making memory efficiency a growing global issue. Samsung is positioning...
Wednesday 23 September 2026
Biwin Storage commits US$672M to double down on 2.5D packaging, compute-memory integration

Biwin Storage Technology plans to invest CNY4.5 billion (approx. US$672 million) in the third phase of its wafer-level advanced packaging...

Wednesday 23 September 2026
SK hynix's venture arm moves beyond memory into optical interconnect and system software
SK hynix has launched a corporate venture capital (CVC) brand, SK hynix Ventures, and widened its investment scope beyond semiconductors and emerging technology to include AI computing,...