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    CPO raises PCB downgrade concerns but switches stick with M8 CCL
    21min ago
    iPhone 18 Pro sellouts across Taiwan as foldable Duo looms
    23min ago
    Resonac develops 12-inch SiC substrate to target AI and EV demand
    Sep 17, 18:14
    High-end GPUs may be slowing China’s AI compute expansion
    Sep 17, 18:14
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    Sep 17, 18:14
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    Sep 17, 18:14
    NEWS TAGGED MEMORY CHIPS
    Friday 18 September 2026
    Micron: AI memory crunch rewrites the market with long-term deals and custom designs
    As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
    Friday 18 September 2026
    Micron's Taiwan investment passes US$47 billion as it rallies fab construction suppliers

    Micron held a conference for Taiwanese suppliers on September 17 under the theme of building at speed and growing at scale. The event...

    Friday 18 September 2026
    AI's next infrastructure squeeze is storage: Seagate sees demand accelerating
    Seagate's 2026 Data Infrastructure Readiness Report finds that enterprise AI strategies are moving beyond early-stage adoption toward broader deployment, increasing the importance...
    Friday 18 September 2026
    Winbond's Infineon buyout puts GigaDevice under pressure

    Winbond Electronics' US$1.12 billion acquisition of Infineon's NOR Flash and ferroelectric RAM (F-RAM) businesses has drawn close attention...

    Thursday 17 September 2026
    SK Hynix looks beyond HBM as inference workloads diversify
    SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
    Thursday 17 September 2026
    Samsung bets on zHBM as 2.5D memory nears its limits
    Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
    Thursday 17 September 2026
    CXMT cashes in on the DRAM shortage — and takes aim at HBM
    ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
    Thursday 17 September 2026
    Memory LTAs lock up 50-70% of capacity
    The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from...
    Thursday 17 September 2026
    AI's memory appetite is squeezing the electronics industry from the bottom up, Intel warns

    Fast-moving advances in chip production have spurred a semiconductor boom, markedly altering the manufacturing scope of the broader...

    Thursday 17 September 2026
    SK Hynix weighs US memory options as buyers lock in 2027 supply
    SK Hynix is keeping its US memory options open as customers move earlier to secure 2027 supply, with tightening availability raising pressure on memory makers to consider additional...
    Thursday 17 September 2026
    Chip equipment, materials suppliers lead India investment pledges ahead of SEMICON India 2026

    Foreign commitments timed around SEMICON India are moving deeper into the supply chain. In the three days before the 2026 edition opened...

    Thursday 17 September 2026
    SK Hynix reportedly eyes Intel Ohio plant for US memory production
    SK Hynix is reportedly lining up US memory chip production and is in talks with Intel over possible cooperation, including leasing part of Intel's Ohio facilities. The move would give...
    Thursday 17 September 2026
    Intel CEO warns of 2027 memory crunch and tighter CPU supply
    AI infrastructure expansion is turning memory supply into a major bottleneck for the semiconductor industry. Intel CEO Lip-Bu Tan warned that the memory shortage in 2027 could be worse...
    Thursday 17 September 2026
    Samsung looks to outside suppliers as HBM boom shifts priorities
    Samsung Electronics has long benefited from a level of vertical integration few technology companies can match, spanning smartphones, memory, chip design, foundry manufacturing and...
    Thursday 17 September 2026
    Jensen Huang's Galaxy Z Fold8 spotlights Nvidia-Samsung ties

    Nvidia CEO Jensen Huang has again been photographed using Samsung Electronics' latest foldable phone, the Galaxy Z Fold8, after being...

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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
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