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Friday 10 July 2026
GlobalWafers-Micron deal pushes US semiconductor localization beyond chip fabs
GlobalWafers and Micron have signed a 10-year supply agreement, alongside US$500 million in strategic financial support, in a move that underscores how artificial intelligence (AI),...
Friday 10 July 2026
HBM prices set to double in 2027 as AI demand and supply deals tighten the memory market

High-bandwidth memory (HBM) prices could more than double in 2027 as Nvidia's Rubin platform drives demand, HBM4 raises production...

Friday 10 July 2026
ADATA Technology to launch tender offer for Tittot in cultural industry push

ADATA Technology's board has approved a public tender offer for Tittot's common shares at NT$24 (US$0.75) per share in cash, a move...

Friday 10 July 2026
Kioxia, SanDisk ship BiCS10 samples as NAND comeback takes shape
Kioxia and SanDisk have begun shipping samples of 332-layer BiCS10 NAND, giving the Japanese memory maker a concrete technology milestone as CEO Hiroo Ota works to pull the company...
Thursday 9 July 2026
Micron to invest up to $3 billion in US semiconductor supply chain, anchored by GlobalWafers wafer deal
Micron Technology said July 9 it plans to invest up to $3 billion to strengthen the US semiconductor supply chain, with the bulk of the announcement centered on a new financing and...
Thursday 9 July 2026
Phison 1H26 revenue tops NT$100B as AI orders extend to 1H27
Phison Electronics, a NAND controller maker, said first-half consolidated revenue in 2026 surpassed NT$100 billion (US$3.1 billion) for the first time. CEO Khein-Seng Pua said June...
Thursday 9 July 2026
CXMT seeks US$4.1bn in China's biggest 2026 IPO for DDR5, HBM

CXMT has launched a CNY29.5 billion (approx. US$4.1 billion) STAR Market IPO, giving China's top DRAM maker fresh capital to upgrade...

Thursday 9 July 2026
CXMT IPO leaves HBM off the funding list, tempering China AI memory hype

CXMT's STAR Market IPO suggests China's largest DRAM maker is prioritizing commodity memory over an aggressive near-term push into...

Thursday 9 July 2026
Memory costs slash low-end phone output and pressure PA shipments

The 2026 smartphone market is facing a dark outlook as memory prices rise and shortages tighten supply, weighing on low- and mid-range...

Thursday 9 July 2026
SK Hynix targets AI infrastructure role with Nasdaq ADR listing

SK Group chairman Tae-Won Chey is reportedly set to travel to the US for SK Hynix's American depositary receipt (ADR) listing on Nasdaq,...

Thursday 9 July 2026
Samsung, SK Hynix rethink hybrid bonding timeline for next-gen HBM

Samsung Electronics and SK Hynix may take longer than expected to adopt hybrid bonding in next-generation high-bandwidth memory, as...

Thursday 9 July 2026
SK Hynix supplier talks show AI memory boom shifting pricing power

The AI data center boom is reshaping the memory supply chain, giving Samsung Electronics, SK Hynix, and Micron greater pricing power...

Thursday 9 July 2026
Team Group posts record first-half revenue on industrial and AI demand
Memory module maker Team Group reported a June 2026 consolidated revenue of NT$3.0 billion (US$94.2 million), up 18.1% from May and 35.0% from a year earlier. The Taiwan-based company...
Thursday 9 July 2026
Macronix and Winbond post record June revenue as memory prices stay firm
Macronix and Winbond Electronics reported record consolidated revenue in June 2026 and for the second quarter of the year as memory chip demand and pricing strengthened. The Taiwanese...
Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...