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Thursday 3 September 2026
CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

Thursday 3 September 2026
SK Hynix weighs Kioxia production tie-up in Japan
SK Group chairman Chey Tae-won has raised the possibility of jointly producing semiconductors with Japan's Kioxia, taking SK Hynix's exploration of a Japanese manufacturing base a...
Thursday 3 September 2026
Intel pre-funds EMIB-T and CPU capacity, will address DRAM through partners rather than fabs
Intel's US$23 billion equity raise in August was pre-funding for a capacity build driven by demand and process confidence rather than distress, chief financial officer David Zinsner...
Thursday 3 September 2026
Apple, Xiaomi and Nvidia chase terabyte-class bandwidth for AI chips
For decades, semiconductor performance gains largely came from shrinking process nodes, from 22nm and 14nm to 7nm and 3nm. AI is changing the constraint: processors are getting faster,...
Thursday 3 September 2026
ChangXin Memory's 'Hefei Project' exposed in Samsung DRAM theft case
South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology...
Thursday 3 September 2026
Samsung to add 1,612 new equipment units at Vietnam chip plant
Samsung Electronics is set to install 1,612 brand-new critical semiconductor back-end processing tools manufactured in South Korea at its factory under construction in Vietnam's Thai...
Thursday 3 September 2026
Macronix boosts sustainability spending to NT$780 million
Macronix (MXIC) said in its latest sustainability report for 2025 that greenhouse gas emissions fell 19.8% from 2024 and 32% from the business-as-usual (BAU) baseline, beating its...
Thursday 3 September 2026
Yield has been semiconductor industry's oldest question; now it's Microsoft's test for AI
Microsoft brought the semiconductor industry's own measure of success back to it on Wednesday, and argued that AI will be judged by it.
Wednesday 2 September 2026
Sandisk says HBF can match HBM bandwidth with up to 16x the capacity
Sandisk says its NAND-based High Bandwidth Flash (HBF) technology can match HBM bandwidth while providing eight to 16 times the capacity at a similar cost, positioning flash memory...
Wednesday 2 September 2026
Micron says tightly coupled DRAM could deliver more than 10x HBM bandwidth
Micron Technology is exploring tightly coupled DRAM that could deliver more than 10 times the bandwidth of HBM while using substantially less energy per bit, as the memory maker looks...
Wednesday 2 September 2026
DRAM giants target 3D stacking to break memory wall and power bottlenecks
At a shared stage at Semicon Taiwan 2026, executives from Samsung Electronics, SK Hynix, and Micron agreed that traditional 2.5D high-bandwidth memory (HBM) using interposers is approaching...
Wednesday 2 September 2026
Samsung, SK Hynix inventories surge as valuation reserves fall
Samsung Electronics and SK Hynix ended the first half of 2026 holding sharply more inventory than six months earlier, an unusual development in a memory market where demand continues...
Wednesday 2 September 2026
MCU chipmaker Sonix sees supply crunch lasting through 2026, memory shortage hits imaging shipments
Sonix Technology expects consumer IC and MCU sales to keep growing in the second half of 2026, but memory shortages could slow imaging-product shipments. AI-driven demand is also squeezing...
Wednesday 2 September 2026
Semicon Taiwan 2026 signals a broader race for AI-era semiconductor leadership
Semicon Taiwan 2026 will draw more than 1,300 companies and 4,300 booths to Taipei from September 2 to 4, setting new records as the industry show expands beyond chipmaking into packaging,...
Wednesday 2 September 2026
Apple's M6 and M5 Ultra break rule tying process to chip strength
Apple has unveiled new Mac mini and Mac Studio models, equipped respectively with its first 2-nanometer chip, the M6, and the four-die M5 Ultra. Most notably, the latest 2-nanometer...