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Friday 12 January 2018
HYE to seek more sales of automotive diodes for electric cars in 2018
After gaining a solid ground in the solar diode market, Taiwan power discrete component supplier HY Electronic (HYE) is stepping up efforts to tap the market for automotive diodes...
Monday 8 January 2018
Taiwan businesses may record impressive M&A growth in 2018
Taiwan businesses have performed aggressively in conducting mergers and acquisitions (M&A) at home and abroad over the past year, and a spate of factors such as cross-domain integrations...
Thursday 4 January 2018
Taiwan inductor maker Chilisin to fully acquire Mag.Layer
Power inductor maker Chilisin Electronics has announced it will acquire a 100% stake in fellow maker Mag.Layer Scientific Technics through a stock swap in which 0.73 Chilisin share...
Friday 22 December 2017
Diode maker HYE to deepen deployments in automotive electronics sector in 2018
With the solar power and automotive electronics sectors expected to sustain stable growth momentum for a while, discrete power component supplier HY Electronic (HYE) will step up...
Tuesday 21 November 2017
Samsung to unseat Intel as top semiconductor supplier in 2017, says IC Insights
For the first time since 1993, the semiconductor industry is expected to witness a new number 1 supplier, according to IC Insights.
Tuesday 14 November 2017
Qualcomm rejects Broadcom acquisition bid
Qualcomm has announced that its board of directors has unanimously rejected the unsolicited proposal announced by Broadcom Limited ("Broadcom") on November 6, 2017, saying the bid...
Tuesday 7 November 2017
Qualcomm receives unsolicited takeover offer from Broadcom
Qualcomm on November 6 confirmed that it has received a non-binding, unsolicited proposal from Broadcom to acquire all of the outstanding shares of Qualcomm for per share consideration...
Monday 16 October 2017
Toshiba discloses further investment in 3D NAND flash facility
Toshiba announced recently its board of directors had approved a further investment by Toshiba Memory in production equipment for Fab 6 at its Yokkaichi operations in Mie (Japan).
Friday 6 October 2017
Dialog to acquire Silego
Dialog Semiconductor, a provider of integrated power management, AC/DC power conversion, charging, and low power connectivity technology, has announced it has signed a definitive...
Friday 29 September 2017
Toshiba seals JPY2 trillion deal with Bain group
Toshiba announced on September 28 the company had signed a deal to sell its memory-chip business - Toshiba Memory - to a group led by Bain Capital for about JPY2 trillion (US$18 bi...
Tuesday 26 September 2017
Sigurd to enter board of Winstek
Winstek Semiconductor (formerly STATS ChipPAC Taiwan Semiconductor) is scheduled to hold a shareholders meeting on November 15 to re-elect its board of directors. Sigurd Microelectronics...
Thursday 21 September 2017
Toshiba agrees to sell memory-chip unit to Bain Capital-led consortium
Toshiba has agreed to sell its memory-chip business to KK Pangea, a special purpose acquisition company formed by a Bain Capital Private Equity-led consortium. The decision was made...
Monday 4 September 2017
Posiflex board approves plan for Portwell acquisition
The board of industrial PC (IPC) maker Posiflex Technology has approved a plan to invest over NT$5.1 billion (US$173.4 million) to fully acquire Portwell, also an IPC player, for...
Monday 4 September 2017
Lam Research completes acquisition of Coventor
Lam Research, a supplier of wafer fabrication equipment and services to the semiconductor industry, has completed the acquisition of Coventor, a provider of simulation and modeling...
Wednesday 30 August 2017
Western Digital to acquire Tegile Systems
Western Digital has announced plans to acquire Tegile Systems, a provider of flash and persistent-memory storage solutions for enterprise data center applications. Financial terms...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research