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NEWS TAGGED ADVANCED PACKAGING
Tuesday 13 May 2025
Hanwha Semitech establishes new R&D center to meet surging demand for TCB equipment
South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation...
Thursday 8 May 2025
Innolux strengthens leadership as it accelerates transformation beyond display panels

Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

Wednesday 30 April 2025
K&S partners with Taiwanese semiconductor leaders in advanced packaging push

Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's...

Saturday 22 March 2025
Intel CEO Lip-Bu Tan's appointment sparks renewed hopes for India
Intel's appointment of Lip-Bu Tan as its new chief executive has raised fresh speculation over the company's potential expansion into India's semiconductor sector, particularly in...
Friday 17 January 2025
US govt commits US$1.4 billion to domestic chip packaging
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
Friday 3 January 2025
TSMC talent poaching limits highlighted by Samsung exec departure
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
Wednesday 25 December 2024
FCCL firm Taiflex expects 2025 growth from advanced packaging materials
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
Monday 23 December 2024
3DIC and packaging drive AI chip innovation at SEMICON Japan 2024
While SEMICON Japan 2024 highlighted 3DIC and advanced packaging equipment essential for artificial intelligence (AI) chips, the event saw fewer physical machinery demonstrations...
Tuesday 19 November 2024
GPTC sees wet process equipment orders soar on advanced packaging boom in 2025
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
Tuesday 15 October 2024
OSATs budget more capex in 2024 than 2023
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Friday 11 October 2024
ASE to boost advanced packaging capacity with new K28 plant
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Tuesday 1 October 2024
How China is accelerating advanced packaging with HBM and CoWoS amid tightening US restrictions
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Friday 20 September 2024
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Friday 6 September 2024
Advanced packaging material sales to skyrocket in 2025, says Topco Scientific
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
Friday 30 August 2024
G2C+ alliance expects robust demand for advanced packaging
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...