The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...
Prominent OSATs have allocated a greater capital expenditure for 2024 compared to 2023, suggesting that their existing production capacity for advanced packaging is still limited,...
Advanced Semiconductor Engineering (ASE) is intensifying its development in the advanced packaging sector by establishing the new K28 plant in Kaohsiung, southern Taiwan. A groundbreaking...
Presently, the enhancement of AI chips' computing power heavily depends on advanced packaging technologies such as CoWoS and HBM, with the two technologies complementing each other...
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Topco Scientific, a supplier of semiconductor materials, anticipates substantial sales growth for advanced packaging materials in 2025 due to demand generated by AI applications.
The global expansion of semiconductor advanced packaging capacity is just beginning, which is promising enormous business opportunities for equipment suppliers, such as the G2C+ alliance...
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
In recent years, advanced packaging has become increasingly crucial in high-performance computing, and Chinese OSAT companies, particularly Tongfu Microelectronics, are determined...
As AI applications proliferate, global tech giants are ramping up investments in data centers worldwide. While traditional hubs like the US, Europe, Japan, and China remain pivotal,...
Samsung Electronics is reportedly developing a new packaging technology to address the overheating of mobile application processors (APs), which may be applied to its next-generation...
ASE Holdings (ASEH) has stepped up production expansion for advanced packaging and does not rule out establishing additional facilities in Japan, the US, or Mexico, according to company...
