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NEWS TAGGED ADVANCED PACKAGING
Thursday 30 October 2025
Singapore leverages advanced packaging to capture share of US$1 trillion chip market
Terence Gan, Executive Director of Singapore's Institute of Microelectronics (IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling...
Thursday 30 October 2025
'Semiconductor paradox' defines next chip boom, says director of Singapore's SSIA

Ang Wee Seng, Executive Director of the Singapore Semiconductor Industry Association (SSIA), told attendees at the 2025 Advanced Packaging...

Thursday 30 October 2025
STATS ChipPAC CTO: Scaling innovation defines AI and HPC's next era
IK Shim, Chief Technology Officer of STATS ChipPAC, opened the 2025 Advanced Packaging Developers Conference (APDC) with a clear message: the semiconductor industry's greatest challenge...
Sunday 12 October 2025
Inside Tesla's plan to rewire itself for AI future

Long known for its disruptive innovations in electric vehicles, Tesla is now undergoing a deeper transformation, one that extends far...

Friday 3 October 2025
Tescan Unveils Workflow-Centric Strategy to Address Advanced Packaging Complexity, Strengthening Commitment to Taiwan and APAC Customers
In an exclusive interview with DIGITIMES ASIA, the Czech-based electron microscope manufacturer Tescan Group detailed a significant strategic transformation. This profound shift aims...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Thursday 17 July 2025
Advanced packaging boom propels ASE, KYEC through shifting semiconductor landscape

Even as Taiwan's semiconductor tariff policies remain unresolved and the New Taiwan dollar continues to appreciate, major chip packaging...

Monday 19 May 2025
AI, EV boom thrusts advanced packaging to forefront of China's chip strategy
China's outsourced semiconductor assembly and test (OSAT) industry is gaining momentum, driven by surging demand for artificial intelligence (AI) and electric vehicles (EVs). As the...
Tuesday 13 May 2025
Hanwha Semitech establishes new R&D center to meet surging demand for TCB equipment
South Korean TC bonder (TCB) manufacturer Hanwha Semitech recently announced an organizational restructuring aimed at strengthening its development capabilities for next-generation...
Thursday 8 May 2025
Innolux strengthens leadership as it accelerates transformation beyond display panels

Innolux Corporation, one of the world's leading panel manufacturers, held its annual general meeting this week. During the meeting, shareholders...

Wednesday 30 April 2025
K&S partners with Taiwanese semiconductor leaders in advanced packaging push

Despite flat demand for most consumer electronics chips and a muted outlook for traditional wire bonding and packaging equipment, Singapore's...

Saturday 22 March 2025
Intel CEO Lip-Bu Tan's appointment sparks renewed hopes for India
Intel's appointment of Lip-Bu Tan as its new chief executive has raised fresh speculation over the company's potential expansion into India's semiconductor sector, particularly in...
Friday 17 January 2025
US govt commits US$1.4 billion to domestic chip packaging
The US Department of Commerce announced on January 16, 2025, that the CHIPS Program's National Advanced Packaging Manufacturing Program (NAPMP) has finalized US$1.4 billion in awards...
Friday 3 January 2025
TSMC talent poaching limits highlighted by Samsung exec departure
Following the widely reported departure of Lin Jing-cheng "Vic" (J. C. Lin) from Samsung Electronics in December 2024, industry analysts are now assessing the impact of his brief...
Wednesday 25 December 2024
FCCL firm Taiflex expects 2025 growth from advanced packaging materials
Flexible copper-clad laminate (FCCL) maker Taiflex Scientific expects to gain growth momentum from new product lines in 2025 though the consumer electronics market will only see mild...