The Mini LED demand in the LED industry has shown a lack of new momentum, leading to a halt in expansion plans, and impacting equipment supplier FitTech's operations.
TSMC's second-quarter sales may surpass the target, seeing customers' AI and HPC-related orders flowing in. In July, chips for Apple's iPhone 16 and Intel's 3nm chips will start mass...
Samsung Electronics is actively expanding its partner alliance to strengthen its semiconductor packaging technology, seeking to compete with the world's leading foundry, TSMC, in...
Contrel Technology, an LCD equipment specialist, is increasing its deployment in MicroLED and advanced packaging, which is expected to yield results in 2025.
Semiconductor packaging and testing company Siliconware Precision Industry Ltd. (SPIL) announced recently that it will invest MLR 6 billion (US$1.276 billion) to build a packaging...
Samsung Electronics has recently expanded its workforce deployment at its new packaging R&D base in Yokohama, Japan, to expedite construction and support the development of next-generation...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
PCB and semiconductor equipment specialist Csun Manufacturing plays an important role in the supply chain for advanced 2.5D and 3D IC packaging, said company president Frank Liang...
Intel has stepped up orders with several equipment and material suppliers for its next-generation advanced packaging based on glass substrate technology, which is expected to go into...
Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
The semiconductor industry is witnessing significant shifts influenced by geopolitical considerations. One recent case exemplifying this trend is King Yuan Electronics's (KYEC) sale...
