News tagged advanced process at DIGITIMES

NEWS TAGGED ADVANCED PROCESS

Monday 15 June 2026

CoPoS and FOPLP accelerate as Manz delivers its first 310mm electrochemical deposition equipment

Equipment maker Manz recently announced the successful delivery of the world's first 310mm x 310mm panel-level packaging (PLP) electrochemical...

Friday 12 June 2026

Sigurd revenue hits record as AI and chip demand lift operations

Sigurd announced that its May revenue reached a historic high, driven by overseas customer expansion, stronger demand for AI-related...

Thursday 11 June 2026

Commentary: TSMC's pricing power stays intact as AI demand keeps fabs full

Market chatter about TSMC has intensified, with reports that its advanced process and packaging prices will rise again in the second half of 2026 and 2027, while some Google TPU production...

Tuesday 9 June 2026

MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand

MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...

Wednesday 3 June 2026

Intel Foundry makes progress in advance processes, CEO Tan calls TSMC a key partner

Intel CEO Lip-Bu Tan said Intel Foundry is making steady progress in advanced process technology, adding that Taiwan Semiconductor Manufacturing Company (TSMC) is one of Intel's most...

Tuesday 2 June 2026

KYEC chair CK Lee steps down; vice chair Chi-chun Hsieh takes over

Semiconductor testing company King Yuan Electronics (KYEC) recently convened its 2026 shareholders' meeting, during which it completed the election of nine board directors. Longtime...

Tuesday 2 June 2026

Commentary: Intel turns AI packaging crunch into foundry comeback test

Intel's foundry revival may depend less on beating TSMC at the most advanced process nodes than on whether it can turn AI-driven demand into a profitable advanced packaging busines...

Tuesday 2 June 2026

Analysis: Advanced packaging shifts from TSMC dominance to industry collaboration

Nvidia CEO Jensen Huang has repeatedly backed TSMC's price hikes, saying its advanced process and supply-chain services are difficult and highly valuable. As AI chip demand surges,...

Monday 1 June 2026

MediaTek highlights supply chain advantage, says focus with Nvidia is product cooperation

MediaTek held a pre-Computex 2026 media event in Taipei, Taiwan, on May 29, after which president and COO Joe Chen and CFO and co-COO David Ku spoke with reporters. Ku shared his views...

Sunday 31 May 2026

AI demand and chip investment lift Taiwan exports and business outlook

Taiwan's economic outlook improved in April 2026 as rising AI demand and receding Middle East geopolitical risks boosted manufacturers' business sentiment, the National Development...

Friday 29 May 2026

Analysis: ASIC market tightens as capacity becomes key battleground for cloud chips

Cloud service providers' demand for application-specific integrated circuits, or ASICs, is increasingly locked in as advanced process nodes, advanced packaging, and component supply...

Tuesday 26 May 2026

Chiplet boom puts Taiwan's InPsytech and its AI connectivity IPs in the spotlight

As the global semiconductor industry pivots toward chiplet-based designs — where multiple smaller chips are packaged together rather than built as a single monolithic die —...

Tuesday 26 May 2026

Intel's Rio Rancho fab becomes test case for AI-era chip packaging

Intel is looking to broaden its foundry strategy beyond the race for advanced process nodes, placing greater emphasis on advanced packaging and glass substrate technologies as it positions...

Thursday 21 May 2026

Texas Instruments sues former exec over trade secret theft at GlobalFoundries

Bloomberg reports that Texas Instruments (TI) has sued former vice president Kannan Soundarapandian, alleging he joined GlobalFoundries without fully disclosing his new employer...

Thursday 14 May 2026

TSMC expands CoWoS and SoIC capacity on AI boom

TSMC said on May 14, 2026, that it is rapidly expanding CoWoS and SoIC advanced packaging capacity as AI demand drives the construction of 18 new fabs and advanced packaging facilities...

1/9 pages

BIZ FOCUS

Jun 1, 08:00

LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE

MOST-READ
7 DAYS NEWS

Full list

RESEARCH INSIGHTS

Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook