According to industry sources, TSMC plans to launch its first high-NA EUV lithography equipment at its fab site in Hsinchu, northern Taiwan, by the end of September, a quarter earlier...

SEMICON Taiwan 2024, is set to take place on September 4, with over 200 industry leaders from the global high-tech and semiconductor sectors expected to attend.

TSMC's board of directors has approved a significant capital budget of US$29.615 billion aimed at enhancing the company's advanced process capacities and upgrading packaging technology...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes,...

Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...

Taiwan Semiconductor Manufacturing Company (TSMC) remains the world's sole provider capable of delivering a complete end-to-end Chip-on-Wafer-on-Substrate (CoWoS) packaging solution...

TSMC may launch a new round of price negotiations in the second half of 2024, with advanced foundry quotes expected to rise as early as 2025.

Semiconductor materials distributors are optimistic about operations in the second quarter of 2024, driven by rising semiconductor capacity and long-term demand for AI and High-Performance...

Taiwan Semiconductor Manufacturing Company (TSMC) has cut its 2024 growth predictions for the foundry and semiconductor industries while keeping the company's growth forecast at 21...

The three major players in advanced chip manufacturing have secured CHIPS Act subsidies by promising to increase investments in fabrication facilities within the United States. With...

According to TSMC's announcement of a third fab for 2nm and more advanced chips, as well as Amkor Technology's intentions to develop an advanced packaging fab in Arizona, advanced...

The Taiwanese government has proposed a subsidy program to fund the research and development of sub-16nm chips.

Samsung Electronics is reportedly renaming its second-generation 3nm process to "2nm process," with expectations to begin mass production in the second half of 2024.

A US Department of Commerce official said Washington will not limit China's access to mature process chips.

At the first conference for its burgeoning foundry business, Intel restated its aim to provide five advanced process nodes in four years. The company also disclosed plans for more...