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Thursday 5 September 2024
PSMC unveils Logic-DRAM and 2.5D interposer
On August 4, Powerchip Semiconductor Manufacturing Company (PSMC) unveiled the Logic-DRAM multi-layer wafer stacking technology and 2.5D interposers to meet rising AI demand.
Wednesday 4 September 2024
AI chip development still faces interconnect and other tech constraints, says MediaTek CEO
During a recent public discussion with Imec CEO Luc Van den Hove, MediaTek CEO Rick Tsai highlighted that there are still technical barriers to AI chip development, such as chip interconnect...
Wednesday 4 September 2024
SEMICON Taiwan 2024: AI chipmaking, HBM in spotlight
Key AI chipmaking and high-bandwidth memory (HBM) technologies will be highlighted at SEMICON Taiwan 2024, where major manufacturers will gather to present their most recent develo...
Friday 30 August 2024
Nvidia supply chain, including TSMC, has strong order visibility for AI chips
Major players in Nvidia's supply chain, such as global foundry leader TSMC, have good order visibility extending to 2026, despite stock investors' concern about the US chip vendor's...
Thursday 29 August 2024
Panel-level packaging looks promising
Panel-level packaging (PLP) is promising to become a viable choice due to its cost-effectiveness and insufficient capacity for advanced chip packaging in the semiconductor industry...
Tuesday 27 August 2024
Canon, front-end equipment makers shift focus to advanced AI chip packaging solutions
AI chips required by generative AI rely on finely wired and processed equipment; thus, front-end process equipment manufacturers have shifted their focus to the advanced packaging...
Tuesday 27 August 2024
Manz AG anticipates growth in advanced packaging amid CoWoS shortage
The semiconductor industry is experiencing a surge in demand for advanced packaging technologies, driven by the rapid growth of high-end AI servers and generative AI. This trend has...
Thursday 22 August 2024
Foxconn navigates complex AI server trading models to maximize profitability
Despite rumors of shipment delays for Nvidia's new-generation AI chips, the demand for AI servers remains strong. For contract manufacturers like Foxconn, the challenge lies in maximizing...
Wednesday 21 August 2024
xMEMS unveils revolutionary cooling SoC for AI devices
US-based xMEMS Labs has developed the XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing semiconductor micro-electro-mechanical...
Tuesday 20 August 2024
Global semiconductor manufacturing industry strengthens in 2Q24, SEMI reports
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure,...
Tuesday 20 August 2024
Sunplus develops AI chip platform for future growth
IC design house Sunplus Technology is actively developing an AI chip platform that the company expects will bring explosive growth.
Tuesday 20 August 2024
Supply chain actively developing GB200 servers despite Blackwell delay, say sources
Nvidia's revised launch schedule for its next-gen Blackwell AI chips has led to changes in the supply chain, with some server makers shifting their focus to developing GB200-based...
Monday 19 August 2024
Huawei's Ascend 910C: a potential threat to Nvidia's dominance in China's AI chip market
Huawei's new AI chip, the Ascend 910C, is reportedly set for release with performance comparable to the NVIDIA H100 GPU. While the older Ascend 910B did not pose a significant threat...
Thursday 15 August 2024
DIGITIMES Research forecasts exponential AI chip market growth in special report
DIGITIMES Research released a special report on AI chips on August 14, highlighting the rapid development of the semiconductor market driven by generative AI.
Thursday 15 August 2024
AI may shake up PC and mobile SoC competition
DIGITIMES Research has issued its latest authoritative special report on AI chips, offering an in-depth analysis of various aspects of AI chips.