Samsung beware: As Intel Foundry (IF) is now collaborating with TSMC to accomplish an advanced packaging mission to meet customer's needs, it is aiming for something bigger.
Nvidia will hold a special China AI Day for the Chinese market at its GTC conference in March, inviting cloud computing and large language models (LLM) leaders from Baidu, Alibaba...
With the surge in demand for generative AI training over the past few quarters, Nvidia's performance has shown a significant leap, benefiting various supply chain players and emerging...
British AI chip startup Graphcore is rumored to be for sale, with the asking price estimated at US$500 million. Arm, SoftBank, and OpenAI are said to be among potential buyers.
SK Hynix is rumored to be establishing an Artificial Intelligence (AI) semiconductor alliance with TSMC, investing in the development of next-generation high-bandwidth memory (HBM)...
Nvidia is reportedly considering offering ASIC services, a development that could potentially affect Broadcom and Marvell, among others, according to industry sources in Taiwan.
Nvidia's many customers, including Open AI CEO Sam Altman, are trying to find ways to cut dependency on its AI chips. While specialists have pointed out that Altman's lack of understanding...
SMIC is said to have set up a new semiconductor production line in Shanghai and hopes to utilize its existing US and Dutch manufacturing facilities to mass-produce Huawei HiSilicon's...
Jensen Huang, Nvidia's founder and CEO, will make a keynote address at the forthcoming GPU Technology Conference (GTC) in mid-March 2024. Given its high level of sponsorship, the...
Intel's latest moves are getting the attention of Samsung: Intel accelerated its development of the 2nm process and was the first to purchase High-NA extreme ultraviolet (EUV) lithography...
Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
Long-term prospects are bright for advanced packaging technology, thanks to robust demand for AI and HPC chips, according to sources at backend houses.
