TSMC and UMC will see full capacity utilization for 22/28nm processes persist at least throughout 2022, as their capacities vacated by some consumer chip clients are soon filled by...
IC substrate maker Kinsus Interconnect Technology saw its net profits for second-quarter 2021 shoot up 202% on year to NT$1.01 billion (US$36.1 million), thanks to substantial improvements...
Despite AI (artificial intelligence) technologies and applications still at a nascent development stage, global tech giants have rushed to invest heavily in making strategic deployments...
The growing level of automobile digitalization, especially advances in IoV technologies, is introducing booming opportunities for automotive electronic devices and parts and this...
In just the first half of 2015 alone, announced semiconductor acquisition agreements had a combined total value of US$72.6 billion, which is nearly 6x the annual average for M&A...
TSMC chairman Morris Chang's remarks over the company and the semiconductor industry's business outlook have long served as a barometer for the capital market. But market response...
TSMC is dedicated to providing foundry services for logic IC providers worldwide, and mergers in the industry will have little impact on the foundry's operations, said company chairman...
Intel and Altera have jointly announced a definitive agreement under which Intel would acquire Altera for US$54 per share in an all-cash transaction valued at approximately US$16.7...
Altera and TSMC have produced an UBM-free (under-bump metallization-free) WLCSP (wafer-level chip scale package) technology for Altera's MAX 10 FPGA products, according to the comp...
A recent Wall Street Journal report quoted unnamed sources as saying that Intel is in talks to buy Altera. IHS has published its research notes on Intel's potential acquisition...
Altera has announced the availability of non-volatile MAX 10 FPGAs, Altera's latest addition to its Generation 10 portfolio. Using TSMC's 55nm embedded flash process technology, MAX...
Altera and Taiwan Semiconductor Manufacturing Company (TSMC) have signed a cooperation deal that will bring TSMC's patented, fine-pitch copper bump-based packaging technology to Altera's...