Semiconductor materials supplier Topco Scientific is keenly promoting the use of new materials for CoWoS and other advanced packaging technologies, confident in its operations and...
According to sources in the notebook industry, customer orders have not experienced a significant increase, suggesting a potentially sluggish second half of this year. Nevertheless,...
SK Hynix has reportedly begun procuring production equipment for its M16 plant in Icheon, aiming to boost its monthly production capacity from 100,000 to 180,000 units, an increase...
Backend house ChipMOS Technologies expects its capex-to-revenue ratio to rise from 15% to 20% in 2024, with increased investment in upgrading memory testing capabilities and adding...
Zhen Ding Technology, a Taiwan-based flexible PCB and IC substrate supplier, has seen the development of its new plant in Thailand progress more smoothly than anticipated. The plant...
TSMC has been placing large volumes of orders for production equipment and factory engineering projects in support of its fast capacity expansion, dispelling skepticism about the...
China's leading foundries, SMIC and Hua Hong Semiconductor, have seen their newly added 12-inch production capacity fully utilized, absorbing a surge in domestic orders.
The semiconductor foundry industry's first-half results and second-half outlook reveal a growing divide between the dominant players and those struggling to keep up. As expected,...
Chang Wah Electromaterials Inc. (CWE), a leading semiconductor materials and distribution company based in Taiwan, recently held a board meeting where the promotion of General Manager...
SMIC held an earnings call on August 9, saying that demand for consumer electronics was improving, and smartphone makers were building their inventories. Its customers placed orders...
PCB firm Dynamic Holding anticipates modest demand growth in the third quarter of 2024, with promising demand prospects for high-density interconnect (HDI) boards.
TSMC Chairman C.C. Wei is set to lead the groundbreaking ceremony for the European Semiconductor Manufacturing Company (ESMC) in Dresden, Germany, on August 20, 2024.
SEMI Japan president Masayuki Hamajima recently called for the semiconductor industry to unify packaging technology standards as soon as possible, particularly in the advanced packaging...
Reports indicate that China's DRAM leader ChangXin Memory Technologies (CXMT) is actively investing in high bandwidth memory (HBM) production capacity. Currently, CXMT is establishing...
