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Wednesday 5 August 2026
Cloud AI chipmakers race to secure capacity with long-term deals
Cloud AI chip demand remains exceptionally hot, forcing chipmakers to put advanced-node capacity at the top of their agenda. IC design firms say technical strength and cost are no...
Wednesday 5 August 2026
US dominates world's largest AI data centers as China places three in global top 60
The global race to build AI data centers is accelerating. According to Epoch AI's latest AI Data Centers report, more than 60 hyperscale AI data centers have either entered operation...
Wednesday 5 August 2026
Research Insight: Samsung indicates diversification in AI memory demand, LTA reshapes supply
Samsung Electronics' memory business was the clear focus of its second quarter 2026 earnings call, accounting for about one-third of the Q&A session. DIGITIMES Intelligence said...
Wednesday 5 August 2026
Aurona lifts ABF and CCL shipments, eyes capacity expansion in 3Q26

Aurona said shipments of ABF substrate pads and CCL-related packaging materials both rose, extending its growth momentum in the second...

Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing...
Tuesday 4 August 2026
Wistron backs Taiwan's sovereign AI effort with 2.4 million computing hours

Wistron will provide 2.4 million hours of AI computing capacity in 2026 and support Taiwan's first open-source language model for three...

Tuesday 4 August 2026
Onsemi details AI data center momentum, pricing strategy in Q2 earnings call

Onsemi's leadership fielded a wide range of investor questions following the company's second-quarter 2026 results, with much of the...

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...

Tuesday 4 August 2026
Kinsus boosts spending as global IC substrate supply stays tight
Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers...
Tuesday 4 August 2026
Interview: Topco Scientific expands to Fukuoka signaling chip regionalization

Topco Scientific is expanding in Japan and other markets to support a global semiconductor buildout that is reshaping supply chains...

Tuesday 4 August 2026
2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

Tuesday 4 August 2026
Interview: Rising material costs and FOUP shortages threaten semiconductor supply chains
AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO...
Tuesday 4 August 2026
SK hynix Unveils First HBF Standard Specifications with Sandisk

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

Tuesday 4 August 2026
J&V Energy buys BlackRock's 187MW solar portfolio, doubling annual power output

J&V Energy announced on August 3, 2026, that it had completed the acquisition of a portfolio of operational solar projects in Taiwan...