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Tuesday 4 August 2026
SK Hynix, Sandisk release first HBF specs with up to 512GB and 3TB/s bandwidth
SK Hynix and Sandisk released the first standard specifications for High Bandwidth Flash (HBF) on August 4, defining a NAND-based memory technology with a capacity of up to 512GB and...
Tuesday 4 August 2026
China's chip output jumps nearly 350% in a decade as semiconductor supply chain expands
China's industrial enterprises above the designated size produced 484.28 billion integrated circuits in 2025, up nearly 350% from 108.72 billion in 2015, as the country expanded manufacturing...
Tuesday 4 August 2026
Wistron backs Taiwan's sovereign AI effort with 2.4 million computing hours

Wistron will provide 2.4 million hours of AI computing capacity in 2026 and support Taiwan's first open-source language model for three...

Tuesday 4 August 2026
Onsemi details AI data center momentum, pricing strategy in Q2 earnings call

Onsemi's leadership fielded a wide range of investor questions following the company's second-quarter 2026 results, with much of the...

Tuesday 4 August 2026
CXMT reportedly weighs second Beijing DRAM fab as Chinese cities compete for memory chip investment

China's leading DRAM maker ChangXin Memory Technologies (CXMT) is considering building a second 12-inch memory chip fabrication plant in...

Tuesday 4 August 2026
Kinsus boosts spending as global IC substrate supply stays tight
Kinsus said stronger second-quarter results and fresh capital spending reflect continued strain in the global IC substrate market, where demand from AI, CPU, GPU, and ASIC customers...
Tuesday 4 August 2026
Interview: Topco Scientific expands to Fukuoka signaling chip regionalization

Topco Scientific is expanding in Japan and other markets to support a global semiconductor buildout that is reshaping supply chains...

Tuesday 4 August 2026
2027 memory capacity reportedly sold out as buyers quietly lock in supply

Tight memory supply is expected to persist into 2027, with industry sources saying manufacturers have already completed much of their...

Tuesday 4 August 2026
Interview: Rising material costs and FOUP shortages threaten semiconductor supply chains
AI-driven demand, new fab construction, and conflict-led raw material inflation are combining to squeeze semiconductor suppliers in 2026, according to Topco Scientific Co. senior CEO...
Tuesday 4 August 2026
SK hynix Unveils First HBF Standard Specifications with Sandisk

SK hynix Inc. (or "the company", www.skhynix.com) announced today in collaboration with Sandisk that it has unveiled the first standard specifications for High Bandwidth...

Tuesday 4 August 2026
J&V Energy buys BlackRock's 187MW solar portfolio, doubling annual power output

J&V Energy announced on August 3, 2026, that it had completed the acquisition of a portfolio of operational solar projects in Taiwan...

Tuesday 4 August 2026
Montage brings CXL 3.2 memory expansion to AI data centers with Samsung, SK Hynix support

Montage Technology has begun pilot production of what it says is the industry's first CXL 3.2 memory expansion controller, targeting...

Monday 3 August 2026
Coretronic's OLED and auto-display gains point to steadier growth as NB weakens
Coretronic said its OLED monitor business is gaining traction as new production lines ramp up, while car displays continue to expand. The company expects full-year OLED monitor shipments...
Monday 3 August 2026
CXMT closes in on LPDDR6 mass production, challenging Samsung, SK Hynix
CXMT is nearing the end of research and development validation for LPDDR6, bringing it closer to mass production of next-generation mobile DRAM and intensifying competition with Samsung...
Monday 3 August 2026
AI infrastructure orders extend PCB expansion race
Global demand for AI infrastructure is rising, and as order visibility improves, the PCB supply chain has launched a marathon of factory expansion. Upstream copper-clad laminate (CCL)...