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Friday 18 September 2026
LGES, Samsung SDI reportedly booked out for two years as US restrictions and China slowdown reshape ESS market
As energy storage system (ESS) battery orders continue to accumulate at South Korean manufacturers, expectations are growing that market conditions could improve further. The outlook...
Friday 18 September 2026
Chip equipment makers face waits of up to 40 months for critical parts
The semiconductor industry's capacity crunch is moving deeper into the equipment supply chain, with shortages of specialized components stretching delivery times as chipmakers accelerate...
Friday 18 September 2026
Mobile SoC battle for 2026 centers on NPUs

More technical details on 2026 mobile systems on a chip (SoCs) from major vendors are emerging, and the biggest changes in chips such...

Friday 18 September 2026
Micron: AI memory crunch rewrites the market with long-term deals and custom designs
As the AI boom spreads from data centers to edge devices and robotics, Micron Technology executives are warning that memory has become a core bottleneck determining the upper limits...
Friday 18 September 2026
GlobalFoundries, Marvell expand SiGe capacity deal for AI optical connectivity

GlobalFoundries (GF) and Marvell Technology have expanded a multi-year agreement to increase production capacity for silicon germanium...

Friday 18 September 2026
Rumored Japan-US chip plant talks test whether two former chipmaking giants can rebuild at home

If the project under discussion goes ahead, it would be the first time Japan's US$550 billion tariff-linked investment pledge is directed...

Friday 18 September 2026
Z.ai's next growth engine starts where compute scarcity ends

Chinese AI developer Z.ai has raised its 2026 year-end annual recurring revenue (ARR) target by 25% to US$3 billion after fresh financing...

Friday 18 September 2026
FIT hedges its AI optics bets with Corning EBO, TSMC co-packaging talks

Foxconn Interconnect Technology (FIT) chairman Sidney Lu said AI demand remains strong, with overall capacity near full utilization...

Friday 18 September 2026
Nan Ya accelerates AI materials shift with major capacity expansion

Nan Ya Plastics is speeding up its transformation in electronic materials as cloud service providers expand capex at a rapid pace, making...

Thursday 17 September 2026
SK Hynix looks beyond HBM as inference workloads diversify
SK Hynix is expanding its memory strategy beyond the conventional GPU-HBM pairing as inference workloads split between latency-sensitive services and capacity-heavy, long-context a...
Thursday 17 September 2026
Samsung bets on zHBM as 2.5D memory nears its limits
Samsung Electronics is betting on vertically stacked zHBM to move memory beyond the physical constraints of conventional 2.5D architectures, setting a system-level target of raising...
Thursday 17 September 2026
CXMT cashes in on the DRAM shortage — and takes aim at HBM
ChangXin Memory Technologies (CXMT) is emerging from the memory shortage with sharply higher profits and greater pricing power, giving China's largest DRAM maker more resources to...
Thursday 17 September 2026
Memory LTAs lock up 50-70% of capacity
The memory industry remains in short supply, and major chipmakers are raising the share of capacity committed to long-term supply agreements (LTAs) while extending their duration from...
Thursday 17 September 2026
Ardentec, Sigurd race into silicon photonics TIA testing as US client books capacity
The global optical communications module market continues to grow, and Taiwan's test and packaging companies are moving to capture demand in silicon photonics (SiPh) transimpedance...
Thursday 17 September 2026
Huawei Connect 2026: OceanStor M900 turns PB-scale KV cache into Huawei's next AI infrastructure layer

Huawei has unveiled the OceanStor M900 at Huawei Connect 2026, extending its AI infrastructure strategy into memory and storage with...