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Monday 13 July 2026
Samsung develops glass interposer as TSMC expands packaging capacity

Samsung Electronics and Samsung Display are jointly developing a next-generation glass interposer that could lower the cost of packaging...

Monday 13 July 2026
Taiwan's auto parts makers pivot to high-tech as AI cooling, chip equipment demand surges

Taiwan's automotive parts makers are accelerating their transformation into high-tech suppliers as the global expansion of advanced...

Monday 13 July 2026
Pegatron June revenue rose 15.9% on server shipments and AI expansion
Pegatron reported June revenue of NT$91.296 billion (US$28.43 billion), up 15.9% year over year and down 4.9% from May, as shipments increased on the gradual rollout of its new server...
Monday 13 July 2026
China's 2030 target for 30% NEV adoption raises the stakes for foreign automakers

China is tying its climate agenda more closely to industrial policy. The State Council's newly released Action Plan for Carbon Peaking...

Monday 13 July 2026
Leadsun pursues strategic partnerships as Xiangyin targets top-tier power retail status
Taiwanese renewable energy developer Leadsun Greentech said that as global supply chains continue to move toward net-zero carbon emissions and RE100 commitments, and Taiwan's semiconductor...
Monday 13 July 2026
Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

Monday 13 July 2026
Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total...
Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
Monday 13 July 2026
Arm CEO: AI agents to drive CPU demand as infrastructure shifts beyond GPUs
GPUs have dominated AI infrastructure discussions over the past two years, powering everything from large language model (LLM) training and inference clusters to high-bandwidth memory...
Monday 13 July 2026
Western automakers tap defense manufacturing to absorb idle capacity as military spending surges
Global automakers are accelerating their expansion into defense manufacturing as geopolitical tensions fuel record military spending and persistent challenges in the automotive sector...
Monday 13 July 2026
Column: Steel industry shifts from capacity to performance

As infrastructure upgrades, rail decarbonization, and the reshaping of critical materials supply chains accelerate, the steel industry...

Sunday 12 July 2026
Column: Compute is no longer the AI bottleneck. Memory is — and suppliers know it
After the semiconductor index nearly doubled in the first half of 2026 before a sharp pullback, the central question is whether the industry's AI-driven growth cycle has already peaked...
Sunday 12 July 2026
InP supply crunch leaves South Korea exposed
Coherent has agreed to prepay AXT US$22.3 million under a three-year agreement for committed 6-inch indium phosphide substrate capacity, showing how buyers are moving to reserve future...
Friday 10 July 2026
China recovers Long March 10B booster in reusable rocket milestone
China marked a major step in rocket reusability on July 10, 2026, after successfully recovering the first-stage booster of its Long March 10B rocket following an orbital launch mis...