CONNECT WITH US
NEWS TAGGED CAPACITY
Tuesday 10 November 2026
Nvidia, SPIL target CPO volume shipments in 2027
AI infrastructure investment is accelerating the shift toward optical connectivity, as rising data-center traffic exposes the power and bandwidth limits of conventional electrical...
Tuesday 10 November 2026
AI boom drives photomask outsourcing despite IP fears, Tekscend says
Memory chipmakers have long been reluctant to outsource sensitive photomask production over intellectual property concerns, but growing artificial intelligence (AI) demand and capacity...
Tuesday 10 November 2026
Winbond to run Infineon flash unit as independent, fabless Spansion brand
Winbond Electronics will revive the Spansion brand for the NOR Flash and F-RAM business it is buying from Infineon Technologies and run it as a fully independent, fabless company,...
Tuesday 10 November 2026
Singapore fab set to drive VIS growth as AI interposers reshape output
Vanguard International Semiconductor (VIS) said its Singapore wafer fab is expected to become a growth driver in 2027, with capacity nearly sold out, customer commitments secured,...
Tuesday 10 November 2026
AI demand points to tighter capacity, higher prices at Taiwanese foundry service Vanguard
Vanguard International Semiconductor expects utilization of its 8-inch mature-node fabs to exceed 90% in the fourth quarter of 2026, as AI data center demand lifts orders for power...
Tuesday 10 November 2026
Infineon bets on 800V DC for megawatt AI racks
Rising power demand at AI data centers is driving demand for power semiconductors used in server power supplies, grid equipment, and chip-level power delivery. Infineon Technologies...
Tuesday 10 November 2026
Automotive component maker PMX doubles semiconductor revenue share to 20%
Automotive powertrain and safety component maker Global PMX reported 3Q26 consolidated revenue of NT$2.417 billion (US$73.76 million), up 5.87% quarter-on-quarter and 24.59% year-on-year...
Tuesday 10 November 2026
Lens Technology to start glass substrate pilot line by year-end, eyes Korean chipmakers
China's Lens Technology plans to build and operate its first through-glass via (TGV) glass substrate pilot line by the end of 2026 and is seeking partnerships with South Korean semiconductor...
Monday 9 November 2026
Musk targets 3Q27 launch for Nvidia-powered space data centers, massive scale by 2029
On November 7, local US time, Elon Musk appeared remotely at the 33rd Baron Investment Conference in New York. During an hour-long conversation with Baron Capital founder Ron Baron,...
Monday 9 November 2026
Samsung, SK Hynix race to secure EUV tools as ASML warns of shortages
Samsung Electronics and SK Hynix are competing to secure extreme ultraviolet (EUV) lithography equipment from ASML as the Dutch supplier warns that its planned capacity will fall short...
Monday 9 November 2026
Chang Wah Technology holds high utilization, boosts China investment
Chang Wah Technology reported October consolidated revenue of NT$1.715 billion (US$52.2 million), up 0.09% month-over-month and 50.83% year-over-year, as demand remained strong despite...
Monday 9 November 2026
Musk's Terafab reportedly targets memory output on par with Samsung's DRAM capacity
Terafab, the chipmaking venture backed by Tesla and SpaceX, is reportedly planning memory output that would rival the world's largest DRAM maker. Japanese and Korean equipment and...
Monday 9 November 2026
In US-China AI data center race, America's 118 GW capacity forecast faces China's rapid expansion by 2030
Surging demand for AI computing is accelerating data center construction in both the US and China, although the US is expected to retain a substantial lead in installed capacity through...
Monday 9 November 2026
Microsoft reportedly phasing out Oracle compute, reassessing cloud deals
Microsoft is phasing out a rented compute capacity agreement with Oracle after deciding not to renew a contract with the cloud provider. The separation is a part of a larger rethinking...
Monday 9 November 2026
Commentary: AI investment doubts rise, but chip demand keeps surging
Concerns over an overheating AI market have resurfaced, fueled by delays in data center construction, power and permitting bottlenecks, and the potential deferral of hundreds of billions...