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Thursday 15 October 2026
US urges chipmakers to use domestic capacity as CHIPS Act strategy shifts from fab subsidies to securing orders
Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...
Thursday 15 October 2026
ASML holds back 2029-2030 orders and confirms first price increases as EUV shortage deepens
ASML, the sole supplier of extreme ultraviolet (EUV) lithography tools, has shifted from taking orders to allocating them. On its third-quarter 2026 earnings call on October 14, the...
Thursday 15 October 2026
LEO satellite boom strains supply chain amid AI data-center demand
The global race to build low Earth orbit (LEO) satellite constellations is intensifying, but the massive deployment requirements are straining the aerospace supply chain. As AI data...
Thursday 15 October 2026
ProLogium targets AI data centers, aviation with solid-state batteries
ProLogium Technology is accelerating the development of non-automotive markets for its all-solid-state batteries, targeting AI data centers, aviation, and humanoid robots as electric...
Thursday 15 October 2026
Each 1% tariff hike could add US$3.5B to US fab costs, SIA warns
The Semiconductor Industry Association (SIA) urged the Trump administration to reduce tariffs on imported semiconductor materials and equipment, warning that higher costs could undermine...
Thursday 15 October 2026
Samsung, SK Hynix stand to benefit as humanoid robot DRAM demand is forecast to jump 20-fold by 2030
Global DRAM demand for humanoid robots is projected to increase more than 20-fold by 2030 as robot deployments expand and memory capacity per unit doubles, potentially opening a new...
Thursday 15 October 2026
Nvidia's Rubin expected to use mostly 12-layer HBM4 despite reported 8-layer shift
Nvidia's next-generation Rubin AI accelerators are expected to rely predominantly on 12-layer HBM4 high-bandwidth memory, despite reports that the chipmaker has asked Samsung Electronics...
Thursday 15 October 2026
GlobalFoundries wins US$21 billion US-Japan deal to build, operate two New York fabs
GlobalFoundries' selection to run two Japan-funded chip plants in New York tests a new way of paying for American fabs: governments own the factory and its tools, and the chipmaker...
Thursday 15 October 2026
Lite-On unveils 800 VDC power and liquid cooling for AI data centers
Lite-On Technology is showcasing an 800 VDC power architecture, NVIDIA Vera Rubin-compatible power racks and integrated liquid-cooling systems at the 2026 Open Compute Project (OCP)...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Fujifilm to expand Arizona semiconductor materials output
Fujifilm is expanding semiconductor materials production in Arizona as global chip demand rises, especially for artificial intelligence, advanced logic, and memory. The move aims to...
Thursday 15 October 2026
Taiwan solar manufacturers turn to US market as domestic approvals stall, low-cost imports intensify
Taiwan's solar manufacturers are increasingly looking to the US market as slowing approvals for large-scale domestic solar projects, limited rooftop installation capacity, and competition...
Thursday 15 October 2026
Murata eyes earlier MLCC expansion as AI server demand surges
Murata Manufacturing is considering additional investment and an earlier expansion of multilayer ceramic capacitor (MLCC) capacity as demand from AI servers accelerates. The company...
Thursday 15 October 2026
Dell CEO urges AI growth without sacrificing safety
As AI investment continues to expand, concerns are mounting over whether capital spending can translate into real revenue and whether data center construction is becoming excessive...
Thursday 15 October 2026
Samsung Semiconductor Highlights 400+ Layer Flash Powering Agentic AI

The 5th GMIF Innovation Summit (Global Memory Innovation Forum 2026;GMIF2026), co-hosted by the Shenzhen Memory Industry Association and the School of Integrated...