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    AI demand driven structural chip shortage threatens auto industry
    56min ago
    Cmsemicon's MCU price hike signals end to price wars, Taiwan firms consider follow-up
    56min ago
    Taiwanese upstream firms question US investments profitability if gross margin fall under 50%
    56min ago
    Samsung foundry to see turnaround as Chinese clients return in 2026
    58min ago
    Analysis: Chip inflation is a major supply chain risk in 2026
    3h 0min ago
    China's AI path: Looking back at DeepSeek's one year anniversary
    3h 0min ago
    NEWS TAGGED CAPACITY
    Tuesday 27 January 2026
    Apple, Qualcomm rethink heavy reliance on TSMC as costs rise

    Even as TSMC retains a clear technological lead in advanced process nodes, Apple and Qualcomm are reassessing how heavily they rely...

    Tuesday 27 January 2026
    Nvidia pours US$2 billion into CoreWeave for AI infrastructure expansion
    Nvidia and cloud computing firm CoreWeave have announced an expanded partnership to build more than 5 gigawatts of AI "factories" by 2030, aiming to support the rapid growth of artificial...
    Tuesday 27 January 2026
    TSMC's capex surprise reveals blind spots in semiconductor forecasting
    TSMC's recently announced capex surpassed market expectations by US$6 billion to US$8 billion, driven by factors that analysts had previously overlooked, DIGITIMES analyst Luke Lin...
    Monday 26 January 2026
    Blue Origin's new satellite network eye enterprise and govt sectors
    Blue Origin announced plans to deploy TeraWave, a new satellite communication network designed to provide up to 6Tbps of global data transmission capacity, starting in the fourth quarter...
    Monday 26 January 2026
    Pegatron eyes triple-digit AI server growth in 2026, targets ASIC opportunities
    Pegatron is poised to continue its strong expansion in the artificial intelligence (AI) server market as it enters its fourth year, with expectations of sustaining triple-digit revenue...
    Friday 23 January 2026
    ASE Group's USI merges with EugenLight to expand silicon photonics module capacity in Vietnam
    ASE Group's co-packaged optics (CPO) strategy is close to complete. In addition to launching advanced packaging solutions that integrate optical engines (OE) and application-specific...
    Friday 23 January 2026
    TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
    TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price...
    Friday 23 January 2026
    TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
    TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
    Friday 23 January 2026
    Intel slows its most ambitious node—and signals where the real battle is for now
    Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
    Friday 23 January 2026
    HBF likely overtaking HBM market by 2038 as commercialization speeds up

    High-Bandwidth Flash (HBF) is likely to reach commercialization sooner than previously expected and could become a key technology supporting...

    Friday 23 January 2026
    NAND shortages help Phison to enter US server supply chain
    Severe NAND flash shortages driven by AI servers have emerged, but have become a growth opportunity for Phison Electronics. Company CEO K.S. Pua said that the shortage is enabling...
    Thursday 22 January 2026
    PSMC to upgrade DRAM processes as demand strengthens

    Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update...

    Thursday 22 January 2026
    Commentary: China's NPI edge comes under pressure
    Geopolitical uncertainty shows little sign of easing, driving continued adjustments across the global consumer electronics supply chain. In manufacturing, the industry is moving beyond...
    Thursday 22 January 2026
    Cloud ASIC shipments set to surge in 2026; memory capacity remains key risk
    2026 is shaping up as a breakout year for cloud application-specific integrated circuit (ASIC) shipments. Not only has Broadcom secured mass production projects with multiple major...
    Thursday 22 January 2026
    Nanya expects memory shortage through 1H27 amid surging demand
    Strong memory demand propelled Nanya's profits to soar in the fourth quarter of 2025, with president Pei-Ing Lee highlighting sustained AI and general server needs driving a robust...
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    BIZ FOCUS
    Jan 28, 08:00
    Ministry of Economic Affairs Launches 2026 Best AI Awards
    Wednesday 28 January 2026
    Lightmatter and GUC Partner to Produce CPO Solutions for AI Hyperscalers
    Wednesday 28 January 2026
    Seoul Business Agency Hosts Global Innovation Forum Showcasing Startup Ecosystem
    Thursday 22 January 2026
    MOSS Introduces an AI-Assisted DAW Built to Support Human Creativity
    Special Report
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook