Fan-out panel level packaging (FOPLP) is a promising semiconductor technology that has been attracting investments from Taiwan's supply chains, including IC foundries, OSATs, panel...
TSMC's CoWoS technology continues to scale, driven by strong demand from major clients such as Nvidia. Production capacity is projected to reach 75,000 units by 2025, with the persistent...
SK Hynix and Samsung Electronics are focusing on upgrading equipment, transitioning processes, and expanding high-bandwidth memory (HBM) packaging capacity instead of investing in...
Taiwan-based E-One Moli Energy (Molicel) has commenced shipments of backup battery units (BBU) to a major cloud service provider (CSP), according to parent company Taiwan Cement (T...
Korean memory vendors intend to promote LPDDR5 as the prevalent specification, which will necessitate a reduction in the output of LPDDR4 and LPDDR4X chips, according to industry...
Touch panel maker GIS posted a net loss of NT$73.86 million (approx. US$2.28 million) for the first three quarters of 2024, a marked improvement from the NT$1.8 billion loss a year...
According to findings from China's semiconductor think tank, ICwise, the US Department of Commerce's (DOC) recent sanctions differ slightly from previous measures.
The global semiconductor manufacturing industry demonstrated strong momentum in the third quarter of 2024, with all key industry indicators showing positive sequential increases for...
In the rapidly evolving landscape of global offshore wind energy, China has emerged as the undisputed frontrunner, while India is just beginning to explore this sector. Industry experts...
With the acceleration of Blackwell mass manufacturing, the capacity of HBM3E will greatly grow. According to industry estimates, after a twofold rise in HBM production in 2024, demand...
TSMC plans to more than double its CoWoS packaging production capacity to meet the surging AI server demand in 2025. Industry sources indicate that Nvidia will consume up to 60% of...
SSD sales have been buoyed by specifications upgrades, according to industry sources, while DRAM module sales have exhibited signs of weakness. In 2024, they predict that SSD sales...
Despite making progress in DDR5 power management IC (PMIC) development over the past two years, Taiwanese suppliers have seen limited revenue growth in this sector. This limitation...
Eternal Materials, a leading supplier of PCB upstream materials including dry film photoresists, acknowledges China's ongoing economic slowdown. Despite these challenges, spokesperson...
Driven by rising demand for chip-on-wafer-on-substrate (CoWoS) and other advanced packaging equipment, Taiwan-based semiconductor automation and wet process equipment maker Grand...
