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NEWS TAGGED CIS
Monday 21 June 2021
Smartphone components to see orders from Apple rise in 2H21
China's smartphone demand failed to gain as much momentum as expected during the Labor Day holidays, resulting in declines in smartphone component shipments in the second quarter,...
Thursday 17 June 2021
Tong Hsing to expand packaging capacity for automotive CIS
Backend house Tong Hsing Electronic Industries plans to expand production capacity in three phases for automotive CMOS image sensors (CIS), while Chinese peers are also enforcing...
Wednesday 9 June 2021
Apple to increase VCM orders starting June for new iPhones
Taiwan-based voice coil motor (VCM) suppliers expect order pull-ins from Apple to gradually turn strong starting from June as the US brand is expected to release its next-generation...
Friday 28 May 2021
ABF substrate suppliers see clear order visibility through 2023
Taiwan ABF substrate makers have been running their production lines at full capacity, with new orders unlikely to be fulfilled until 2023, according to industry sources.
Tuesday 25 May 2021
Taiwan testing houses gearing up for AiP, 3nm chips
Taiwan-based IC testing houses including King Yuan Electronics (KYEC), Sigurd Microelectronics and Ardentec have all kicked off R&D for more advanced 3nm-made chips, while also...
Monday 3 May 2021
TSMC ramping 28nm chip output despite cutback in orders from Sony
Despite weakened orders from Sony, TSMC still has been ramping up its 28nm chip output with plans to build additional production capacity at its Nanjing fab in China, according to...
Wednesday 28 April 2021
PTI to further expand DRAM backend capacity
Powertech Technology (PTI) plans to further expand production capacity for standard-type DRAM memory at its Xian plant in China to better serve major clients, according to the Taiwan-based...
Monday 26 April 2021
Tong Hsing to raise quotes for ceramic substrates later in 2Q21
Taiwan's backend house Tong Hsing Electronic Industries is set to raise quotes for ceramic substrates later in the second quarter of the year in response to increasingly strong demand...
Friday 9 April 2021
Backend houses see order visibility for CIS, sensor chips through 4Q21
Backend houses continue to enjoy strong demand for processing IP camera chips and CMOS image sensor (CIS) chips, with their order visibility clear through the fourth quarter of 2021,...
Friday 9 April 2021
IC and material distributors to embrace strong profit growth in 2021
Taiwan-based IC and material distributors are expected to see their profit growths this year outperform revenue increases, as shortages of IC parts and materials are sending prices...
Wednesday 7 April 2021
Strong sensor demand to buoy suppliers in 2021
Demand for CMOS image sensor (CIS) and other sensors is set to be robust this year, driven by a surge in demand for video conferencing, security surveillance and automotive electronics...
Friday 19 March 2021
Japan, Korea PCB makers shifting production focus to IC substrates
PCB makers in Japan and South Korea have been shifting production focus to IC substrates from segments of traditional multi-layer rigid boards and even higher-end HDI, flexible PCB...
Thursday 18 March 2021
Taiwan IC packaging-testing firms eyeing automotive CIS
As international design houses of smartphone-use CMOS image sensors (CIS) including Sony, Samsung Electronics, OmniVision and On Semiconductor have shifted 2021 business focus to...
Tuesday 16 March 2021
Backend firms to gain growth momentum from car chips till 3Q21
Taiwan's backend service firms will see their ratios of revenues from processing automotive chips ramp up through at least the third quarter 2021, according to industry sources.
Wednesday 10 March 2021
Taiwan OSATs post revenue increases in February
Taiwan-based OSAT providers including ASE Technology, King Yuan Electronics (KYEC) and Tong Hsing Electronic Industries have posted on-year revenue increases for February 2021, and...