CONNECT WITH US
NEWS TAGGED CIS
Tuesday 3 March 2020
VisEra to build new color filter plant to serve Sony
Color filter (CF) maker VisEra Technologies, a subsidiary of TSMC, will establish a new plant in Longtan, northern Taiwan and is eyeing new orders from Sony, according to industry...
Thursday 27 February 2020
CIS backend firm Tong Hsing to double capacity by end-2020
Taiwan-based Tong Hsing Electronic Industries, dedicated to backend services for CMOS image sensors (CIS), has disclosed plans to double monthly production capacity to 150,000-160,000...
Wednesday 26 February 2020
Demand for 8-inch wafer fabrication services stays robust
The supply of 8-inch wafer fabrication services remains tight, due to robust demand for fingerprint-on-display (FoD) solutions, CMOS image sensors and power management ICs, according...
Wednesday 19 February 2020
Driver IC backend houses expect demand to rebound in 2H20
Taiwan-based handset display driver IC backend specialists have seen customer orders slow down, with poor order visibility for the next several months, but they expect demand to rebound...
Wednesday 19 February 2020
CIS, chip resistor shortages emerging
The coronavirus outbreak in China has further tightened supply of CMOS image sensors (CIS) and chip resistors, with severe shortages set to surface and price hikes to follow, according...
Friday 14 February 2020
Xintec turns profitable in 2019, set to gain more from 3D DOE devices
TSMC-reinvested backend house Xintec will see little seasonality impact on its revenues for the first half of 2020 as robust packaging demand for DOE (diffractive optical element)...
Friday 7 February 2020
CIS, VCSEL makers see robust demand for ToF phone cameras in 2H20
Taiwan-based makers of CMOS image sensor (CIS) and VCSEL components are optimistic that multi-lens camera modules incorporating ToF (time of flight) sensing technology will be mass-adopted...
Monday 20 January 2020
Xilinx keen on developing AI-based FPGA chips for automotive use
US FPGA chips specialist Xilinx will step up development of self-adaptive AI chips for automotive applications based on the emerging concepts of Mobility as a Service (MaaS) and Transportation...
Tuesday 14 January 2020
OmniVision set to raise quotes for diverse CIS devices by 10-40%
OmniVision Technologies will raise its quotes for various CMOS image sensors (CIS) by 10-40% in 2020 to counter ever-expanding demand for application to handsets, notebooks, smart...
Wednesday 8 January 2020
SK Hynix unveils PCIe NVMe SSDs
At the ongoing CES, SK Hynix has unveiled its PCIe NVMe consumer SSD series. The drives are built with SK Hynix' 128-layer 4D NAND flash, just six months after the company announced...
Wednesday 8 January 2020
OmniVision to raise CIS prices to reflect tight supply
OmniVision will revise upward by as much as 20% its quotes for high-resolution CMOS image sensors for use in consumer devices due to tight supply, according to industry sources.
Friday 3 January 2020
KYEC starting 2020 with robust test orders for 5G, AI, CIS chips
Taiwan-based testing house King Yuan Electronics (KYEC) is expected to see its first-quarter 2020 revenues hit the highest record ever for the same quarter with monthly revenues to...
Monday 30 December 2019
Highlights of the day: Taiwan CIS packagers to merge into heavyweight player
Two major Taiwan-based CMOS image sensor packagers Tong Hsing and Kingpark have agreed a merger deal that will make turn them into one of the world's largest packaging firms for the...
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Thursday 26 December 2019
Xintec profit soars in November
Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....