Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...

King Yuan Electronics (KYEC), Kingpak Technology and GEM Services are expected to see their sales growth exceed the seasonal average in the first half of 2019, outperforming their...

Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...

CMOS image sensor (CIS) backend service provider Kingpak Technology is expected to enjoy revenue growth of 10-15% in 2019 with higher profits than year-ago levels, according to market...

Shipments of Android-based smartphones featuring 3D sensing technology are set to boom in 2019, propelled by the increasing adoption of back-end time-of-flight (ToF) sensor solutions,...

Taiwan-based foundries including Vanguard International Semiconductor (VIS), Episil Technologies and Mosel Vitelic will continue to enjoy brisk demand for power discrete semiconductors...

CMOS image sensor (CIS) backend service provider Kingpak Technology is on track to complete building new production capacity for automotive applications by mid 2019, according to...

The market for CMOS image sensors is expected to see robust growth in 2019, thanks to brisk demand for multi-lens handsets, cars equipped with ADAS capabilities, and security control...