CMOS image sensor (CIS) packaging specialist Kingpak Technology has reported consolidated revenues of NT$205 million (US$6.8 million) for October 2019, surging 30% sequentially and...

Sony and Samsung Electronics have been competing head to head in the CMOS image sensor (CIS) market in order to maintain their leadership, using their respective technology advantages,...

STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M,...

Taiwan-based Holtek Semiconductor has developed its first AI chip solution to tap smart living application opportunities and has also launched a spate of new MCU products for automotive,...

Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.

The semiconductor supply chain is eyeing the robust demand from 5G commercialization. IC designers are designing chips supporting 5G, and in turn their backend partners are also gearing...

CMOS image sensor suppliers Sony and OmniVision have both enjoyed robust demand for multi-camera smartphones from Huawei, with their regional distributors and backend suppliers being...

Tong Hsing Electronic Industries, which supplies ceramic substrates as well as packaging services for CMOS image sensors and other niche ICs, expects its revenues to pick up sequentially...

CMOS image sensor (CIS) packaging specialist Xintec has put increased focus on high-profit segments of healthcare, industrial control and automotive CIS applications, and expects...

SK Hynix saw its operating profits fall 89% from a year earlier to KRW638 billion (US$540.8 million) in the second quarter of 2019, when consolidated revenues slid 38% on year to...

Foxconn Technology Group is likely to kick off construction of a 12-inch wafer fab in 2020 in Zhuhai, southern China in cooperation with the city government there, and will operate...

Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...

Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.

Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...

GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...