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NEWS TAGGED CIS
Monday 30 December 2019
Tong Hsing, Kingpak to merge into heavyweight CIS packager in Taiwan
A heavyweight CMOS image sensor (CIS) packaging firm will be born in Taiwan soon, as Tong Hsing Electronic Industries, a handset CIS backend and wafer reconstruction specialist, has...
Thursday 26 December 2019
Xintec profit soars in November
Niche-market IC packaging house Xintec has disclosed its net profit surged 252% from a year ago to NT$74 million (US$2.46 million) in November 2019. EPS for the month came to NT$0....
Tuesday 24 December 2019
ASE, VisEra to enjoy robust demand for in-display fingerprint sensors
ASE Technology and VisEra Technologies are both being pinpointed as among the backend houses set to enjoy robust demand for optical in-display fingerprint sensors, according to industry...
Thursday 12 December 2019
Highlights of the day: UMC enters Sony CIS supply chain
UMC's acquisition of Mie Fujitsu Semiconductor apparently has fulfilled two of its major strategic purposes: to expand its presence in the Japanese maket and the niche market. Through...
Thursday 12 December 2019
Backend firms to gain from robust high-spec auto CIS demand
Global makers of CMOS image sensors (CIS) are expected to embrace explosive demand for higher-specs CIS devices for application to autonomous vehicles in addition to handsets, which...
Thursday 12 December 2019
UMC enters supply chain for Sony CIS
United Microelectronics (UMC), through its takeover of Mie Fujitsu Semiconductor (MIFS), has entered the supply chain for Sony's CMOS image sensors, according to industry sources.
Tuesday 10 December 2019
Backend partners to gain from Sony CIS capacity expansion in 2020
Taiwan's CMOS image sensor (CIS) packaging specialists including Kingpak Technology, Xintec,VisEra Technologies and Tong Hsing Electronic Industries are expected to benefit significantly...
Tuesday 10 December 2019
TSMC obtains Sony orders for CIS, says report
TSMC has obtained orders for CMOS image sensors from Sony, and will fabricate the chips using 40nm process technology at Fab 14A in Tainan, southern Taiwan, according to a recent...
Tuesday 3 December 2019
Handset vendors keen on camera upgrades
Handset vendors are demanding significant upgrades to camera lenses, screens, image resolutions and APs seeking to stand out in an increasingly competitive market.
Friday 15 November 2019
Tong Hsing sees CIS packaging as major growth driver for 2020
Tong Hsing Electronic Industries, which supplies ceramic substrates and backend services for CMOS image sensors and other niche ICs, expects its 2020 revenues to hit a new high on...
Friday 8 November 2019
CIS packager Kingpak sees impressive revenue rise in October
CMOS image sensor (CIS) packaging specialist Kingpak Technology has reported consolidated revenues of NT$205 million (US$6.8 million) for October 2019, surging 30% sequentially and...
Tuesday 5 November 2019
Sony, Samsung competing head to head in CIS sector, Digitimes Research says
Sony and Samsung Electronics have been competing head to head in the CMOS image sensor (CIS) market in order to maintain their leadership, using their respective technology advantages,...
Wednesday 30 October 2019
STAr Technologies introduces MEMS micro-cantilever probe cards for CMOS sensor test
STAr Technologies Inc, a leading supplier of semiconductor test probe cards, today announced the introduction of its new MEMS type micro-Cantilever probe card - STAr Aries Sigma-M,...
Friday 18 October 2019
MCU maker Holtek releases AI chip solution
Taiwan-based Holtek Semiconductor has developed its first AI chip solution to tap smart living application opportunities and has also launched a spate of new MCU products for automotive,...
Monday 7 October 2019
Xintec eyeing return to profit in 2019
Niche-market IC packaging house Xintec is eyeing its return to profitability this year, according to industry observers.