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NEWS TAGGED CIS
Monday 24 June 2019
Yageo chairman takes helm of Tong Hsing
Tong Hsing Electronic Industries, which provides ceramic substrates and niche-IC backend services, has elected its new board of directors with Yageo chairman Pierre Chen becoming...
Thursday 23 May 2019
Himax develops AI-based visual sensor for notebooks
Himax Technologies has introduced its ultra-low power, AI-based visual sensor for notebooks, with the solution already certified by Quanta Computer.
Monday 20 May 2019
CIS packager Kingpak revenues for 2Q19 to see slight sequential fall
Taiwan's CMOS image sensor (CIS) packaging specialist Kingpak Technology is expected to see its second-quarter revenues fall only slightly on quarter as its average capacity utilization...
Wednesday 10 April 2019
Niche-IC backend specialists enjoy strong 1Q19
GEM Services, which specializes in packaging semiconductor power devices, and CMOS image sensor backend specialist Kingpak Technology both saw their revenues for the first quarter...
Tuesday 12 March 2019
Backend firms KYEC, Kingpak and GEM to see sales buck seasonal trends in 1H19
King Yuan Electronics (KYEC), Kingpak Technology and GEM Services are expected to see their sales growth exceed the seasonal average in the first half of 2019, outperforming their...
Wednesday 20 February 2019
IC packager Xintec expects revenues to pick up in 2Q19
Image sensor packaging specialist Xintec expects a significant sequential revenue pickup in the second quarter of 2019 due mainly to faster inventory adjustments at 3D sensor supply...
Tuesday 19 February 2019
CIS backend firm Kingpak to post 10-15% revenue growth in 2019
CMOS image sensor (CIS) backend service provider Kingpak Technology is expected to enjoy revenue growth of 10-15% in 2019 with higher profits than year-ago levels, according to market...
Wednesday 13 February 2019
Shipments of 3D sensing-enabled Android smartphones to boom, says Digitimes Research
Shipments of Android-based smartphones featuring 3D sensing technology are set to boom in 2019, propelled by the increasing adoption of back-end time-of-flight (ToF) sensor solutions,...
Thursday 17 January 2019
Taiwan foundries to enjoy brisk demand for power discretes
Taiwan-based foundries including Vanguard International Semiconductor (VIS), Episil Technologies and Mosel Vitelic will continue to enjoy brisk demand for power discrete semiconductors...
Thursday 10 January 2019
CIS backend firm Kingpak expects new capacity to arrive in mid-2019
CMOS image sensor (CIS) backend service provider Kingpak Technology is on track to complete building new production capacity for automotive applications by mid 2019, according to...
Thursday 20 December 2018
CIS demand set to grow robustly in 2019
The market for CMOS image sensors is expected to see robust growth in 2019, thanks to brisk demand for multi-lens handsets, cars equipped with ADAS capabilities, and security control...
Tuesday 11 December 2018
CIS backend firm Kingpak sees order visibility through 1H19
CMOS image sensor (CIS) backend service firm Kingpak Technology has seen its order visibility extend to the first half of 2019, and will see its capacity utilization rate rebound...
Tuesday 13 November 2018
CIS backend firm Kingpak sees revenues disappoint
CMOS image sensor (CIS) backend service firm Kingpak Technology saw disappointing October revenues, as clients' requests to defer some of their shipments reduced its production capacity...
Wednesday 31 October 2018
Kingpak ramping CIS packaging capacity
CMOS image sensor (CIS) back-end service firm Kingpak Technology is currently expanding its packaging capacity for the automotive segment with plans to increase it by 40% in 2019,...
Thursday 18 October 2018
CIS demand from handset, automotive sectors set to boom in 2019
CMOS image sensor demand (CIS) is set to boom for application to triple-lens camera phones and automotive electronics in 2019, prompting leading CIS maker Sony to expand capacity...