Silicon photonics (SiPh) has garnered significant business interest as a technology solution for high-speed data transfer in the era of AI. Currently, leading US chip manufacturers...
Taiwan's Ministry of Economic Affairs (MOEA) will launch the second phase of its subsidy program for domestic IC design houses in 2025, aimed at boosting their competitiveness against...
Samsung Electronics has launched a comprehensive overhaul of its advanced packaging supply chain, focusing on "reassessing" materials, components, and equipment to boost competitiveness...
The upcoming US policy focus on "high tariffs" and "Made in America" initiatives could significantly impact Taiwan's machinery exports while potentially creating new opportunities...
Taiwan has launched the "Defense Innovation Unit" to accelerate the development of dual-use military technologies, with a particular focus on drones and countermeasures. The initiative...
Development of drones and low-Earth orbit (LEO) satellites in Taiwan has been hindered by a lack of domestically developed chips, according to industry sources.
Amid challenges, Samsung has decided to scale back investments in its foundry business, prioritizing existing production lines to reduce losses and refocusing efforts on regaining...
Innolux has pledged to cut greenhouse gas emissions by 25% from 2020 levels by 2030, aligning with its carbon reduction goals. The company targets achieving a 20% renewable energy...
Samsung Electronics (Samsung) has implemented a significant personnel adjustment within its Device Solutions (DS) division to regain competitiveness in the semiconductor sector. This...
Samsung Electronics is bolstering its HBM competitiveness through significant investments in advanced packaging. Upgrades are underway at its Cheonan facility in South Korea, and...
In the digital economy, national-level computing power is a key indicator of global competitiveness, with countries like China, the US, and Europe vying for dominance. The advancement...
Samsung Electronics is reportedly set to launch high-capacity and high-heat-dissipation Bonding Vertical (BV) NAND Flash with more than 400 layers in 2026. This move aims to enhance...
In today's digital economy, the development of national-level computing power has become an important measure of global competitiveness. Computing power, as a pillar of digital infrastructure,...
Samsung Electronics has launched bold restructuring efforts to boost competitiveness, forming a business task force to enhance R&D and explore new business avenues, according...
Samsung Electronics' high-bandwidth memory (HBM) division, which has been struggling to regain competitiveness, is now glimpsing a potential revival. With AMD's latest AI accelerator...
