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Monday 14 October 2024
Samsung reportedly lowers HBM production target by 10%; reassigns R&D personnel to boost competitiveness
Samsung Electronics (Samsung) has confirmed delays in high bandwidth memory (HBM) supply, leading to a downward adjustment of its production target for 2025. To enhance semiconductor...
Friday 11 October 2024
Why the EU is imposing tariffs on Chinese EVs despite retaliation risk
The European Union (EU) has unleashed a powerful economic tool on China by imposing tariffs on electric vehicles (EVs), a move that increases the risk of retaliatory measures and...
Thursday 3 October 2024
Rapidus struggles to secure funding amidst 2nm chip ambitions
Rapidus, a Japanese semiconductor startup aiming to mass-produce 2nm chips by 2027, faces significant funding, technology, and market competitiveness challenges.
Friday 27 September 2024
Can Taiwan SiC industry grow its competitiveness?
Taiwan's silicon carbide (SiC) wafer foundry sector has received a confidence boost after Vanguard International Semiconductor (VIS), a specialty foundry affiliated with TSMC, announced...
Wednesday 25 September 2024
Samsung splits from Naver on AI accelerator project, pursues independent development
Samsung Electronics and Naver previously announced a collaboration to develop artificial intelligence (AI) accelerators for servers. However, recent reports suggest that the two companies...
Friday 20 September 2024
Samsung Display to expand Vietnam production base with investment up to US$1.8 billion
Samsung Display Vietnam (SDV) has announced plans to expand its production facility in Bắc Ninh Province, Vietnam, with an investment of up to US$1.8 billion in Yên Phong...
Friday 20 September 2024
TSMC demand boosts suppliers performance; smaller ones gain competitiveness
Benefiting from TSMC's performance in advanced processes and advanced packaging, related suppliers are also seeing their fortunes rise, further strengthening Taiwan's semiconductor...
Tuesday 10 September 2024
Advanced packaging focuses on CoWoS, 3D IC, and FOPLP at SEMICON Taiwan 2024
A major focus of SEMICON Taiwan 2024 that concluded last week was advanced packaging, with CoWoS, 3D IC, and FOPLP being the leading technologies. CoWoS has caught more attention...
Tuesday 3 September 2024
Broadcom's VMware acquisition: a strategic expansion with long-term synergy potential
Following Broadcom's acquisition of VMware, there has been significant interest in how the two companies will evolve and whether the merger will generate any notable synergy for the...
Monday 2 September 2024
Seoul Semiconductor confident in MicroLED patent portfolio
Seoul Semiconductor and its subsidiary Seoul Viosys recently released their financial results for the second quarter of 2024. CEO Chung-Hoon Lee emphasized the competitiveness of...
Wednesday 28 August 2024
How Kioxia going public may affect NAND leaders Samsung and SK Hynix
Kioxia, currently ranked third in the global NAND market, is reportedly set to go public in Japan in October 2024. The move aims to secure funds for R&D and production capacity...
Monday 12 August 2024
Hycon Tech's SiS acquisition fuels advanced chip development amid market shifts
IC design firm Silicon Integrated Systems (SiS)'s stock exchange agreement with Hycon Technology has drawn significant market attention. Hycon stated that post-merger, it will become...
Wednesday 31 July 2024
Gus Technology to set up EV battery plant in Indonesia to expand global reach
Gus Technology, a Taiwanese battery OEM and custom battery service provider, has announced plans to build an electric vehicle battery manufacturing plant in Indonesia. This move is...
Monday 29 July 2024
Samsung invests in AI chip startups DreamBig and Axelera AI
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
Monday 22 July 2024
SK Group's energy overhaul: SKI and SK E&S merge into US$72.5 billion powerhouse
South Korea's SK Group, previously considering a restructuring of its battery business, is now moving forward with a significant merger between SK Innovation (SKI) and SK E&S...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research