The global power management (PW) and driver IC market will experience a revenue decline of around 3% in 2009, mainly due to the current slowdown in consumer spending, IMS Research...
Ene Technology is optimistic about its LED drive ICs for decoration and lighting applications, whose sales proportion will increase to 10-15% in 2009, according to a Chinese-language...
Driver IC packaging and testing house Chipbond Technology's November sales were only NT$277 million (US$8.32 million), down 36% from October and lower than the company's breakeven...
Driver IC designers Novatek Microelectronics, Orise Technology and Raydium Semiconductor all have reported sharp sequential declines in November sales.
Despite that Taiwan IC designers are facing difficulties in the fourth quarter, sales of LED driver IC supplier Macroblock are still expected to stay flat from the third quarter....
With demand for large-size LCD panels remaining in the doldrums, driver IC designers are placing more emphasis on the small- to medium-size segment, according to industry sources.
Although Semiconductor distributor Niching Industrial has seen sales growth in 2008 thanks to strong shipments of memory module and memory card substrates, profits have declined due...
Driver IC supplier Orise Technology has reported October sales at NT$407 million (US$12.41 million), down 18.6% on month to mark the company's first sales decline since July. Another...
Driver IC packaging and testing houses Chipbond Technology, International Semiconductor Technology (IST), and ChipMOS Technologies will see their utilization rates drop to 55-60%...
Driver IC designer Novatek Microelectronics saw its revenues drop to NT$6.91 billion (US$260.49 million) in the third quarter from NT$7.24 billion in the second quarter, but margins...
Packaging and testing house International Semiconductor Technology (IST) has seen its utilization rate drop significantly because of weak demand from driver IC clients. The company...
Packaging and testing company ChipMOS Technologies has announced a downward adjustment in its third-quarter guidance to reflect the reduction in DRAM production and inventory adjustment...
Handset makers are preparing to launch more models for the second half of the year than in the first half, thanks to recovering demand, but the outlook for shipment volumes is still...
The recent large-size panel price drops are causing makers to heap more pressure on upstream component makers for additional cost downs. Component suppliers are at a disadvantage...
Chipbond Technology is facing stronger resistance from clients to its planned increases in driver IC packaging and testing quotes, as the LCD panel market is turning more conservative...
