ACM Research has received orders for wafer-level packaging equipment from a US-based customer and a leading US research center, according to the equipment manufacturer, which serves...
Zhen Ding Technology made its debut at SEMICON Taiwan 2024, where the company highlighted the expanding role of IC substrates in advanced semiconductor manufacturing.
Following the recent revelation that IBM had closed the intranet access for employees in its Chinese research and development and testing departments, on the morning of August 26,...
Despite the recent downturn in automotive chip demand, most Taiwan-based IC designers remain largely unaffected and continue to intensify their efforts in the market, according to...
US-based xMEMS Labs is set to deliver its newly unveiled XMC-2400 µCooling™, a single-chip (SoC) air-cooled all-silicon active cooling solution utilizing MEMS technology,...
After approving four IC backend manufacturing facilities earlier this year, India reportedly plans to provide more incentives for compound semiconductor and silicon photonics proje...
The global semiconductor manufacturing industry in the second quarter of 2024 continued to show signs of improvement with significant growth of IC sales, stabilizing capital expenditure,...
