SK Hynix's performance outlook in the High Bandwidth Memory (HBM) market has garnered optimism from South Korea's securities industry, driven by major customer orders from NVIDIA,...

Malaysia is fast becoming a semiconductor hub in Southeast Asia, with efforts being devoted particularly to expanding its advanced packaging, IC design, and AI sectors.

ASE Technology Holding (ASEH) recently announced that its subsidiary Advanced Semiconductor Engineering (ASE) will collaborate with Hung Ching Development & Construction to build...

President Xi Jinping called on China to step up innovation because other countries dominate certain key technologies, comments that underscore his nation's escalating semiconductor...

Intel Foundry's design ecosystem has hit a new milestone as key partners Ansys, Cadence, Siemens, and Synopsys release reference flows for Intel's Embedded Multi-die Interconnect...

To address the rising memory demand of the AI boom, Samsung is resuming the construction of its new Pyeongtaek plant 5 (P5), with construction beginning as early as the third quarter...

According to PR Newswire and Evertiq, SK keyfoundry has announced that it has secured key device characteristics for a 650V GaN High Electron Mobility Transistor...

Taiwan-based backend houses have seen demand for advanced packaging and testing services growing from the AI chip segment, which is expected to fuel sales growth in the second half...

ByteDance Ltd. and Broadcom Inc. have discussed a potential collaboration on an AI processor to help bolster the TikTok parent's development of that technology.

Samsung and Intel are trying to overtake TSMC, but TSMC chairman C. C. Wei's answer to that challenge is: "No way!"

Konrad Young, a pivotal figure in semiconductor research known for his leadership at TSMC told DIGITIMES Asia during his UK visit that quantum computing presents a prime...

Despite plateauing smartphone demands, OmniVision expects rising demands for CMOS Image Sensors (CIS) in AI PCs, automotive, and machine vision applications, says OmniVision.

As the industry heavily invests in High Bandwidth Memory (HBM) DRAM, market insiders predicted a supply shortage for general DRAM.

In recent years, Fan-Out Panel-Level Packaging (FOPLP) technology has become a rare opportunity for OSATs and other industry participants to compete with TSMC, Samsung Electronics,...

Even since the US imposed sanctions on China, South Korean manufacturers have been storing old equipment in warehouses, incurring annual rental fees exceeding KRW20 billion (approx...