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Thursday 25 June 2026
ASE sees AI demand stretching packaging capacity into 2030
ASE Holdings COO Dr Tien Wu said the global semiconductor industry is growing faster than expected on the back of AI investment, with demand so strong that the capacity the company...
Thursday 25 June 2026
TSMC-Amkor alliance jolts packaging map as ASE races to expand
The global semiconductor packaging and testing race is heating up as TSMC recently signed a 10-year agreement with Amkor to expand advanced packaging collaboration in Arizona, drawing...
Thursday 25 June 2026
Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
Thursday 25 June 2026
Chinese chip packaging giant JCET plans US$1.1b AI chip packaging plant
JCET Group is accelerating its AI chip packaging expansion with a CNY7.8 billion (US$1.1 billion) investment in a new advanced packaging and testing plant in Shanghai Lingang, strengthening...
Thursday 25 June 2026
China moves to build helium reserve as Nippon Sanso sets over 30% price hike

Global helium supply is under renewed strain. Nippon Sanso, Japan's largest industrial gas supplier, announced it will raise prices across...

Thursday 25 June 2026
TSMC 3nm lead times surpass one year as Samsung faces Intel in foundry push
As demand for AI chips surges, the battle for foundry orders is heating up. South Korean industry sources say the next 2-3 years will be a critical period for Samsung Electronics'...
Thursday 25 June 2026
ByteDance's reported AI chip orders mark breakthrough for Chinese GPU maker Iluvatar CoreX
ByteDance's reported plan to purchase at least 50,000 AI inference chips from Shanghai-based GPU developer Iluvatar CoreX could become one of the most significant commercial wins yet...
Thursday 25 June 2026
IC design firms race to secure packaging capacity
IC design firms are scrambling to expand their partner networks as tight packaging and testing capacity remain the most pressing bottleneck in the supply chain. Companies in Taiwan,...
Thursday 25 June 2026
Techzone builds circular economy to tap rising semiconductor expansion demand
Techzone Technology Materials, a provider of one of Taiwan's few integrated waste treatment, renewable energy, and recycling solutions, is actively addressing the waste treatment demand...
Wednesday 24 June 2026
Global market for advanced chip packaging set for rapid expansion
The market for fan-out panel-level packaging(FOPLP) and glass substrate packaging is set to grow sharply as chipmakers race to support AI and high-performance computing. For global...
Wednesday 24 June 2026
Qualcomm, ByteDance talks signal new phase in China AI chip diversification
Qualcomm's reported talks to provide custom chip-design services to TikTok owner ByteDance show how China's AI chip supply chain is moving beyond a simple Nvidia replacement story.
Wednesday 24 June 2026
IBM targets Anderon venture to anchor quantum wafer supply
IBM is building a foundry to produce silicon wafers used in quantum-computing processors, seeking to become an indispensable part of the quantum economy under development. Called Anderon,...
Wednesday 24 June 2026
Samsung, SK Hynix weigh new Korean chip belt as concerns mount for Yongin cluster

South Korea's government is in talks with Samsung Electronics and SK Hynix over a potential new phase of large-scale semiconductor investments,...

Wednesday 24 June 2026
Samsung eyes Galaxy Ultra for 2nm Exynos 2700

Samsung Electronics' System LSI division is pressing its mobile business to expand adoption of the in-house Exynos 2700 processor beyond...

Wednesday 24 June 2026
Former SMIC CEO targets China photomask IPO after 12-inch wafer bet
Former SMIC CEO Tzu-yin Chiu is extending his semiconductor materials strategy into photomasks, one of the most critical upstream links in chip manufacturing. Guangzhou Xinrui Photomask...