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Friday 23 October 2026
Japan targets 2nm medical AI chip with IBM design, Rapidus eyed for foundry
Japan's Leading-edge Semiconductor Technology Center (LSTC), Hokkaido University, Fujifilm Corporation, GE HealthCare Japan, and imec announced a joint initiative in Tokyo on October...
Friday 23 October 2026
First chip-level device on the list: US FCC bans two devices with Huawei HiSilicon chips under new rule
The US Federal Communications Commission (FCC) has banned two electronic devices from entering the US market because both contain surveillance chips made by Huawei's HiSilicon. The...
Friday 23 October 2026
Samsung reportedly orders final tools for first Taylor fab as Texas site nears 2nm output cap
Samsung Electronics has ordered additional equipment to fill the remaining space at its first foundry fab in Taylor, Texas, a move that would lift the plant's 2nm capacity to 20,000...
Friday 23 October 2026
TSMC advances CoPoS packaging at Taoyuan Longtan site
TSMC's Longtan Science Park Phase 3 in Taoyuan is restarting after nearly three years of delays, with Taiwan's National Development Council approving its development plan on September...
Friday 23 October 2026
Rapidus courts US AI customers ahead of planned 2H27 2nm mass production
Rapidus chairman Tetsuro Higashi said the Japanese chipmaker remains broadly on track to begin mass production of 2nm chips in the second half of 2027. Winning customers remains a...
Friday 23 October 2026
FCC grants Intel a waiver to foreign robot ban to prevent chip disruptions
The US Federal Communications Commission (FCC) granted Intel a waiver to its ban on foreign-made mobile robots, which will allow it to update its fleet of autonomous guided vehicles...
Friday 23 October 2026
JCET's AI profit surge sets up US$2.73 billion advanced packaging expansion
JCET Group lifted third-quarter revenue 13.53% year-over-year to CNY11.43 billion (approx. US$1.71 billion) and net profit attributable to shareholders 59.99% to CNY773 million. For...
Friday 23 October 2026
US signs up to US$389 million in CHIPS R&D deals for power chips and fusion
The US Department of Commerce has signed letters of intent with four companies to provide up to US$389 million in federal research and development awards under the CHIPS and Science...
Friday 23 October 2026
Taiwan sits out global chip selloff, thanks to typhoon
Taiwan doesn't stop often. On Friday, October 23, Typhoon Champi made it stop.
Friday 23 October 2026
TSMC reportedly surveys suppliers on rare-earth-free motors as China's export-control pause nears legal expiry
The world's largest contract chipmaker is weighing whether the motors inside its factory-automation equipment can run without rare-earth magnets, a sign that China's grip on rare earths...
Friday 23 October 2026
Apple's iPhone Duo and touchscreen MacBook could accelerate OLED TDDI adoption
Apple's iPhone Duo has gone on sale, with pre-orders in several key markets reportedly exceeding the company's expectations. Delivery dates have stretched to late 2026 and even early...
Friday 23 October 2026
AI cuts chip R&D cycles to 9 months, says Etron chair
AI-driven growth will push the semiconductor industry past the US$1.6 trillion mark in 2026, while accelerating chip development cycles to one new product every nine months, Etron...
Friday 23 October 2026
Why is TSMC suddenly looking at Texas?
TSMC is scouting Texas for possible new US capacity, even as it builds out its advanced-process fabs in Arizona. Chairman C.C. Wei confirmed that a team has been sent to Texas to assess...
Friday 23 October 2026
Interview: TI sees liquid cooling shift to tray-level control in AI data centers
Liquid cooling in AI data centers is moving toward more granular control architectures. Patrick Zeng, general manager of data center thermal management at Texas Instruments (TI), told...
Friday 23 October 2026
Samsung Foundry targets automotive, edge AI chips with 8LPU+
Samsung Electronics' foundry business will extend its 8-nanometer process, now more than eight years old, into another generation with the launch of the second-generation 8LPU+ platform...