Chip-performance gains have long been driven by an industry-wide focus on shrinking transistor nodes and tightening integration. While major economies including the US and Taiwan have...
Micron Technology's revenue and profit for the fourth quarter of fiscal 2026 both beat expectations, and the company expects capacity supply to be even tighter in 2027 and 2028 than...
AI servers and advanced packaging continue to drive demand for semiconductor manufacturing, outsourced semiconductor assembly and test (OSAT), and equipment. Machvision said Advanced...
Chenming Electronic Tech (UNEEC) president Charles Lo said the fourth quarter is a traditional peak season and that new models such as VR200 will enter mass production in the fourth...
TSMC is reportedly weighing a new manufacturing campus in Texas that could add tens of billions of dollars to its US expansion, potentially creating a second major American production...
To address chip talent shortages, Taiwan has a law in place to promote industry-academia collaboration by establishing semiconductor schools. However, the current financing scheme...
JCET Group signed an agreement on September 29 for a high-end advanced packaging and testing project in Wuxi, Jiangsu Province. Wuxi municipal leadership pledged operational support...
Data center AI accelerator package power has climbed from about 500W in the A100 generation to roughly 3,500–4,000W for Rubin Ultra-class products expected in 2027, pushing supply...
AI-driven memory demand is surging, and Micron has recently accelerated capacity expansion across multiple regions worldwide, including Taiwan, the US, Japan, Singapore, and India...
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
National Taiwan University's Graduate School of Advanced Technology (GSAT) has expanded its semiconductor research capabilities with new process and measurement equipment, strengthening...
The race to commercialize advanced packaging is widening beyond traditional chipmakers and display panel makers. As fan-out panel-level packaging (FOPLP), through-glass via, and micro-LED...
Japan's three major power semiconductor makers — Rohm Semiconductor, Toshiba, and Mitsubishi Electric — have failed to complete integration talks on the original schedule,...
The Southern Taiwan Science Park (STSP) has approved the entry of three new companies—Fangsco, Nanya Technology, and South Korea's Hansol Chemical—pushing the park's cumulative...
Onsemi has amended its agreement to buy Synaptics in an all-cash deal, a move that could reshape semiconductor competition and affect global technology supply chains. The revised cash...
