China's AI chip race is pushing the semiconductor bottleneck into advanced packaging and testing, where HPC, HBM, Chiplets and domestic...

Hanmi Semiconductor has launched FC Bonder 3.5, a new flip-chip bonding tool for AI system semiconductor packaging, as the South Korean...

South Korea's plan to push semiconductor investment beyond the greater Seoul area is taking clearer shape, with Samsung Electronics reportedly...

Samsung Group is expected to announce a domestic investment plan worth more than KRW1,000 trillion (approx. US$648 billion) on June 29,...