Nexperia could eventually reunite its Chinese and international operations despite an unresolved control dispute with Chinese parent Wingtech Technology, acting CEO Stefan Tilger said...
Infineon Technologies told analysts that demand is no longer what limits its growth. On a November 10 call to discuss its fiscal 2026 results, the German chipmaker said orders for...
Ingentec’s consolidated revenue reached NT$1.329 billion (US$40.4 million) from January to October 2026, up 79.32% from the same period in 2025. However, October revenue fell...
Intel is expanding its CPU and GPU portfolio with the Intel GPU D-series, code-named Crescent Island, and next-generation Xeon processors, code-named Diamond Rapids, targeting large-model...
Charles Kau, chairman of IEMC, said TSMC "cannot make 3D DRAM," dismissing reports that the foundry is evaluating entry into the next-generation memory market at Nvidia's request....
Infineon Technologies ended fiscal 2026 with its strongest quarter ever, and the shape of the result says more than its size: profitability rose much faster than sales, and the German...
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...
Acer subsidiary Acer Synergy Tech benefited from sustained semiconductor industry growth, which drove demand for information technology (IT), operational technology (OT), and workforce...
DIGITIMES observed that Nvidia is advancing an optics-on-interposer (OOI) architecture that moves the optical engine from an organic substrate to a silicon interposer to increase interconnect...
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening...
Infineon Technologies AG said on November 9, 2026, that it has processed 300mm silicon carbide (SiC) wafers into functional power devices at its fab in Villach, Austria, which it described...
Jiangsu HISI Semiconductor (HISIGK) has prepared 14 automated lithography systems for delivery across 300mm, 200mm and 150mm wafer platforms, expanding its specialty semiconductor...
UK photonic integrated circuit (PIC) startup Wave Photonics is expanding in Asia and, despite partnerships with the Hon Hai Research Institute (HHRI) and Taiwan-based EDA companies,...
Driven by rising demand for AI, semiconductors, and automation equipment, Hiwin Technologies delivered strong results in the third quarter of 2026, with all three key profit margins...
