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Thursday 2 April 2026
Intel buyback signals shift beyond austerity as chipmaker regains confidence
Intel's US$14.2 billion buyback of its Ireland fab stake signals a shift beyond austerity, reflecting improved finances, renewed confidence in AI-driven CPU demand, and a strategic...
Thursday 2 April 2026
Top 10 Chart: Advanced packaging, not volume, drives OSAT shift as markets signal 2026 inflection

Taiwan's outsourced semiconductor assembly and test (OSAT) sector is entering 2026 with relatively modest revenue growth, but market behavior...

Thursday 2 April 2026
TSMC says COUPE platform set for production as Samsung outlines SiPh push

TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

Wednesday 1 April 2026
Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...
Wednesday 1 April 2026
SiPh and advanced packaging shine at Touch Taiwan
The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
Wednesday 1 April 2026
Nexchip applies for HK listing amid mature-node expansion
Chinese semiconductor foundry Nexchip has applied to list on the Hong Kong Stock Exchange's Main Board, Guandian.cn reported on March 31, as the company moves to consolidate...
Wednesday 1 April 2026
AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
Wednesday 1 April 2026
TSMC eyes SiPh breakthrough as industry consensus forms
TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
Wednesday 1 April 2026
India accelerates semiconductor push with Kaynes plant launch
India is stepping up its semiconductor ambitions as a new domestic plant begins production, underscoring efforts to build a resilient supply chain and position the country as a global...
Wednesday 1 April 2026
Nvidia moves beyond GPUs with three-system push to own the AI stack
At GTC 2026, Nvidia introduced three new systems simultaneously: the Groq LPX inference rack, the Vera ETL256 CPU rack, and the STX storage reference architecture. These launches extend...
Wednesday 1 April 2026
China's AI chip demand drives advanced foundry growth amid geopolitical split
Under a push to localize capacity, China's leading domestic foundries are well-positioned to leverage their home market and policy advantages to replicate TSMC's growth trajectory...
Wednesday 1 April 2026
Samsung's 2nm Exynos 2600 loses to Qualcomm's 3nm on battery and thermals
Samsung's Exynos 2600 application processor (AP), built on the company's 2nm process, lags in battery endurance behind Qualcomm's Snapdragon 8 Elite Gen 5 — a 3nm chip —...
Tuesday 31 March 2026
CEA-Leti bets on Taiwan fabs to turn Europe’s chip research into reality
Europe is tightening its semiconductor research links with Taiwan's manufacturing engine, with French research institute CEA-Leti positioning itself as a primary gateway between the...
Tuesday 31 March 2026
Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
Tuesday 31 March 2026
Samsung targets 1nm production by 2030, challenges TSMC with new chiplet technology
Samsung Electronics is aiming to launch its 1nm semiconductor process by 2030 as part of a direct technological competition with rival TSMC. The move seeks to secure leadership in...