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Thursday 16 April 2026
TSMC hints at next-gen LPU bid, stokes speculation that Samsung's Groq order may not last
TSMC Chairman C.C. Wei disclosed at the company's first-quarter 2026 earnings call that the foundry is collaborating with a customer on next-generation LPU development —a remark...
Thursday 16 April 2026
TSMC enters 2nm mass production, scales 3nm capacity
TSMC laid out its capacity expansion plans and advanced node progress at its first quarter 2026 earnings call. Chairman C.C. Wei reaffirmed Taiwan as the primary base for leading-edge...
Thursday 16 April 2026
TSMC guides over 15% 2Q26 revenue growth, N3 margins set to top average
TSMC posted a record profit of NT$572.48 billion (US$18.06 billion) in the first quarter of 2026, marking another high in overall performance. For the second quarter of 2026, TSMC...
Thursday 16 April 2026
Taiwan analog IC firms show varied 1Q26 revenue; motor control and DDR5 PMIC drive growth
Taiwanese analog IC companies have recently released their full revenue figures for the first quarter of 2026, revealing mixed performances. Firms with rapidly growing new businesses...
Thursday 16 April 2026
EZconn posts 200% profit surge in March as high-fiber count shipments boost growth
Optical communication manufacturer EZconn announced a net profit after tax of NT$312 million (US$9.9 million) for March 2026, marking a 200% increase year on year and earnings per...
Thursday 16 April 2026
TSMC lifts full-year outlook above 30% as AI demand powers another record quarter
Fresh off a quarter in which it beat its own margin forecasts by a wide margin, TSMC issued second-quarter guidance that signals the AI-driven chip boom is accelerating rather than...
Thursday 16 April 2026
TSMC 1Q26 earnings: AI demand sends profit up 58%, gross margin to all-time high
Taiwan Semiconductor Manufacturing Company (TSMC) reported a first-quarter 2026 revenue of US$35.90 billion, a 40.6% jump from a year earlier, as insatiable demand for artificial intelligence...
Thursday 16 April 2026
Tesla AI5 tape-out signals dual sourcing with Samsung, TSMC

Tesla has finalized the design of its next-generation AI5 chip, marking a milestone in its in-house semiconductor development. CEO Elon...

Thursday 16 April 2026
TSMC says Applied Materials and JSR form top-tier chipmaking team
Japanese materials giant JSR has established an advanced planarization process solution joint research center in Taiwan, with JSR representative director and CEO Hank Hori personally...
Thursday 16 April 2026
ASE Holdings to acquire Innolux Fab 5 for US$460 million

ASE Holdings has secured Innolux's Fab 5, with the company announcing on April 15 that its semiconductor unit's board had approved the...

Thursday 16 April 2026
TSMC capex hits US$56 billion, reshaping global semiconductor supply chain
TSMC's capital expenditure has surged in recent years, with 2026 spending forecasted to reach a record US$52-56 billion and market expectations even suggesting an upward revision to...
Thursday 16 April 2026
ASML raises 2026 revenue guidance as AI-driven chip demand overwhelms supply — and its customers know it
The lithography giant's first quarter earnings call reveals more than a beat-and-raise quarter: it exposes a structural shift in how chipmakers relate to their sole EUV supplier
Thursday 16 April 2026
JSR restarts Taiwan production as TSMC dominates advanced nodes
Japanese photoresist leader JSR officially announced on April 15 the establishment of an advanced planarization process solutions research center in Hukou, Hsinchu, Taiwan.
Thursday 16 April 2026
Spain aims to boost chip design, photonics, and quantum tech influence
The Spanish ICT Association (AMETIC) has been actively promoting Spain's standing in the domestic technology industry. Albert Anglarill, director of AMETIC's Catalonia office, said...
Wednesday 15 April 2026
Taiwan equipment makers ride advanced packaging and SiPh wave
Nvidia is accelerating the commercial rollout of silicon photonics (SiPh) technology, marked by the launch of its Rubin Ultra platform and the gradual establishment of co-packaged...