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Tuesday 30 June 2026
Asia Neo Tech and Brooks sign 15-year FOUP deal

Asia Neo Tech has announced a 15-year technology licensing agreement with US-based Brooks Automation to cooperate on FOUP (front-opening...

Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
TSMC fast-tracks CoPoS—whole supply chain under gag order

TSMC is accelerating CoWoS capacity expansion while also pushing ahead with next-generation panel-level packaging, CoPoS, aiming to...

Tuesday 30 June 2026
TSMC 2nm, CoWoS, and CoPoS broadly lift Taiwan's equipment, materials, and packaging suppliers

As AI demand continues to fuel global semiconductor investment, customers are keeping wafer starts strong, and TSMC is accelerating...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Tuesday 30 June 2026
Corning's East Coast edge: IP, manufacturing depth, and AI-era return of optical fiber
Protecting patents around the world is a core value for any R&D-driven company. It is also a commitment to partnering with customers. In 2025, glass giant Corning filed nearly...
Tuesday 30 June 2026
Samsung commits KRW2,655 trillion to future industries, anchoring new Gwangju fab
Samsung said on June 29 it will invest a combined KRW2,655 trillion (approx. US$1.72 trillion as of June 30, 2026) across its domestic operations, splitting the figure between continued...
Tuesday 30 June 2026
AI hands foundries pricing power: TSMC leads, but the boom spreads industry-wide

AI demand in 2026 is no longer confined to GPUs, but is broadening into ASICs, networking, PMICs, and a wide range of peripheral ICs,...

Tuesday 30 June 2026
Samsung revives 1.4nm foundry push as 2029 timeline takes shape

Samsung Electronics is moving forward again on its 1.4nm foundry process, but on a slower schedule than originally planned, The...

Tuesday 30 June 2026
SK Hynix accelerates Yongin fab timeline by 12 years as HBM strains memory capacity
SK Hynix said on June 29 it will spend KRW1,100 trillion (approx. US$710 ​billion) across three sites in South Korea over the coming decades, accelerating its Yongin cluster...
Tuesday 30 June 2026
China's third-largest pure-play foundry's HK filing shows growth, but also rising risks

Nexchip Semiconductor has filed for a Hong Kong listing to fund expansion, following rapid revenue growth and a stronger market position...

Tuesday 30 June 2026
South Korea looks to Taiwan as model for semiconductor decentralization
South Korea is overhauling its semiconductor manufacturing footprint to secure an edge in the AI era, drawing direct inspiration from a fierce competitor: Taiwan.
Tuesday 30 June 2026
Taiwan reportedly expands AI server smuggling probe, searches Supermicro and listed firms

Taiwanese prosecutors have reportedly expanded their investigation into the alleged illegal export of high-end AI servers to China,...

Tuesday 30 June 2026
Expected MCU price hike drives early 1H26 pull-ins

Microcontroller customers are accelerating shipments into the first half of 2026 as higher production costs ripple through the supply...

Tuesday 30 June 2026
Riken and Taiwan academia join forces on next-gen compound semiconductors
Japan's world-renowned Riken institute announced in late March 2026 that its homegrown superconducting quantum computer, "Ei-II," jointly developed with the University of Osaka, had...