Delta Electronics showcased its on-site solid oxide fuel cell (SOFC) power generation solution at Energy Taiwan 2026, alongside its first physical solid-state transformer (SST) pro...

Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...

Intel used the Open Compute Project (OCP) Global Summit in San Jose to argue that AI is moving away from giant models in centralized data centers.

GlobalFoundries (GF) has reached a multiyear manufacturing agreement with TSMC to expand silicon interposer capacity at its Malta fab in New York, supplying TSMC's Chip-on-Wafer-on-Substrate...

An explosion and fire at Intel's wafer fab in Kiryat Gat, southern Israel, on October 14, 2026, seriously injured three employees, one of whom later died of his injuries. Authorities...

Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...

Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...

Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has...

Bill Frauenhofer, executive director of semiconductor investment and innovation at the US Department of Commerce, joined Entegris CEO David Reeder for a fireside chat at SEMICON West...

Vietnamese technology group FPT is lining up a second Japanese distribution channel for its in-house power chips, a move that would carry Vietnamese-designed semiconductors beyond...

ASML, the sole supplier of extreme ultraviolet (EUV) lithography tools, has shifted from taking orders to allocating them. On its third-quarter 2026 earnings call on October 14, the...

AI chips are becoming harder to build, but that complexity is also creating new opportunities for semiconductor equipment suppliers. Applied Materials says rising transistor counts,...

Applied Materials sees advanced packaging as a key growth lever as AI chips move to multi-die designs, with the company projecting more than US$5 billion in related revenue in the...

ASML has signaled that a new customer whose name may begin with "T" is among the chipmakers seeking lithography tools for 2029 and 2030.

Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...