中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED IC MANUFACTURING
    Tuesday 29 September 2026
    US, China eye US$60 billion in tariff relief, but chips stay off the table
    The US and China are moving toward tariff reductions on about US$60 billion of bilateral trade following last week's Trump-Xi summit, but semiconductors and other strategically sensitive...
    Tuesday 29 September 2026
    Advanced packaging shifts toward system integration as AI renews semiconductor talent appeal

    At Singapore's Innovate Together 2026 conference on September 25, executives and researchers from A*STAR's Institute of Microelectronics...

    Tuesday 29 September 2026
    Beyond 16 layers: HBM stacks test advanced packaging equipment makers
    At Singapore's Innovate Together 2026 conference on September 25, equipment makers including ASM, ASMPT, and KLA said the challenges facing next-generation advanced packaging are expanding...
    Tuesday 29 September 2026
    Samsung bonus plan to lift South Korea talent race

    Samsung Electronics' Device Solutions division is set to announce the calculation and payout rules for its special management performance...

    Tuesday 29 September 2026
    GlobalFoundries eyes GaN expansion to challenge TSMC in AI

    GlobalFoundries (GF) is preparing a major global capacity expansion as TSMC is set to gradually exit gallium nitride (GaN) foundry services...

    Tuesday 29 September 2026
    GF's MIPS bets on RISC-V physical AI, expands into autos and data centers
    MIPS, a GlobalFoundries (GF) unit, said it has completed its integration with the ARC unit acquired from Synopsys earlier this year and is using the move to position RISC-V for physical...
    Tuesday 29 September 2026
    Chips make up nearly half of South Korea's September exports; China, Hong Kong account for 52% of them
    Semiconductors made up nearly half of South Korea's exports in the first 20 days of September, while China and Hong Kong combined accounted for more than half of the country's chip...
    Tuesday 29 September 2026
    VSMC Singapore fab fully booked as VIS weighs Fab 2
    Capacity at VisionPower Semiconductor Manufacturing Company's (VSMC) first 12-inch wafer fab in Singapore is fully booked as the joint venture between Vanguard International Semiconductor...
    Tuesday 29 September 2026
    TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
    VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
    Tuesday 29 September 2026
    Vanguard chairman says AI slowdown won't free up chip capacity

    Vanguard International Semiconductor (VIS) and NXP Semiconductors' joint venture, VisionPower Semiconductor Manufacturing Company (VSMC),...

    Tuesday 29 September 2026
    Trump-Xi state dinner puts tech titans at the head table, spotlighting Taiwan's quiet supply chain clout

    Chinese President Xi Jinping and his wife, Peng Liyuan, arrived at the White House on the evening of September 24 US time to attend...

    Tuesday 29 September 2026
    AI server MLCC prices rise as Chinese suppliers gain ground in generic parts

    Multilayer ceramic capacitor (MLCC) prices for AI servers have continued to climb, while prices for general-purpose components used...

    Tuesday 29 September 2026
    AMD pays US$8.2 billion for Fei-Fei Li's 3D world-modeling startup to shape future AI chips
    AMD has agreed to acquire World Labs, the San Francisco AI research startup led by Fei-Fei Li, in an all-stock deal valued at about US$8.2 billion. The chipmaker says it wants the...
    Tuesday 29 September 2026
    Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
    As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
    Tuesday 29 September 2026
    Behind CoWoS (part 1)—How a 0% yield crisis led to TSMC's first advanced packaging win
    In a recent interview on the DIGITIMES podcast, Dr. Shin-Puu Jeng, chairman of the International Microelectronics and Packaging Society (IMAPS) and a former longtime TSMC...
    1/247 pages
    API
    BIZ FOCUS
    Sep 29, 08:00
    Breaking free from keyword constraints: GeoGraph elevates job matching
    Thursday 24 September 2026
    FSP Debuts World's First 80 PLUS Ruby ATX PSU
    Wednesday 23 September 2026
    The Robot in the Supply Chain
    Tuesday 22 September 2026
    GUC Announces 2nm 16 Gbps HBM4E IP
    reportAIglasses