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Friday 17 July 2026
TSMC says A14 process on track for 2028 volume production
TSMC said at its earnings call on July 16 that its A14 process technology is developing as planned, with risk production set for 2027 and volume production slated to begin in 2028.
Friday 17 July 2026
Interview: From six weeks to two minutes: QuantumDiamond's EU-backed quantum leap in chip inspection lands in Taiwan

The global tech landscape is currently dominated by two massive tides: the race for semiconductor supremacy and the long-promised dawn...

Friday 17 July 2026
Power component prices keep rising as supply tightens

Power semiconductor makers say prices are still being adjusted as upstream raw material costs rise and AI-driven high-margin products...

Friday 17 July 2026
Tata's India chip debut reportedly to lean on 90nm, a humbler start than its 28nm pledge
India's first large-scale wafer fab will begin production on decades-old 90nm technology rather than the 28nm node the Tata group publicly touted, a step that underscores how far the...
Friday 17 July 2026
Hygon forecasts higher first-half 2026 revenue and profit
Hygon Information Technology said its first-half 2026 results are expected to rise sharply, signaling continued demand for domestic high-end chips as AI, cloud computing, and localization...
Friday 17 July 2026
TSMC welcomes EMIB relief as MediaTek pressure eases

TSMC Chairman C.C. Wei said on July 16 that if more competitors can offer advanced packaging solutions that meet customer needs, the...

Friday 17 July 2026
TSMC boosts US manufacturing as Taiwan chip designers wait on moving production

TSMC Chairman C.C. Wei formally announced on July 16 that the company will invest an additional US$100 billion in the US, funding several...

Friday 17 July 2026
TSMC's US$100 billion bet: AI growth, US pressure and the cost of staying ahead
Taiwan Semiconductor Manufacturing Company (TSMC) posted record second-quarter earnings for 2026, issued third-quarter revenue guidance above market expectations, and raised its full-year...
Friday 17 July 2026
South Korean suppliers ramp up hybrid bonding R&D beyond HBM5
As high-bandwidth memory (HBM) stacks add more layers, requirements for chip-to-chip bonding accuracy and signal transmission efficiency are becoming more demanding.
Friday 17 July 2026
Taiwan backs TSMC's US expansion while reaffirming advanced chip leadership at home
TSMC said on July 16 that it will add US$100 billion to its US investment, bringing the total to US$265 billion. Taiwan's Executive Yuan said it respects companies expanding in the...
Friday 17 July 2026
AI-driven chip price increases put automakers on alert as shortages stay limited
Semiconductor suppliers have begun rolling out one to two rounds of price increases and tighter allocations in the first half of 2026 as demand from GenAI, geopolitical tensions and...
Friday 17 July 2026
South Korean bill could let SK Hynix bring in outside investors for new fabs

A South Korean lawmaker has introduced a bill that would allow a second-tier subsidiary of a general holding company to retain a stake...

Friday 17 July 2026
CPU demand rebounds in AI data centers as TSMC stands to benefit across architectures

Taiwan Semiconductor Manufacturing Company (TSMC) held its second-quarter 2026 earnings conference on July 16, where chairman and CEO...

Friday 17 July 2026
Cica-Huntek opens Arizona plant to support advanced chip manufacturing in the US
Cica-Huntek Chemical Technology said on July 16 that its subsidiary facility in Phoenix, Arizona, had been completed and officially opened after about US$8 million in investment. The...
Friday 17 July 2026
China's AI chips hit three walls — and bet on 3D memory to break through
China's AI chip industry is moving beyond a contest over process nodes and into a broader race involving memory, advanced packaging, chip interconnects and system architecture.