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Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
AMEC seeks South Korean foothold through MOCVD trials with SK Keyfoundry, Magnachip
AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large...
Wednesday 21 October 2026
TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.
Wednesday 21 October 2026
AI chip scaling shifts into 3D, with performance per watt the new benchmark, says former TSMC VP
Growing AI computing demand is bringing the semiconductor industry to a technological turning point. Transistor scaling has long driven gains in chip density, performance, and energy...
Wednesday 21 October 2026
Samsung reportedly shifts foundry focus to 4nm, 5nm as 2nm deals take longer
Samsung Electronics is increasingly relying on its 4nm and 5nm foundry processes to improve near-term profitability as negotiations with major customers for its next-generation 2nm...
Wednesday 21 October 2026
Breaking AI's memory wall: former TSMC VP charts a path with HBM, optical links and 3D stacking
AI processor performance continues to improve, but memory bandwidth is growing more slowly, making data supply a major constraint on AI chip performance and energy efficiency. Efforts...
Wednesday 21 October 2026
Taiwan's September export orders jump 62.4% on AI demand
Taiwan's export orders totaled US$114.21 billion in September 2026, up US$11.25 billion, or 10.9%, from the previous month, according to data released by Taiwan's Ministry of Economic...
Wednesday 21 October 2026
Packaging-to-board integration emerges as key gap as AI reshapes electronics supply chain
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
Wednesday 21 October 2026
Foreign suppliers stand to gain first as India's chemical makers chase Tata's chip fab
India's first commercial chip fab is opening a long-awaited new market for the country's chemical makers, but the companies best placed to profit in the near term are Japanese, South...
Wednesday 21 October 2026
Japan plans JPY400 billion boost for Rapidus 2nm push
Japan plans to provide an additional JPY400 billion (US$2.5 billion) to support Rapidus' advanced semiconductor production between fiscal 2027 and fiscal 2029, as the government seeks...
Tuesday 20 October 2026
Unimicron chairman sees substrate sizes reaching 14x current scale by 2030
TPCA Show 2026 officially opened, with Unimicron Chairman Shan-Chieh Chien saying in his opening address that solving the three major challenges facing AI accelerators in high-performance...