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Friday 21 August 2026
SK Chairman warns of 2027 memory shortage, ties expansion to long-term orders
SK Group Chairman Tae-Won Chey said in a recent interview with CNBC that memory demand is surging explosively and that the most severe "memory shortage" will hit in 2027. He also apologized...
Friday 21 August 2026
CoWoS boom lifts Taiwan semiconductor equipment makers, Bosch Rexroth targets 2027 volume growth
Bosch Rexroth, the industrial technology subsidiary of Bosch, showcased advanced semiconductor and smart manufacturing solutions at the 2026 Taipei International Industrial Automation...
Friday 21 August 2026
JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026
Explainer: Why South Korea's semiconductor concentration may fare better than Taiwan's
As South Korea's semiconductor exports continue to power its economic expansion, market concerns are growing regarding the risks of excessive concentration in the tech sector. Recent...
Friday 21 August 2026
FOPLP's race to scale: Taiwan leads while three technical hurdles test mass production

Rising demand for AI computing power is increasing chip package sizes, bringing fan-out panel-level packaging (FOPLP) into sharper focus...

Friday 21 August 2026
Analyst: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
Taiwan export orders near US$98 billion in July, with US as top buyer
Taiwan's export orders climbed by US$207.3 billion, or 52.5%, in the first seven months of 2026 compared with the same period in 2025, according to data released on August 20 by the...
Friday 21 August 2026
JCET hits 1.5μm TSV milestone for denser HBM and 2.5D/3D packaging
JCET Group has completed trial production of a 1.5μm-diameter, 17μm-deep through-silicon via (TSV) with an aspect ratio of 11.3:1, extending its advanced packaging capabilities...
Friday 21 August 2026
Charts: AI test demand drives broadest growth among Taiwan's chip equipment suppliers
Thirty-eight of 43 companies grew year to date at a median rate of 28.7% — the highest of any semiconductor sub-sector — with test handlers, sockets and probe cards recurring...
Friday 21 August 2026
Samsung holds off on High-NA EUV until 1nm production
Samsung Electronics does not expect to move High-NA EUV lithography into volume production until its 1nm-class generation, a timeline that points to around 2030, after it had earlier...
Friday 21 August 2026
DIGITIMES's Colley Hwang warns Taiwan AI data center capacity lags South Korea

The inference economy has arrived, and Taiwan's tech industry must transition from the "knowledge economy" to the "inference economy,"...

Friday 21 August 2026
Column: Is 800V really 'high voltage'? —AI data centers revive an old power debate
High-voltage direct current (HVDC) is currently one of the hottest areas of technology and product development for AI data centers. It is not only the first layer of what Nvidia CEO...
Friday 21 August 2026
Kenmec surges on AI, advanced packaging to record orders, revenue

Fueled by robust global demand for artificial intelligence and the rapid expansion of semiconductor advanced packaging capacity, Kenmec...

Thursday 20 August 2026
Samsung gains foundry pricing power as 4nm capacity stays tight through 2027

Samsung Electronics is gaining pricing power in its foundry business as AI and high-bandwidth memory (HBM) demand tightens advanced-node...

Thursday 20 August 2026
AMEC profit jumps 300%: China chip equipment maker expands beyond etch with US$520M plan
Advanced Micro-Fabrication Equipment Inc. China (AMEC) posted a 300% surge in first-half 2026 profit and announced a CNY3.5 billion (US$520 million) capacity expansion, accelerating...