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Thursday 22 October 2026
Nvidia pitches factory-built AI data centers and hardware-enforced agent controls at GTC Berlin
Nvidia used its GTC Berlin keynote on October 21 to argue that AI's bottlenecks now lie in deployment speed, power, and security rather than silicon, unveiling reference designs and...
Thursday 22 October 2026
Unimicron, STATS ChipPAC, Wistron address advanced packaging bottlenecks in AI system integration
The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Thursday 22 October 2026
Taiwan tech supply chain eyes Texas for first US industrial cluster
As Taiwan and the US deepen supply chain localization efforts, concrete plans for Taiwan's electrical and electronics industries to establish US industrial parks are rapidly taking...
Thursday 22 October 2026
Samsung's Nvidia HBM bid raises four strategic concerns
Samsung Electronics is reportedly turning to TSMC's 3nm process to produce base dies for Nvidia's custom high-bandwidth memory (NVHBM), abandoning its long-standing turnkey integration...
Thursday 22 October 2026
ESMT sees memory price momentum extending through 4Q26, 2027
Persistent supply shortages have kept the niche memory market hot, with Elite Semiconductor Microelectronics Technology (ESMT) estimating that the structural supply gap exceeds 30%...
Thursday 22 October 2026
2nm and CoWoS expansion lifts Chi Yi Hsin Technology backlog to NT$4.5B
The expansion of advanced semiconductor processes and packaging is driving demand for facility engineering, with Chi Yi Hsin Technology securing NT$4.5 billion (US$138.9 million) in...
Thursday 22 October 2026
High-end ASIC demand drives TGV adoption as TPK weighs further Taiwan expansion
As advanced packaging technology evolves, traditional copper-clad laminates (CCL) are increasingly running up against signal transmission and thickness limitations. Through-glass via...
Wednesday 21 October 2026
Micron reaches deal with Taiwan union to introduce quarterly profit bonuses in FY27
Micron Technology's labor dispute in Taiwan appears set for resolution after its Taichung union signed a labor-management agreement with the company and withdrew from the mediation...
Wednesday 21 October 2026
Infineon, Wolfspeed pivot to 8-inch SiC to cut costs and meet rising AI power demand
Infineon Technologies and US-based silicon carbide (SiC) leader Wolfspeed announced on October 15 a new multi-year supply agreement for 8-inch SiC wafers. This deal transitions their...
Wednesday 21 October 2026
Sony keeps chip unit as imaging sensors, TSMC partnership drive strategy
Sony Group will not spin off its semiconductor business, which focuses on image sensors, president and CEO Hiroki Totoki said recently. The group is retaining the unit because its...
Wednesday 21 October 2026
AMEC seeks South Korean foothold through MOCVD trials with SK Keyfoundry, Magnachip
AMEC is seeking an entry into South Korea's power semiconductor market through MOCVD equipment trials with SK Keyfoundry and Magnachip. The Chinese equipment supplier holds a large...
Wednesday 21 October 2026
TSMC and others turn LCD plants into AI assets as LG Innotek weighs acquisition
Growing demand for AI servers, advanced packaging, and data centers is reviving interest in idle LCD plants, with companies acquiring and converting existing sites into semiconductor...
Wednesday 21 October 2026
Axcelis plans US$35 million semiconductor facility in South Korea
Axcelis Technologies plans to break ground on a US$35 million ion implantation equipment manufacturing facility in Pyeongtaek, South Korea, expanding its semiconductor infrastructure...
Wednesday 21 October 2026
Analysis: From rockets to fabs, SpaceX's TeraFab bet pushes vertical integration into the semiconductor era
SpaceX has spent two decades proving that hardware once considered too complex, too capital-intensive, or too dependent on entrenched suppliers could sometimes be pulled in-house....
Wednesday 21 October 2026
SpaceX pushes AI scaling into industrial realm as power equipment becomes limiting factor
The AI infrastructure race is increasingly becoming a contest over who can turn electrical capacity, cooling systems, and hardware into usable compute the fastest.