CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Tuesday 9 June 2026
MAtek posts record May revenue as AI chip power and 2-nanometer nodes drive testing demand
MAtek reported May 2026 revenue of NT$544 million (US$17.23 million), a 26.87% increase year-over-year and a 0.69% increase month-over-month, marking its third consecutive month of...
Tuesday 9 June 2026
AI supply chain shortages shift from chips to equipment
As four major North American CSPs step up AI infrastructure spending, global semiconductor output forecasts keep rising. But the AI demand surge is also exposing hidden supply-chain...
Tuesday 9 June 2026
AI chip race lifts semiconductor equipment sales to record US$36.55bn
Global semiconductor equipment sales hit a record first-quarter 2026 high, as the AI buildout lifted investment in leading-edge logic, DRAM and advanced packaging.
Monday 8 June 2026
Exclusive: The semiconductor battle behind AI data centers and EVs
Beneath the rapid expansion of electric vehicles and artificial intelligence infrastructure, a quieter battle is unfolding in the semiconductor supply chain.
Monday 8 June 2026
Wingtech sues Nexperia's Dutch entities as cross-border control dispute deepens
Wingtech has launched a lawsuit in China against Nexperia's Dutch entities and related parties, intensifying a dispute that could affect semiconductor supply chains, corporate governance,...
Monday 8 June 2026
Weekly news roundup: Taiwan ecosystem strengthens AI chip supply chain as MediaTek, Nvidia deepen cooperation
Below are the most-read DIGITIMES Asia stories from the week of June 1-7, 2026:
Monday 8 June 2026
Exclusive: Nvidia drops dual-piece cooling architecture for Vera Rubin platform
Nvidia's upcoming Vera Rubin AI server platform has become the focus of intense scrutiny after a late-stage redesign of its thermal architecture.
Monday 8 June 2026
Hitachi and Intel strike collaboration on physical AI and industrial infrastructure
Hitachi and Intel have agreed to work together on physical AI, advanced computing, and digital infrastructure, a move that could shape manufacturing, energy, and mobility systems used...
Monday 8 June 2026
LG Innotek expands Vietnam operations for AI packaging boom
LG Innotek is accelerating its push into advanced semiconductor packaging, announcing plans to expand its substrate manufacturing operations in Vietnam as it seeks to transform the...
Monday 8 June 2026
India roundup: India state targets chip packaging hub as India courts Taiwanese electronics investment

Andhra Pradesh is positioning itself as a semiconductor packaging hub, focusing on an entry...

Monday 8 June 2026
Onsemi promotes 800 VDC power architecture for future AI infrastructure
As hyperscale cloud providers and enterprise customers race to build increasingly powerful artificial intelligence infrastructure, power delivery and energy efficiency are emerging...
Monday 8 June 2026
T3EX expands Northeast Asia air freight to serve electronics and chip supply chains
Taiwan's T3EX Global Holdings is strengthening its Northeast Asia air freight network to capture rising logistics demand from the electronics and semiconductor supply chains, as global...
Sunday 7 June 2026
Samsung Foundry turns to 5nm, 8nm orders as 2nm comeback takes shape

Samsung Electronics is pursuing a two-track foundry strategy, accelerating its 2nm push for future customers while asking partners to...

Sunday 7 June 2026
JCET opens 3D packaging plant to target AI power modules, CPO demand
JCET has opened a new advanced manufacturing facility at its Chengdong production base in Jiangyin, strengthening the Chinese OSAT provider's push into advanced packaging for AI computing,...
Sunday 7 June 2026
Aspeed sees 2027 demand surge as agentic AI tightens supply chain capacity
Aspeed chairman Chris Lin said on June 3 that rapid growth in agentic AI is boosting demand for AI and general-purpose servers, with the chip maker's main constraint now supply-chain...