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NEWS TAGGED IC MANUFACTURING
Tuesday 20 October 2026
DeepSeek-Huawei chip co-design could shift AI training away from Nvidia
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
Tuesday 20 October 2026
Intel says it is the only high-volume fab for 12-inch InP silicon photonics as co-packaged optics nears deployment
Intel is pitching its foundry as the industry's supplier of light sources for AI data center optics, claiming at the 2026 Open Compute Project (OCP) Global Summit that it is the only...
Tuesday 20 October 2026
Amkor triples Gwangju investment as AI packaging demand grows
Amkor Technology is tripling its planned investment in Gwangju to expand advanced packaging capacity for artificial intelligence and high-performance computing, bringing a semiconductor...
Tuesday 20 October 2026
TPK targets 2028 TGV mass production with NT$6 billion investment
TPK Holding has completed a pilot production line for glass-substrate through-glass via (TGV) technology at its Zhongli plant and started joint development and validation of early-stage...
Tuesday 20 October 2026
Commentary: Samsung's US 2nm ramp faces no room for error
Samsung Electronics' 2nm mass-production capability at its Taylor, Texas fab has become critical to its efforts to close the gap with TSMC, as Tesla's AI5 chip delivery schedule and...
Tuesday 20 October 2026
Hanmi Semiconductor establishes US hub to support AI packaging customers

Hanmi Semiconductor has established a US subsidiary in Silicon Valley as it seeks to capitalize on growing demand for advanced semiconductor packaging...

Tuesday 20 October 2026
Nvidia seeks Taiwan government affairs director amid deeper local push
Nvidia is actively recruiting for a director of government affairs in Taiwan, as it deepens its presence on the island. The role is responsible for developing and executing government...
Tuesday 20 October 2026
MediaTek's Google TPU v9 faces potential delay over glass substrate yields, but 2026 orders remain strong
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Tuesday 20 October 2026
DIGITIMES Insight: AI packaging power reaches kilowatt scale as thermal design moves toward the die
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Tuesday 20 October 2026
Taiwanese server makers deepen Mexico investments amid US AI spending boom
Taiwanese electronics makers are deepening their presence in Mexico's Chihuahua state, drawn by surging US demand for AI servers, officials and business leaders told a seminar in Taipei...
Tuesday 20 October 2026
Analysis: US backing grows, but Intel insists turnaround remains independently run
The economics of the foundry business have always carried a particular contradiction: semiconductor manufacturing demands enormous upfront capital and years of sustained investment,...
Monday 19 October 2026
DIGITIMES Insight: Microsoft Maia 300 leads 2nm race, TSMC's US strategy shifts, Intel EMIB-T faces yield challenge
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
Monday 19 October 2026
Solution Finders Part 2 of 2: TSMC's first CTO said no to Intel twice but still wonders what if
Chenming Hu co-invented the FinFET transistor with colleagues at the University of California, Berkeley, in the 1990s and became TSMC's first chief technology officer in 2001. Decades...
Monday 19 October 2026
ACM Research bets on panel-level packaging and overseas growth as adoption risks persist
ACM Research is expanding beyond China as its panel-level packaging equipment advances through customer evaluations in Taiwan, while the US semiconductor equipment maker invests in...
Monday 19 October 2026
Solution Finders Part 1 of 2: the DARPA challenge behind TSMC's success
The foundations of TSMC's modern-day success can be traced back to a public call from the US Defense Advanced Research Projects Agency (DARPA) for innovative designs that could break...