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Tuesday 9 December 2025
Navitas, Cyient Semiconductors partner to develop GaN ecosystem in India
Navitas Semiconductor and Cyient Semiconductors have announced a strategic, long-term partnership aimed at advancing gallium nitride (GaN) technology adoption in India and establishing...
Tuesday 9 December 2025
SK Hynix secures 39 patents in China to strengthen memory and neuromorphic chip design
SK Hynix and battery subsidiaries within SK Group received approval for 68 core patents in China in November 2025. Many of these patents relate to highly integrated memory designs...
Tuesday 9 December 2025
Silver shockwaves push tech suppliers to renegotiate and retrench

Since the start of 2025, silver prices have nearly doubled, far outpacing the roughly 30% rise in copper and the 60% climb in gold. The...

Tuesday 9 December 2025
Tata Group and Intel form strategic alliance to assemble chips in India
Tata Group and Intel announced on December 8 that they have signed a memorandum of understanding to explore cooperation across semiconductor manufacturing, packaging and AI-focused...
Tuesday 9 December 2025
Baidu evaluates Kunlun chip spin-off for Hong Kong IPO, but offers no guarantee
Baidu has responded to reports that its in-house chip business, Kunlunxin, is planning a separate listing on the Hong Kong Stock Exchange by stating it is currently evaluating the...
Tuesday 9 December 2025
Moore Threads CEO leverages Nvidia legacy to challenge GPU giant
In a global GPU market dominated by US-based Nvidia, Chinese startup Moore Threads is rapidly emerging as a formidable local challenger. The driving force behind this bold counterattack...
Tuesday 9 December 2025
Samsung moves to narrow gap with TSMC as silicon photonics race heats up
Samsung Electronics is accelerating development of silicon photonics (SiPh) technology in an effort to solve bottlenecks in advanced AI processors and narrow the competitive gap with...
Tuesday 9 December 2025
Analysis: Why isn't Huawei trying to win the tech war?
Huawei founder Ren Zhengfei recently gave a public talk at the Huawei Lianqiuhu R&D Center in Shanghai. He shared insights on AI, quantum computing, computing power, and chips...
Monday 8 December 2025
Exclusive: Ex-TSMC R&D VP talks advanced packaging and CoWoS
Former TSMC R&D vice president Douglas Yu shared insights on the evolution of advanced packaging technologies like CoWoS, InFO, and SoIC, highlighting their critical role in extending...
Monday 8 December 2025
Samsung reportedly gains momentum in foundry and memory with improved 4nm yields
Samsung Electronics is reportedly gaining momentum across its foundry and memory operations as higher yields on its 4nm process and a broad recovery in DRAM demand position the company...
Monday 8 December 2025
Geopolitics push AI chip packaging into Taiwan-US duopoly
Geopolitical realignments are accelerating a reshaping of the global outsourced assembly and test (OSAT) landscape. Industry analysts say that over the next five years, advanced AI-chip...
Monday 8 December 2025
TSMC expansion to drive record earnings for Taiwan engineering contractors through 2026

Taiwan's leading construction engineering contractors are on track to post record results in 2026 as TSMC accelerates advanced fab expansion...

Monday 8 December 2025
Weekly news roundup: TSMC veteran's Intel move sparks debate, Samsung reportedly secures TPU HBM4 nod
These are the most-read DIGITIMES Asia stories in the week of December 1 to December 7, 2025.
Monday 8 December 2025
Ritek revives growth by becoming an AI infrastructure dark horse

Ritek Group CEO Wang Ting-chang said the group has long invested in AI-linked fields such as power, semiconductor materials, and packaging...

Sunday 7 December 2025
South Korea bets on airport GSE to break 90% power chip import lock
South Korea is racing to slash its more than 90% dependence on imported power semiconductors. Industry leaders warn that this reliance threatens the country's competitiveness in electric...