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    US ban on Chinese optical modules could disrupt AI supply chain
    10h 9min ago
    Old LCD fabs are being repurposed as AI advanced packaging hubs
    10h 9min ago
    Exclusive: STATS ChipPAC plans broad price hikes in 2H26 as AI demand stays strong
    10h 9min ago
    Interview: Nvidia exec on progress of CPO production and pluggable optics
    10h 9min ago
    Eclusive: Wistron lands Oracle AI server order as it adds Lenovo and HPE
    10h 9min ago
    China auto exports shift from price wars to value wars
    10h 9min ago
    NEWS TAGGED IC MANUFACTURING
    Thursday 6 August 2026
    Largan July 2026 revenue rises 11% as CPO samples progress

    Largan announced on August 5 that July revenue reached NT$4.877 billion (US$150.8 million), up 31% month-over-month and 11% year-over-year...

    Thursday 6 August 2026
    Taiwan unveils four semiconductor pillars for Smart Nation 2.0 plan

    On August 5, Taiwan's National Science and Technology Council said it had completed the central government's 2027 budget plan, with...

    Thursday 6 August 2026
    Rashi Peripherals partners with Japan's Restar to build out India semiconductor business

    Rashi Peripherals, a national distribution partner for global technology brands in India, has entered a joint venture with Japanese...

    Thursday 6 August 2026
    GlobalFoundries 2Q analysis 2/2: US subsidies, Taiwan rhetoric and GF's silicon photonics test
    GlobalFoundries (GF) often presents itself as an essential pillar of US semiconductor sovereignty. That claim is partly true, but requires qualification.
    Thursday 6 August 2026
    GlobalFoundries 2Q analysis 1/2: AI optics power earnings beat and margin gains
    GlobalFoundries reported stronger-than-expected second-quarter results, supported by rapid growth in AI-related optical networking and a richer mix of higher-margin technologies.
    Thursday 6 August 2026
    Second-tier foundries' repair rally lifts margins back to 30%
    The global mature-process foundry market is set for another recovery in 2026, as AI demand spreads into mature nodes, specialty-process content rises, and product mix improves. The...
    Thursday 6 August 2026
    TSMC's CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
    Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
    Thursday 6 August 2026
    India's ASIP Technologies makes FCBGA core of OSAT plan
    ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
    Thursday 6 August 2026
    Chunghwa Precision Test posts record July revenue on AI chip demand
    Chunghwa Precision Test Tech. reported record monthly revenue in July 2026, as demand for AI and high-performance computing (HPC) testing products rose across data center and cloud...
    Thursday 6 August 2026
    Samsung pitches 5nm as HBM4, Nvidia orders push 4nm lines to full capacity
    Samsung Electronics' foundry arm is stepping up sales of its 5nm process as its more advanced 4nm capacity is expected to remain fully booked through 2027, driven by HBM4 base-die...
    Thursday 6 August 2026
    Machvision July revenue hits record as AI and PCB demand strengthens
    Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The...
    Thursday 6 August 2026
    FOPLP leads production as CoPoS advances glass packaging
    AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
    Thursday 6 August 2026
    Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
    The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
    Thursday 6 August 2026
    GlobalWafers says AI demand is lifting utilization and new LTA talks are underway
    GlobalWafers said semiconductor demand has rebounded as AI and high-performance computing applications expanded, keeping its factories highly utilized and prompting a new round of...
    Wednesday 5 August 2026
    Infineon sees AI demand outpacing supply as customers lock in long-term capacity

    Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign...

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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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