South Korea's Hanmi Semiconductor has reportedly begun supplying 2.5D packaging bonders to an unnamed Taiwanese foundry after the equipment passed mass-production qualification, giving...
Facing rapid demand expansion across the semiconductor and AI industries, Tongtai Group (TT Group) has aggressively promoted an import-substitution and localization strategy in recent...
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
AI and high-performance computing (HPC) demand is extending order visibility for Taiwanese semiconductor equipment supplier Scientech into 2028, while capacity constraints may force...
AI and high-performance computing (HPC) demand is changing the semiconductor industry's technology and investment priorities. As chip power consumption, computing density, and data...
National Yang Ming Chiao Tung University (NYCU) has recruited 2013 Nobel Prize in Chemistry laureate Arieh Warshel to work in Taiwan, and the National Development Council (NDC) has...
Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
As Semicon Taiwan kicked off at the Taipei Nangang Exhibition Center, the Ministry of Economic Affairs (MOEA) announced that, based on forecasts compiled from multiple research institutions,...
System integration remains a key hurdle as the AI chip industry pushes for higher power efficiency and faster transmission speeds, drawing intense attention to when short-reach optical...
TSMC is steering the future of artificial intelligence toward high-density three-dimensional advanced packaging designed to mimic the architectural connectivity of the human brain,...
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Marketech International Corp. (MIC) posted record results in the second quarter of 2026, with consolidated revenue of NT$21.2 billion (approx. US$668.6 million), up 48.2% quarter-over-quarter...
TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
Trustworthy supply chain concerns are extending beyond semiconductors to drones and other autonomous systems, now emerging as national strategic industries. At a Semicon Taiwan 2026...
