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Thursday 13 August 2026
Taiwan's packaging and integration ecosystem positions it as the backbone of CPO scaling, Ayar Labs says

The technical feasibility of co-packaged optics (CPO) has been demonstrated repeatedly at major industry conferences in recent years...

Thursday 13 August 2026
Samsung delays High-NA EUV adoption until 1nm production in 2030
Samsung Electronics plans to introduce high-numerical-aperture extreme ultraviolet (High-NA EUV) lithography into mass production at its 1nm node around 2030, according to South Korean...
Thursday 13 August 2026
LandMark Optoelectronics posts surge in profit on silicon photonics demand
LandMark Optoelectronics Corp. reported a sharp jump in revenue, margins, and profit in the second quarter of 2026, driven by strong demand for silicon photonics products and higher...
Thursday 13 August 2026
SK Hynix expands EUV roadmap with High-NA tools and PSM adoption
SK hynix said it is advancing its use of extreme ultraviolet (EUV) lithography for the mass production of next-generation DRAM, with high-numerical-aperture (High-NA) EUV equipment...
Thursday 13 August 2026
LX Semicon starts mass producing automotive MCU for Hyundai Motor, Kia
LX Semicon has begun mass production of an automotive microcontroller unit (MCU) and started supplying the chip to Hyundai Motor and Kia, marking the first time the two automakers...
Thursday 13 August 2026
OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.
Thursday 13 August 2026
GaAs gains ground in short-reach AI optics as InP constraints mount
As AI workloads push data center interconnects from 800G toward 1.6T, indium phosphide (InP) has become a critical material for high-speed optical links, particularly for longer-distance...
Thursday 13 August 2026
Intel signals memory push after hiring former SK Hynix CEO

Intel is signaling a broader push into next-generation memory technologies, with CEO Lip-Bu Tan revealing that the company is exploring...

Thursday 13 August 2026
Hanmi pulls ahead of Hanwha as HBM4 orders rebound

South Korea's Hanmi Semiconductor is pulling ahead of rival Hanwha Semitech in thermal compression (TC) bonders for high-bandwidth memory...

Thursday 13 August 2026
India's state of Odisha sweetens chips, renewable energy incentives to court ISM projects

Odisha's state cabinet has approved a third amendment to its Semiconductor Manufacturing and Fabless Policy, adding fresh capital support...

Thursday 13 August 2026
Taiwan manufacturers call for faster nuclear restart to keep pace with AI, chip growth

The Chinese National Federation of Industries (CNFI), a major industrial and manufacturing association in Taiwan, called for the government...

Thursday 13 August 2026
Lenovo Capital backs Niobium Optoelectronics in Series B funding for TFLN chips
Jiangsu Niobium Optoelectronics Technology, a Chinese maker of thin-film lithium niobate (TFLN) photonic chips, has closed a Series B funding round worth several hundred million yuan...
Thursday 13 August 2026
TSMC-Sony image sensor venture pushes Japan chip investment to JPY6 trillion

TSMC said on August 11 that it will invest in CMOS image sensor development and mass production with Sony Group in Kumamoto Prefecture,...

Thursday 13 August 2026
From lab bench to IPO: How Taiwan's top university aims to turn professors into founders, campus into a unicorn factory

National Tsing Hua University (NTHU), one of Taiwan's leading research universities, has spent more than a decade cultivating a campus...

Thursday 13 August 2026
Vietnam opens Haiphong free trade zone to court semiconductor investment
Vietnam has launched the Haiphong Free Trade Zone to draw high-value investment into northern port city of Haiphong, with semiconductors, precision manufacturing, and other strategic...