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Wednesday 8 July 2026
Asia VC leaders call for deeper cross-border tech investment at inaugural regional summit
Heads of venture capital associations from Taiwan, Japan, and Korea gathered in Taipei today for the first Asia Venture Capital (VC) Summit, a historic trilateral meeting aimed at...
Wednesday 8 July 2026
ELAN revenue hit the top of forecast as notebook and AI products gained traction
ELAN reported June 2026 revenue of NT$1.059 billion, up 5.48% from the prior month and 7.13% from a year earlier. The Taiwanese chip maker said second-quarter 2026 revenue reached...
Wednesday 8 July 2026
Samsung's Jae-yong Lee heads to Sun Valley Conference for likely AI talks

Samsung Electronics Chairman Jae-yong Lee departed for the Sun Valley Conference in the US on July 7, marking his second straight year...

Wednesday 8 July 2026
France-Taiwan tech ties move from talks to factory floor

France's push into Taiwan's tech ecosystem has entered a new phase. After three years of cultural outreach and research exchanges,...

Wednesday 8 July 2026
TSMC earnings call could signal how long the AI boom can keep lifting its outlook

TSMC's July 16 earnings call is likely to test how far the chipmaker can extend its already upbeat guidance, as investors look for...

Wednesday 8 July 2026
Netherlands presses China talks on Nexperia and ASML trade frictions
The Netherlands used a trade mission to Beijing this week to reopen economic ties with China while semiconductor tensions remained at the center of the agenda. Dutch trade officials...
Wednesday 8 July 2026
National Center for Instrumentation Research helps academia break 2D materials bottleneck
As AI infrastructure chip orders flood in and TSMC runs near nonstop, academia has found it difficult to carry out industry-academia collaboration with the world's top foundry house...
Wednesday 8 July 2026
ASE expands globally as Hanmi Semiconductor targets CoWoS packaging demand
South Korean equipment maker Hanmi Semiconductor is moving beyond high-bandwidth memory (HBM) tools into advanced chip packaging, a shift that could affect the global semiconductor...
Wednesday 8 July 2026
Chinese equipment maker wins first large-format PLP lithography order for AI packaging equipment
Circuit Fabology Microelectronics Equipment (CFMEE) has secured China's first commercial order for a large-format panel-level packaging lithography tool, marking the company's entry...
Wednesday 8 July 2026
Msscorps posts record 2Q revenue on AI and chip testing demand

Msscorps reported record consolidated revenue in June, and for the first half of 2026, as demand from AI and semiconductor customers...

Wednesday 8 July 2026
ThinTech Materials Technology eyes FOPLP gains, BNCT growth through 2028

ThinTech Materials Technology (TTMC) is currently the only supplier with technology transfer recognition approved for FOPLP metal substrates...

Wednesday 8 July 2026
Onsemi sells two fabs to cut costs and sharpen power chip focus

Onsemi is selling two manufacturing facilities in the Philippines and the US to cut fixed costs, streamline its global production network...

Wednesday 8 July 2026
Global PMX revenue rises as advanced foundry and AI cooling demand strengthen

Global PMX said on July 6 that demand tied to semiconductor advanced-process equipment and AI server liquid-cooling systems remained...

Wednesday 8 July 2026
Foxsemicon June, 1H26 revenue hits record on AI orders
Foxsemicon Integrated Technology (FITI) posted record consolidated revenue of NT$2.451 billion (US$76.3 million) in June 2026, up 24.22% from May and 39.75% year-over-year. First-half...
Wednesday 8 July 2026
Foxconn chair: Two of four AI customer groups yet to reach full-scale demand

Speaking at the Taiwan Venture Capital and Private Equity Annual Conference on July 7, Foxconn Chairman Young Liu said demand for AI...