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Friday 22 May 2026
Samsung's quiet Taiwan play: Pairing memory with foundry to chip away at TSMC
Samsung Electronics chairman Lee Jae-yong quietly visited Taiwan on May 21 and met with MediaTek CEO Rick Tsai, according to semiconductor supply chain sources, in a move aimed at...
Friday 22 May 2026
AMD backs Taiwan EFB packaging chain to cut CoWoS reliance

AMD said it plans to invest more than US$10 billion in Taiwan's technology ecosystem to accelerate AI infrastructure development, while...

Friday 22 May 2026
Analysis: Samsung deal prevents walkout but deepens internal rifts over compensation
Samsung Electronics and its union signed a provisional agreement late at night, about an hour before a scheduled May 21 strike, averting an industry estimate of more than KRW100 trillion...
Friday 22 May 2026
South Korea aims for 50% domestic defense semiconductor supply by 2029
South Korea announced a national plan to raise domestic production of defense semiconductors to 50% by 2029, targeting heavy reliance on US and Taiwan supply chains to bolster national...
Friday 22 May 2026
Lam Research's Salzburg PLP center signals push toward panel production, but hurdles remain for large-scale adoption
Lam Research has opened a Panel-Level Packaging (PLP) Innovation Excellence Center in Salzburg, Austria, underscoring the company's move deeper into advanced packaging as customers...
Friday 22 May 2026
Global corporates take the pitch stage at Plug and Play Silicon Valley May Summit 2026
At Plug and Play Silicon Valley May Summit 2026, 12 global corporate leaders took the stage for a "Corporate Reverse Pitch," inviting potential partners to co-create solutions for...
Friday 22 May 2026
AMD deepens Taiwan supply chain ties with US$10B-plus push
AMD CEO Lisa Su arrived in Taiwan on May 20, 2026, on a private jet and largely followed the same itinerary as her April 2025 visit, including a meeting with TSMC, a technology forum...
Friday 22 May 2026
Intel's foundry reset: 14A, 10A and tougher engineering rules
Intel CEO Lip-Bu Tan is reshaping the chipmaker's engineering culture and foundry strategy, confirming that 14A remains on track while revealing that early development has begun on...
Friday 22 May 2026
Lam Research launches PLP Center of Excellence, replacing wafers with panels
Advanced packaging designs are approaching the physical limitations of wafers as AI, HPC, and heterogeneous integration rapidly evolve. Subsequently, Panel Level Packaging (PLP) technology...
Friday 22 May 2026
Innovation at the edge: Semiconductor startup highlights from Plug and Play Silicon Valley May Summit 2026
At the recent Plug and Play Silicon Valley May Summit, the semiconductor and supply chain sessions highlighted a critical shift toward hardware-level security, energy efficiency for...
Thursday 21 May 2026
AMD CEO meets with TSMC CEO in Taiwan as it expands US chip output
Advanced Micro Devices (AMD) CEO Lisa Su stated that the company plans to invest more than US$10 billion in Taiwan's industrial ecosystem to accelerate the development of artificial...
Thursday 21 May 2026
Commentary: Trump's Taiwan chip claim tests TSMC's silence
US President Donald Trump, after recently concluding a visit to China, again publicly accused Taiwan of having "stolen our chip industry." This was not the first time he had made such...
Thursday 21 May 2026
Nvidia's China hopes dim as Beijing doubles down on domestic AI chips
Nvidia's H200 was a major focus after the Trump-Xi meeting, but hopes for sales into China have faded after US President Donald Trump's latest remarks. Trump said Chinese President...
Thursday 21 May 2026
Five weak links India Semiconductor Mission 2.0 must fix
India's first semiconductor mission brought fabs, OSAT units, and chip projects into the policy pipeline. Its second phase is being shaped around a harder question: whether India can...
Thursday 21 May 2026
Demand surge for power semiconductors reshapes data-center power and cooling, pushing suppliers toward SiC and GaN
Demand for power components is surging as AI servers adopt high-voltage direct current power delivery and advanced cooling technologies. This shift could increase component density...