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    Xiaomi-backed RISC-V chip designer Nuclei starts IPO process
    19min ago
    Xpeng expands Turing chip from EVs into humanoid robots
    19min ago
    Corning sees CPO and glass core as new semiconductor battlegrounds
    19min ago
    China optical transceivers avoid US FCC curbs as NPO and CPO compete in high-speed links
    19min ago
    China's AIDC token costs hinge on access to advanced GPUs
    19min ago
    NEWS TAGGED IC MANUFACTURING
    Monday 14 September 2026
    Yole Group takes outside capital for the first time, selling minority stake to new French fund
    Yole Group, the French market-research firm that tracks the semiconductor, photonics and electronics supply chains, has sold a minority stake to Cervinvest Scale, the lower-midcap...
    Monday 14 September 2026
    Fujitsu's Monaka targets 2027 mass production with TSMC 2nm boost
    Fujitsu is preparing to take its advanced AI CPU overseas, with sales set to begin as early as 2027 in Japan, the US, and Asia. The company is betting on Monaka, a high-efficiency,...
    Monday 14 September 2026
    AI demand lifts UMC, VIS, PSMC revenue

    After mature-node price competition from 2023 to 2025, AI demand has spread from GPUs and HBM to power management ICs (PMICs), power...

    Monday 14 September 2026
    STMicro lead times top 1 year, boosting Taiwan chip makers
    AI crowd-out effects are rippling through the supply chain, with lead times for microcontroller units (MCUs) from STMicroelectronics reportedly stretching beyond 1 year and triggering...
    Monday 14 September 2026
    DIGITIMES Insight: High NA EUV chips near production, but economics will be the pacemaker
    ASML's latest update suggests High NA EUV is no longer confined to laboratory validation. With 10 systems already operating across four customers worldwide, and three more in shipment...
    Monday 14 September 2026
    DIGITIMES Insight: Taiwanese firms lead in FOPLP as overseas rivals race to catch up
    Taiwanese chip packaging firms are advancing fan-out panel-level packaging (FOPLP) and glass-substrate development as AI processors demand ever-larger reticle sizes and more complex...
    Monday 14 September 2026
    China optical firms target photonics with mixed high-end, lower-cost push
    The 2026 China International Optoelectronic Exposition (CIOE) closed on September 11. While near-eye display applications such as AR/VR and smart glasses drew attention, vendors' latest...
    Monday 14 September 2026
    South Korea broadens espionage law to counter rising tech leaks
    South Korea's revised Criminal Act took effect September 13, extending the scope of espionage offenses from acts benefiting North Korea to those benefiting any foreign country or equivalent...
    Monday 14 September 2026
    Samsung, Qualcomm deepen 2nm talks as pricing and yield hurdles persist
    Samsung Electronics and Qualcomm are expanding discussions over 2nm foundry cooperation, with pricing, yield, and process optimization still unresolved as Samsung seeks to regain a...
    Monday 14 September 2026
    Gritek to take full control of 12-inch silicon wafer venture in major restructuring
    Gritek plans to strengthen its position in China's large-diameter silicon wafer market by acquiring the remaining stakes in two semiconductor materials companies, according to a company...
    Monday 14 September 2026
    AI's energy demand ignites global nuclear rush, straining Taiwan's restart
    A worldwide nuclear comeback, fueled by artificial intelligence data centers and semiconductor demand, is tightening supply chains and labor markets just as Taiwan considers restarting...
    Monday 14 September 2026
    India semiconductor deals hit a multi-year high ahead of SEMICON India 2026
    India's semiconductor companies have raised nearly half of their all-time equity funding since the start of 2025, and deal activity this year is already at a multi-year high. The figures...
    Monday 14 September 2026
    Hua Hong Grace completes Huali Micoelectronics acquisition, state parent raises stake

    Hua Hong Grace (HHGrace) has completed the share issuance for its acquisition of a 97.4988% stake in Huali Microelectronics (HLMC),...

    Monday 14 September 2026
    CPO nears mass production — next battle about interfaces, yield and maintenance
    As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
    Monday 14 September 2026
    AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
    Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
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    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
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