Optical communications is becoming a key global bottleneck as AI workloads expand, and Sigurd is positioning itself to benefit. The IC test and packaging company said demand is rising...
A former iPhone display factory in Mobara, Japan, is set for a new role in the semiconductor supply chain, with Shinko Electric Industries planning to convert the site into a production...
As the global smartphone system-on-chip (SoC) market contracts, competition in the high-end application processor (AP) segment is intensifying. MediaTek is accelerating its push into...
This week's (October 5 to October 11, 2026) coverage highlights intensifying efforts to build resilient semiconductor and AI hardware supply chains. Elon Musk's Terafab project faces...
Tata Electronics has six customers at different stages of engagement with its Dholera semiconductor fab, including three with what a person familiar with the project described as binding...
Taiwan's gross domestic product (GDP) growth is projected to reach 11.05% in 2026, a 39-year high, driven by its technological advantage in artificial intelligence (AI), semiconductors,...
DIGITIMES observed that as AI computing has hit a bottleneck from the memory wall, data storage and data movement have become extensions of the computing task, also reshaping the role...
Episil held an earnings call on October 7, saying silicon carbide (SiC) capacity utilization has rebounded quickly from 30% at a low point to nearly 90% now. If 6-inch order demand...
MAtek, a leading semiconductor testing company, reported September 2026 revenue of NT$569 million (approx. US$17.8 million), up 12.31% year-over-year. Revenue for the first nine months...
Baso Precision Optics held its latest online earnings call on October 7, during which the company acknowledged short-term pressures on its gross margin, due to ongoing adjustments...
Changs Ascending said orders tied to semiconductor customers' new plant construction, equipment arrivals, and project acceptance schedules were gradually fulfilled and recognized as...
As explosive AI computing demand drives hardware architecture change, Taiwan Printed Circuit Association (TPCA) is set to open its annual flagship event, with the 21st International...
Malaysia is moving from traditional semiconductor back-end manufacturing toward higher value-added work, with advanced packaging set to drive growth over the next two to three years,...
GF said on October 8, 2026, that it has signed a multi-year, US$2 billion manufacturing agreement with TSMC to produce silicon interposers for TSMC's CoWoS ecosystem at its Malta,...
