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Tuesday 10 November 2026
Intel looks beyond 18A and 14A to reshape computing
Intel has fallen noticeably behind rivals including Nvidia and AMD in the generative AI boom. Rather than concentrating all its resources on catching current market leaders, the company...
Tuesday 10 November 2026
SK Hynix-backed Trinity Fab to test chipmaking tools in 2027
Trinity Fab, a semiconductor testing facility backed by SK Hynix and South Korean public bodies, will begin testing chipmaking equipment and materials in October 2027, The Elec...
Tuesday 10 November 2026
Nvidia, SPIL target CPO volume shipments in 2027
AI infrastructure investment is accelerating the shift toward optical connectivity, as rising data-center traffic exposes the power and bandwidth limits of conventional electrical...
Tuesday 10 November 2026
Mitsui Chemicals to acquire JSR for US$11.6 billion, targeting semiconductor materials growth
Mitsui Chemicals plans to acquire semiconductor materials maker JSR in a transaction valued at JPY1.84 trillion (approx. US$11.6 billion), including assumed debt, as it seeks to strengthen...
Tuesday 10 November 2026
Exclusive: Designing light for everyone—Wave Photonics seeks to make custom photonic chips accessible
In a Cambridge laboratory, an automated testing machine sits at the end of a process that has traditionally demanded years of specialized engineering: designing a photonic chip, sending...
Tuesday 10 November 2026
AI boom drives photomask outsourcing despite IP fears, Tekscend says
Memory chipmakers have long been reluctant to outsource sensitive photomask production over intellectual property concerns, but growing artificial intelligence (AI) demand and capacity...
Tuesday 10 November 2026
Taiwanese engineering company Yankey holds NT$57.1 billion orders, Kumamoto wafer fab project to boost 2027 revenue
Yankey Engineering’s order backlog reached a record NT$57.1 billion (US$1.74 billion) as of the end of September, with its subcontracting project for the second wafer fab in...
Tuesday 10 November 2026
Intel targets silicon photonics, in-memory computing beyond GPUs
As the global semiconductor industry continues to focus on Nvidia, Intel is looking beyond GPUs to determine where next-generation computing architectures will go. In an interview...
Tuesday 10 November 2026
Exclusive: influx of Chinese capital drives gallium oxide substrate price cuts toward 2027
Gallium oxide (Ga2O3), a compound ultra-wide-bandgap semiconductor material, is poised to hit a critical turning point in 2027. Semiconductor supply chain sources...
Tuesday 10 November 2026
Singapore fab set to drive VIS growth as AI interposers reshape output
Vanguard International Semiconductor (VIS) said its Singapore wafer fab is expected to become a growth driver in 2027, with capacity nearly sold out, customer commitments secured,...
Tuesday 10 November 2026
AI demand points to tighter capacity, higher prices at Taiwanese foundry service Vanguard
Vanguard International Semiconductor expects utilization of its 8-inch mature-node fabs to exceed 90% in the fourth quarter of 2026, as AI data center demand lifts orders for power...
Tuesday 10 November 2026
Japanese chipmaker Rapidus targets Taiwan’s chip cluster model, plans 3 more Hokkaido plants
Rapidus President Atsuyoshi Koike said the Japanese chipmaker will use Taiwan as a model for building a semiconductor industry cluster in Hokkaido, while IBM Japan is establishing...
Tuesday 10 November 2026
Infineon, Solum expand cooperation on HVDC power for AI data centers
Infineon Technologies and Solum have agreed to expand cooperation on high-voltage direct current (HVDC) power systems for artificial intelligence data centers, as rising computing...
Tuesday 10 November 2026
Lens Technology to start glass substrate pilot line by year-end, eyes Korean chipmakers
China's Lens Technology plans to build and operate its first through-glass via (TGV) glass substrate pilot line by the end of 2026 and is seeking partnerships with South Korean semiconductor...
Tuesday 10 November 2026
Exclusive: Quantum Motion makes 10,000-fold leap in chip integration, but qubit control remains the real test
The race to build powerful quantum computers has long revolved around an unfamiliar set of engineering challenges: maintaining delicate quantum states, operating complex cooling systems,...