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Monday 13 July 2026
Intel eyes dual-side power in 1.4nm push against TSMC

Intel is reportedly preparing a new technology roadmap for its next-generation 1.4nm process, 14A2, as it evaluates a hybrid architecture...

Monday 13 July 2026
TSMC June 2026 revenue surges 68% as AI demand continues to fuel growth
TSMC reported another month of strong revenue growth, underscoring continued demand for advanced chips used in AI applications. According to the company's June revenue report, consolidated...
Monday 13 July 2026
Chiayi Science Park Phase 2 breaks ground for advanced packaging hub
The second phase of Chiayi Science Park has officially broken ground on a site of about 90 hectares, with TSMC leading the development of an industrial cluster centered on advanced...
Monday 13 July 2026
Samsung targets 2029 Yongin fab opening as infrastructure timetable tightens
Samsung Electronics plans to begin operations at its first Yongin fab in 2029, one to two years ahead of the original schedule, increasing pressure on South Korea to accelerate the...
Monday 13 July 2026
Huawei reportedly backs 12-inch DRAM fab to reduce memory dependence

Huawei is reportedly partnering with Chinese DRAM maker Shenzhen Shengweixu Technology (SwaySure) and the Chinese government to build...

Monday 13 July 2026
Applied Materials India eyes larger role in global chip equipment development
Applied Materials India is preparing to take on broader ownership of selected semiconductor equipment product initiatives, as the US-based chipmaking equipment supplier expands its...
Monday 13 July 2026
US chip factory buildout faces possible delays as labor shortage nears 157,000 by 2030

A shortage of skilled workers could slow construction of new US semiconductor plants, raise costs, and limit chip output for global...

Monday 13 July 2026
CPO mass production accelerates new four-stage test equipment market
AI-driven demand is accelerating the shift of co-packaged optics (CPO) from technology validation to mass production, triggering a new wave of equipment demand. Companies including...
Monday 13 July 2026
Nanya lifts long-term capacity to 50%, eyes 4x capex in 2027
Memory chipmaker Nanya said its second-quarter 2026 operations hit a record high, with President Pei-Ing Lee saying signed long- and short-term agreements now account for 50% of total...
Monday 13 July 2026
Infineon urges TSMC to consider a second Dresden fab as demand outlook evolves

A push by Infineon for TSMC to expand further in Dresden could reshape Europe's role in advanced chipmaking and ripple through the...

Monday 13 July 2026
Weekly news roundup: TSMC widens AI chip lead as HBM and CoWoS bottlenecks reshape supply chains

AI demand is still outrunning advanced semiconductor capacity, putting foundry output, HBM supply, packaging and server infrastructure at...

Monday 13 July 2026
India opens first CMP pad technology hub in Hyderabad
India's first Chemical Mechanical Polishing pad technology hub could help reshape semiconductor supply chains far beyond the country. The new Hyderabad facility aims to build local...
Monday 13 July 2026
KYEC approves US$1.4 billion US plant to expand chip testing capacity
King Yuan Electronics (KYEC) approved a US plant investment of up to US$1.4 billion, or about NT$44.9 billion, on July 10 as the US continued pushing to expand domestic chip manufacturing...
Monday 13 July 2026
India roundup: India's chip strategy tests its ability to build a competitive ecosystem

India is moving from semiconductor planning to execution, using funding, tariff changes, foreign...

Monday 13 July 2026
MA-tek hits record June revenue on rising AI chip testing demand, CPO complexity
Semiconductor testing company Materials Analysis Technology (MA-tek) reported June 2026 revenue of NT$558 million (approx. US$17.41 million), up 2.56% from May and 11.01% year over...