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Sunday 2 August 2026
Memory costs overtake smartphone chip costs as SoC shipments are set to fall 14%
Memory costs have moved ahead of smartphone system-on-chip (SoC) costs, and Counterpoint Research said the shift was already reshaping handset pricing and demand. The research firm...
Sunday 2 August 2026
ESMT posts record second-quarter profit on higher contract memory prices
Elite Semiconductor Microelectronics Technology (ESMT) reported a record second-quarter 2026 profit as contract prices rose for niche memory products, lifting results sharply from...
Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
Saturday 1 August 2026
Obituary: Powerchip chairman Frank Huang dies after reshaping Taiwan's DRAM and foundry industry

Powerchip Semiconductor Manufacturing Corp. (PSMC) chairman Frank Huang died on July 31, 2026, at age 76, closing a career that spanned...

Saturday 1 August 2026
Posiflex revenue rises 46% in the second quarter on Europe and Asia demand
Posiflex Technology reported a sharp sequential rebound in the second quarter of 2026, with consolidated revenue climbing 46% to NT$5.183 billion (US$160.3 million). The industrial...
Saturday 1 August 2026
At OCP's Taiwan summit, servers take a back seat to optics and advanced packaging

When the agenda for this year's OCP APAC Summit landed, seasoned observers noticed something unusual. TSMC, Applied Materials, Advantest,...

Friday 31 July 2026
Exclusive: Asian chipmakers' shift to US helium raises concentration risk
Chipmakers in Taiwan, South Korea, and Japan have avoided broad helium-related production disruptions so far, but their rapid shift toward US supply is creating a new concentration...
Friday 31 July 2026
ASE lifts 2026 capex to record US$10.5 billion, expects LEAP revenue to double in 2027

Driven by robust AI-related demand for advanced packaging and testing, ASE Technology Holding has raised its 2026 capital expenditure...

Friday 31 July 2026
Samsung chip engineers eye SK hynix as AI-driven bonus gap fuels talent war
Nvidia CEO Jensen Huang recently appeared alongside SK Group Chairman Chey Tae-won and Samsung Electronics Executive Chairman Lee Jae-yong at a high-profile AI gathering in San Francisco,...
Friday 31 July 2026
Tokyo Electron raises outlook as AI data center spending lifts memory demand
Tokyo Electron lifted its operating profit outlook for April-September 2026 on July 30, citing continued investment in AI data centers and stronger semiconductor capital spending....
Friday 31 July 2026
Powertech bets on AMD FOPLP mass production in 2027
Powertech Technology is pressing ahead with new growth drivers, with chairman DK Tsai saying its FOPLP project with AMD for AI advanced packaging is on schedule and is expected to...
Friday 31 July 2026
Auto chip demand recovers, but restocking remains elusive

Automotive chip sales are improving across Europe and the US, but major suppliers say global carmakers and their suppliers are still...

Friday 31 July 2026
Shanghai rises as China's lithography hub, powered by SMEE, Huawei and rising DUV rivals

China's lithography equipment sector has returned to the global semiconductor spotlight following reports that a domestically developed...

Friday 31 July 2026
TSMC reportedly develops EMIB-like packaging to counter Intel

TSMC is reportedly developing a new advanced chip-packaging technology modeled on Intel's Embedded Multi-die Interconnect Bridge (EMIB),...

Friday 31 July 2026
Analysis: Samsung's HBM4 base die is the foundry weapon TSMC and Intel can't copy

The most revealing thing about Samsung Electronics' foundry commentary on its second quarter of 2026 earnings call was not any single...