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Tuesday 13 October 2026
ASML unveils Hyper NA EUV successor targeting 5nm single exposure
Engineers from ASML and its optical partner Zeiss have jointly published a research paper in the October issue of the academic journal Journal of Micro/Nanopatterning, Materials...
Tuesday 13 October 2026
Taiwan seeks to produce more Nobel laureates
Taiwan has not seen a locally born and educated Nobel Prize winner in the last 40 years since Yuan-Tseh Lee became a laureate in chemistry in 1986. Thus, Taiwan President Ching-te...
Tuesday 13 October 2026
AMEC chairman warns of AI bubble risk, sees consolidation ahead for China's chip equipment industry
Advanced Micro-Fabrication Equipment (AMEC) chairman and general manager Gerald Yin has warned of a potential AI investment bubble, cautioning that surging demand for chipmaking equipment...
Tuesday 13 October 2026
Hua Hong deepens China chip equipment partnerships, targets stronger specialty foundry share by 2030
China's Hua Hong Group has signed strategic agreements with four domestic semiconductor equipment suppliers to accelerate the adoption of locally developed wafer fabrication tools,...
Tuesday 13 October 2026
Malaysian states team up to back homegrown chip firms
The Selangor state government has committed MYR50 million (US$12.24 million) to the National Strategic Investment Fund, joining Khazanah Nasional Bhd and the Penang government in a...
Tuesday 13 October 2026
TSMC power plant funding talks still conceptual, says Taipower
Electricity demand from semiconductor manufacturing, memory production, advanced packaging, and server assembly is rising rapidly, fueling reports that Taiwan Power Company (Taipower)...
Tuesday 13 October 2026
India's Kaynes Semicon seeks foreign partners as its Gujarat chip plant ramps up
Kaynes Semicon, the chip packaging arm of Indian electronics maker Kaynes Technology, is calling for foreign semiconductor companies to form joint ventures in India, as its executives...
Tuesday 13 October 2026
Applied Materials opens R&D center to speed chipmaking for the AI era
Applied Materials has opened its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, positioning the Silicon Valley site as a new hub for...
Tuesday 13 October 2026
Nanya Technology's LTAs cover up to 70% of capacity as Pingtung 3D IC plant targets 2H28 production
Nanya Technology reported record profits in the third quarter of 2026, with president Pei-Ing Lee saying long-term agreements (LTAs) now cover approximately 50–70% of the company's...
Tuesday 13 October 2026
AI Server tracker: Taiwan's AI server chain grew 55% in September, but the growth narrowed to fewer suppliers
The AI buildout is still lifting Taiwan's server supply chain faster than almost any other industry, yet September's filings show the lift concentrating into fewer hands. The 49 listed...
Tuesday 13 October 2026
Podcast highlights: Is Elon Musk using TSMC talks as leverage against Intel and Samsung?
Elon Musk's recent confirmation that his "TeraFab" initiative is in talks with Taiwan Semiconductor Manufacturing Co. (TSMC) signals that a project originally framed as a challenge...
Tuesday 13 October 2026
Terafab and beyond: Musk's push to fuse silicon, robotics, space into one AI system
As plans for the Terafab project begin to take shape, the emergence of a scaled chipmaking initiative increasingly reflects Elon Musk's broader ambition to push vertical AI integration...
Tuesday 13 October 2026
Samsung to pay chip workers special bonuses in stock, pending shareholder approval
Samsung Electronics plans to pay its semiconductor employees special bonuses entirely in company shares in late March or early April 2027, with two-thirds of the stock subject to selling...
Tuesday 13 October 2026
Nan Pao sees breakthroughs in adhesives for semiconductors, foldable displays
Nan Pao Resins Chemical reported September revenue of NT$2.308 billion (US$72.35 million), up 16.5% year-over-year and a record for the same period, as it continued to develop new...
Monday 12 October 2026
Microsoft's Maia 300 rack: 96 accelerators, HBM4, mostly liquid-cooled
Microsoft has released architecture details for Maia 300, its third-generation Azure AI accelerator. The design pairs 96 accelerators per rack with a two-tier network that links up...