CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Thursday 6 August 2026
TSMC’s CoW outsourcing spurs OSAT capacity push amid AI packaging bottleneck
Taiwan Semiconductor Manufacturing Co. (TSMC) is expanding outsourcing of the chip-on-wafer (CoW) stage of its CoWoS advanced packaging to outsourced semiconductor assembly and test...
Thursday 6 August 2026
India's ASIP Technologies makes FCBGA core of OSAT plan
ASIP Technologies will focus its Visakhapatnam semiconductor facility on flip-chip ball grid array packaging as it works toward volume production in the fourth quarter of 2027, Managing...
Thursday 6 August 2026
Chunghwa Precision Test posts record July revenue on AI chip demand
Chunghwa Precision Test Tech. reported record monthly revenue in July 2026, as demand for AI and high-performance computing (HPC) testing products rose across data center and cloud...
Thursday 6 August 2026
Samsung pitches 5nm as HBM4, Nvidia orders push 4nm lines to full capacity
Samsung Electronics' foundry arm is stepping up sales of its 5nm process as its more advanced 4nm capacity is expected to remain fully booked through 2027, driven by HBM4 base-die...
Thursday 6 August 2026
Machvision July revenue hits record as AI and PCB demand strengthens
Machvision reported consolidated revenue of about NT$359 million (US$11.1 million) in July 2026, a record monthly high that was up 1.28% from June and 31.84% from a year earlier. The...
Thursday 6 August 2026
FOPLP leads production as CoPoS advances glass packaging
AI chip computing power is rising rapidly, pushing advanced packaging toward larger form factors, higher bandwidth, and greater integration. Traditional Ajinomoto build-up film (ABF)...
Thursday 6 August 2026
Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
Thursday 6 August 2026
GlobalWafers says AI demand is lifting utilization and new LTA talks are underway
GlobalWafers said semiconductor demand has rebounded as AI and high-performance computing applications expanded, keeping its factories highly utilized and prompting a new round of...
Wednesday 5 August 2026
Infineon sees AI demand outpacing supply as customers lock in long-term capacity

Infineon said demand for its AI data center power semiconductors continues to exceed available supply, prompting leading customers to sign...

Wednesday 5 August 2026
Samsung, SK Hynix expansion puts Korea's chip supply chain to the test

Daeduck Electronics plans to invest KRW497 billion(US$349.50 million) in semiconductor production facilities through 2027, its second...

Wednesday 5 August 2026
Samsung, SK Hynix reportedly test AMEC tools to guard against tighter US curbs
Samsung Electronics and SK Hynix reportedly began testing etching equipment from China's Advanced Micro-Fabrication Equipment (AMEC) about two years ago for possible use at their Chinese...
Wednesday 5 August 2026
Huawei's 18-tier pagoda challenges Nvidia's chip-scaling playbook

Huawei is arguing that the next phase of semiconductor performance will depend less on transistor shrinkage and more on system architecture,...

Wednesday 5 August 2026
Vanguard International Semiconductor sees AI demand lift mature-node prices through 2027
Demand for power management ICs (PMICs) driven by artificial intelligence (AI) servers continues to grow, accelerating the recovery of mature-node processes. Vanguard International...
Wednesday 5 August 2026
Vanguard International Semiconductor lifts 2Q26 profit on AI server chip demand
Vanguard International Semiconductor (VIS) reported stronger second-quarter 2026 results on higher demand for AI server power management ICs, customer restocking and higher average...
Wednesday 5 August 2026
PSMC open to US, Singapore, Malaysia joint ventures as Intel packaging partnership enters mass production

Market interest in whether Taiwan's Powerchip Semiconductor Manufacturing (PSMC) would deepen cooperation with Intel or potentially...