CONNECT WITH US
NEWS TAGGED IC MANUFACTURING
Tuesday 3 November 2026
TSMC's next US chip plant could land in Sherman
Sherman, a city north of Dallas, has emerged as a possible site for TSMC's next US chip plant, with Texas development documents describing a proposed US$45 billion investment in two...
Tuesday 3 November 2026
China's chip packagers ride AI demand, price hikes, but investment gains, capex cloud the profit picture
China's outsourced semiconductor assembly and test (OSAT) companies entered the fourth quarter with rising sales, high utilization, and an industry-wide price upturn. Their third-quarter...
Tuesday 3 November 2026
Geopolitical risks, sustainability pressures reshape Taiwan's specialty chemicals industry
Geopolitical tensions, volatile crude oil prices, and tightening sustainability requirements are reshaping the global chemical industry, creating new challenges and opportunities for...
Tuesday 3 November 2026
South Korea aims to speed up chip fab openings by two years
South Korea plans to bring new semiconductor fabs into operation at least two years ahead of schedule by speeding up construction approvals and infrastructure development, as the government...
Tuesday 3 November 2026
Apple says 2nm transition is easing its advanced-node chip constraints
Apple said the main supply constraint in its fiscal fourth quarter 2026, ended September 26, was the availability of leading-edge process capacity for its in-house chips. It said the...
Tuesday 3 November 2026
Samsung to exit 8-inch foundry business by 2030, report says
Samsung Electronics plans to shut down its remaining 8-inch foundry lines by the end of 2030, forcing South Korean chip designers to seek alternative manufacturing capacity as competing...
Tuesday 3 November 2026
Nvidia strengthens South Korea ties at AI Day Seoul
Nvidia will showcase its expanding partnerships with South Korean companies at AI Day Seoul, where Samsung Electronics and SK Hynix will present semiconductor development cases using...
Tuesday 3 November 2026
Samsung's Young Hyun Jun urges humility, customer trust amid semiconductor profit boom
Despite record profits driven by surging demand for artificial intelligence (AI) and a booming semiconductor industry, Samsung Electronics vice chairman and head of its Device Solutions...
Tuesday 3 November 2026
DIGITIMES Insight: Intel's retreat from low-margin industrial chips opens edge AI market to AMD and Arm rivals
As edge AI applications and AI agents move toward real-world deployment, industrial control and embedded processors are undergoing a structural upgrade in computing capabilities.
Monday 2 November 2026
Powerchip Investment Holding files suit over NT$13.6B share-buying bid
Powerchip Investment Holding has filed a complaint over an alleged plan by unidentified buyers to acquire a 20% stake through coordinated share sales for more than NT$13.6 billion...
Monday 2 November 2026
Taiwan aims to train 60,000 IC specialists by 2030
Taiwan is aggressively pursuing a core strategy of "Team Taiwan to Team Global," according to Cheng-Wen Wu, Minister of the National Science and Technology Council (NSTC). Wu noted...
Monday 2 November 2026
TEL sees 90% profit surge as AI chip demand stays strong
Tokyo Electron (TEL) forecasts nearly 90% annual operating-profit growth as chipmakers accelerate capital spending to meet demand for AI hardware, despite mounting concerns over an...
Monday 2 November 2026
AI data center demand fuels THEIL's optical communications rebound, 4Q26 to buck seasonal downtrend
Tong Hsing Electronic Industries (THEIL) outlined the latest developments and market trends across its four major product lines of optical communications, ceramic substrates, new semiconductor...
Monday 2 November 2026
Macronix wins IEEE Milestone — chair reveals how sNOVA transformed Taiwan's chipmaking
Memory chipmaker Macronix International Co. has become Taiwan's first semiconductor company to receive an IEEE Milestone, in recognition of its pioneering sNOVA engineering data analysis...
Monday 2 November 2026
Samsung's Lee bets on Japan for AI chip packaging edge
Samsung Electronics chairman Lee Jae-yong visited the company's Advanced Package Lab (APL) in Yokohama, Japan, on November 1, as the chipmaker looks to Japan's semiconductor materials...