News tagged IC manufacturing at DIGITIMES

NEWS TAGGED IC MANUFACTURING

Monday 3 November 2025

In South Korea's 'Silicon Valley,' AI startups look beyond software

Just south of Seoul, a dense grid of R&D towers known as Pangyo Techno Valley has evolved from an industrial cluster into a crucial testbed for South Korea's artificial intelligence...

Monday 3 November 2025

Nexperia China accuses Dutch parent of US$140 million debt

The Chinese arm of Dutch semiconductor maker Nexperia has publicly accused its headquarters of owing more than CNY1 billion (approximately US$140 million) in unpaid fees, escalating...

Monday 3 November 2025

Japan's materials makers scale up for 2nm chip era

As TSMC and Samsung Electronics move closer to mass production of 2nm chips, Japan's semiconductor materials makers are accelerating investments to strengthen their global supply...

Monday 3 November 2025

Taiwan manufacturing set to gain as traditional and electronics sectors strengthen

The recent meeting between US President Donald Trump and his Chinese counterpart Xi Jinping has eased tensions between the two countries, de-escalating rare earth export controls...

Monday 3 November 2025

TSMC unveils four-year price hike for advanced chips starting 2026

Industry sources revealed TSMC had introduced a rare multi-year price increase strategy for its advanced semiconductor processes, effective starting in 2026. The company will implement...

Monday 3 November 2025

Nexperia's supply freeze upends global chip chains, but opens doors for Taiwan

The aftershocks of Nexperia's abrupt suspension of power semiconductor shipments continue to reverberate across the global electronics...

Monday 3 November 2025

Weekly news roundup: Samsung launches aggressive price-cut strategy to catch up in HBM; Intel shifts assembly and testing to Vietnam

Below are the top DIGITIMES Asia stories from October 27 to November 2, 2025.

Monday 3 November 2025

Tong Hsing Electronics eyes growth engines to revive 2026 operations

Tong Hsing Electronic, a CMOS image sensor (CIS) packaging and semiconductor assembly company, reported NT$2.85 billion (US$93 million) in consolidated revenue for the third quarter...

Monday 3 November 2025

Tongfu Microelectronics taps AMD synergy to command the AI packaging frontier

Tongfu Microelectronics, a leading Chinese semiconductor packaging and testing company, made a significant leap in advanced packaging after acquiring 85% of AMD's Suzhou and Penang...

Monday 3 November 2025

Samsung’s 2nm Tesla gamble: a long shot or a long-awaited comeback?

Samsung Electronics' foundry division appears poised for a long-anticipated recovery after winning consecutive chip orders from Tesla. Following reports that Samsung would handle...

Monday 3 November 2025

AI chip packaging complexity drives surge in equipment orders

TSMC is accelerating development beyond the 2nm process node while expanding mass production of CoWoS-L, SoIC, and next-gen WMCM and CoPoS technologies. The semiconductor industry...

Monday 3 November 2025

Win Semiconductor back in the black on US smartphone, 3D sensor demand

Win Semiconductor, the world's largest pure-play gallium arsenide (GaAs) foundry, rebounded sharply in the third quarter of 2025 on strong...

Sunday 2 November 2025

Samsung's Exynos 2600 chips challenge Apple and Qualcomm in early benchmarks

Samsung Electronics' next-generation application processor, the Exynos 2600, appears poised to reclaim the spotlight in the high-end smartphone chip market, with early benchmark tests...

Sunday 2 November 2025

Nvidia strengthens South Korea ties, turning AI drive into geopolitical strategy

As world leaders gather for the APEC Summit in Gyeongju amid tense geopolitics, South Korea is quietly taking on a new strategic role in the global AI race. Nvidia CEO Jensen Huang's...

Saturday 1 November 2025

Siemens turns to software to manage AI’s power surge

The rapid expansion of the semiconductor industry and artificial intelligence (AI) supply chains is driving a sharp increase in global electricity demand, raising new challenges for...

1/200 pages