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NEWS TAGGED IC MANUFACTURING
Wednesday 12 August 2026
TSMC says AI advanced packaging enters system-level battle

AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

Wednesday 12 August 2026
SPIL breaks ground on NT$100B Douliu plant, targeting operations in 2028

Siliconware Precision Industries (SPIL), a subsidiary of ASE Technology Holding (ASEH), broke ground on a new plant in Douliu, Yunlin...

Wednesday 12 August 2026
South Korea deepens semiconductor ceramics collaboration amid chip industry expansion

South Korea is moving to reinforce its semiconductor materials and components ecosystem as chipmakers accelerate capacity expansion...

Wednesday 12 August 2026
Lumentum targets US$2B quarterly run rate as optical capacity expansion accelerates

Lumentum Holdings said it is pulling forward capacity investments across lasers, transceivers, and optical circuit switches (OCS) after...

Wednesday 12 August 2026
OCP: ASE unveils AI packaging trilogy

Demand for AI infrastructure is forcing chipmakers and data-center operators to rethink how systems are built, with implications for...

Wednesday 12 August 2026
Apple's shadow looms over TSMC's Sony sensor deal

TSMC's board formalized its image-sensor tie-up with Sony on Tuesday as part of a broader capacity mandate that underscores how much...

Wednesday 12 August 2026
TSMC-Sony's US$4.69B sensor venture is a defensive play against Samsung and China

TSMC and Sony Group are betting that closer integration, not just closer proximity, is what it will take to keep their combined lead...

Wednesday 12 August 2026
Tsang Yow's semiconductor parts business drives profit growth in 2Q

Tsang Yow said its semiconductor equipment components business had become a major growth driver in July, as the Taiwan transmission-system...

Wednesday 12 August 2026
TSMC tackles CoWoS material risks while cutting 3DIC development cycle to one year
AI computing demand is rapidly increasing the complexity of chip integration, shifting advanced packaging competition beyond individual component performance to reliability and validation...
Wednesday 12 August 2026
Panel makers turn to AI packaging as old fabs gain value
Taiwanese panel makers broadly reported weaker July revenue as some customers pulled in shipments in advance in the first half of the year and memory price increases weighed on consumer...
Wednesday 12 August 2026
Topco and Wah Lee post record July sales on semiconductor materials demand

Topco Scientific Co. and Wah Lee Industrial Corp. both reported record July revenue as chipmakers ran at full utilization and customers...

Wednesday 12 August 2026
Samsung weighs power subsidiary to secure semiconductor electricity by 2027
Samsung Group was reported to be considering a dedicated in-house power-procurement subsidiary to secure electricity directly for its semiconductor production facilities, with operations...
Wednesday 12 August 2026
Everlight starts Thailand plant to boost AI server and auto supply chains
Everlight Electronics has broken ground on a new manufacturing base in Chachoengsao, Thailand, with construction starting in August and mass production planned for the second half...
Tuesday 11 August 2026
TSMC commits JPY282 billion to Sony sensor JV as AI demand outruns Sony's 40nm process

TSMC and Sony Semiconductor Solutions have signed a legally binding definitive agreement to establish Advanced Vision Semiconductor...

Tuesday 11 August 2026
TSMC finally catching up to AI packaging demand after years of doubling capacity: 'CoWoS guy' Jun He

TSMC has been roughly doubling its CoWoS and SoIC capacity annually for the past several years, and is running CoWoS at better than...