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Tuesday 21 July 2026
China's EUV gap keeps semiconductor catch-up in check
As the US continues to tighten export controls on advanced semiconductor equipment to China, questions are mounting over whether China can narrow the gap with leading-edge manufacturing...
Tuesday 21 July 2026
CMTX develops 590mm single-crystal silicon ground ring for chip etching

South Korean semiconductor materials and parts supplier CMTX has developed a roughly 590mm single-crystal silicon ground ring for chip-etching...

Tuesday 21 July 2026
TSMC weighs margin hit against long-term AI payoff in US push

TSMC has announced an additional US$100 billion investment in the US on top of its existing US$165 billion commitment, expanding its...

Tuesday 21 July 2026
Taiwan indicts ex-TSMC employees in first China-linked national core tech espionage case

Taiwan prosecutors have indicted four former TSMC employees for allegedly stealing confidential semiconductor technology with the intent...

Tuesday 21 July 2026
AI reshapes semiconductor growth curve; Zeiss eyes US$2.5 trillion market
Generative AI, high-performance computing (HPC), and large AI models are rapidly reshaping the global semiconductor industry's growth curve. Thomas Stammler, chief technology officer...
Tuesday 21 July 2026
BOE expands into glass-core packaging, solar cells and optical interconnects
BOE Technology Group said on July 20 that it is pushing beyond display panels into glass-core substrate packaging, perovskite solar cells and Micro LED optical interconnects. The Chinese...
Tuesday 21 July 2026
Pat Gelsinger: Intel missed GPU boom, warns Taiwan energy risk

Former Intel CEO Pat Gelsinger has criticized Intel's past strategy in a recent interview, revisiting the company's history with Nvidia...

Tuesday 21 July 2026
Samsung keeps High-NA EUV rollout cautious as foundry profitability remains the focus

Samsung Electronics is taking a slower approach than Intel to High-NA extreme ultraviolet (EUV) lithography for advanced chip production,...

Tuesday 21 July 2026
TSMC sees structural AI growth, expands Arizona capex

TSMC Chief Financial Officer Wendell Huang said the company expects AI chip demand to remain strong for years, prompting it to keep...

Tuesday 21 July 2026
Elite Material, TUC race ahead in AI CCL push

As AI server products accelerate their generational shift and demand higher-frequency, higher-speed transmission, the upgrade cycle...

Tuesday 21 July 2026
Befar begins production of 6N hydrogen fluoride gas for chipmaking

Befar Group has begun producing semiconductor-grade hydrogen fluoride gas with a claimed purity of 6N, or 99.9999%, expanding the Chinese...

Tuesday 21 July 2026
Advanced Echem Materials to invest NT$4.52 billion in Longtan plant
Advanced Echem Materials (AEMC), a semiconductor specialty chemicals materials maker, plans to invest roughly NT$4.52 billion (approx. US$139.66 million) in Taiwan's Longtan Science...
Tuesday 21 July 2026
AI boom may reshape SK Siltron sale as chairman reportedly rethinks
SK Group chairman Chey Tae-Won is reportedly making a final decision on the sale of semiconductor silicon wafer subsidiary SK Siltron, as surging AI chip demand raises doubts about...
Tuesday 21 July 2026
VSMC warns AI-ready MES is becoming essential for wafer fabs, with China accelerating adoption

TSMC's sustained capital spending highlights the two foundations of its competitive strength: technology leadership and manufacturing excellence...

Monday 20 July 2026
Samsung to cut over 800 US jobs amid market headwinds

Samsung Electronics is cutting over 800 jobs in the US from its smartphone, display, and consumer electronics business units. The division,...