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Friday 23 January 2026
Analysis: How Howard Lutnick is redrawing the memory-chip map

US Commerce Secretary Howard Lutnick is driving a fundamental reordering of the global semiconductor supply chain. According to exclusive...

Friday 23 January 2026
TSMC and Samsung reduce 8-inch wafer capacity, but oversupply still remains
TSMC chairman C.C. Wei confirmed adjustments in 8-inch and mature process capacities to improve efficiency, with Samsung also cutting 8-inch output. Despite these reductions and price...
Friday 23 January 2026
TSMC reveals dual purpose behind Chiayi AP7 plant as Yunlin expansion looms
TSMC has significantly expanded its advanced packaging capacity in recent years to meet surging AI customer demand. Despite planning six to eight phases for the Chiayi site, internal...
Friday 23 January 2026
South Korea-made EUV pellicles to be adopted at Samsung's Taylor fab
Industry sources stated that Samsung has signed equipment contracts and placed orders for extreme ultraviolet (EUV) photomask pellicle-related equipment for its Taylor fab with South...
Friday 23 January 2026
Intel’s “better than guidance” quarter comes with a catch
Intel's latest financials highlight a fragile turnaround: while AI-linked data center demand and early traction in advanced manufacturing offer strategic promise, weak margins, volatile...
Friday 23 January 2026
Lip-Bu Tan faces Intel's first real bottleneck of the AI era
Intel outlined an increasingly AI-centric roadmap across client PCs, data centers, and manufacturing. Still, executives cautioned that tight supply and early-stage foundry ramps continue...
Friday 23 January 2026
Intel slows its most ambitious node—and signals where the real battle is for now
Intel is sharpening its manufacturing strategy around yield improvement, selective capital spending, and differentiated advanced packaging, while keeping major 14A capacity investments...
Thursday 22 January 2026
SAS shifts SiC strategy with 12-inch wafers and AI glasses innovation
Facing intense price wars triggered by China's rapid expansion in the global silicon carbide (SiC) wafer industry, Sino-American Silicon Products (SAS) chairwoman Doris Hsu has decisively...
Thursday 22 January 2026
Nvidia overtakes Apple as TSMC's largest customer

Nvidia CEO Jensen Huang said rising demand for AI computing has pushed the company past Apple to become the largest customer of Taiwan...

Thursday 22 January 2026
GlobalWafers' Texas plant holds six-phase expansion potential
GlobalWafers chairwoman Doris Hsu said in a January 21, 2026, media interview that with easing inflation pressures and some central bank policy adjustments, the global economy is experiencing...
Thursday 22 January 2026
GlobalWafers chair sees Taiwan's semiconductor edge, says AI is irreversible
On January 21, 2026, GlobalWafers chairwoman Doris Hsu spoke to the media about the recent US-Taiwan tariff agreement, which lowers Taiwan's reciprocal tariffs to 15% without stacking...
Thursday 22 January 2026
GlobalWafers eyes quarterly revenue growth in 2026; chair sees better market than last year
GlobalWafers chairman Doris Hsu told the media on January 21, 2026, that the company's global expansion plans are starting to pay off, with subsidiaries in Niigata and Utsunomiya,...
Thursday 22 January 2026
Chinese AI chipmakers face mixed reactions to Nvidia H200 block
The US has confirmed that under a new set of stringent regulations, Nvidia's H200 is permitted to be exported to the Chinese market, and Chinese customers have expressed strong demand...
Thursday 22 January 2026
Taiwan advances second-phase quantum strategy, betting on hybrid computing and global partnerships
Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates...
Thursday 22 January 2026
PSMC to upgrade DRAM processes as demand strengthens

Following its announcement to sell the Tongluo fab to Micron Technology, Powerchip Semiconductor Manufacturing (PSMC) provided an update...