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Friday 19 December 2025
Onsemi and GlobalFoundries sign agreement to develop 650V GaN power devices
Onsemi has signed a collaboration agreement with GlobalFoundries to develop and manufacture next-generation gallium nitride (GaN) power devices, expanding its power semiconductor...
Friday 19 December 2025
India's semiconductor outbound investments surge, signaling strategic global ambitions
India's semiconductor sector has increasingly turned to cross-border acquisitions and investments, reflecting a broader push to accelerate technology capabilities and integrate into...
Friday 19 December 2025
South Korea's Uniqconn partners with TSMC to mass-produce 60GHz communication chip
A South Korean logic IC startup is moving closer to cable-free device design with the development of a 60GHz millimeter-wave communication chip designed to replace short-range wired...
Thursday 18 December 2025
Doosan Group named preferred partner in SK Siltron sale talks
South Korea's Doosan Group has been selected as the preferred negotiation partner for the acquisition of semiconductor wafer maker SK Siltron, valued at approximately KRW4 trillion...
Thursday 18 December 2025
Intel completes high-NA EUV validation for 14A, advances 2D transistor tech
Intel has completed acceptance testing of the industry's first commercial high-NA EUV lithography system with a numerical aperture of 0.55, the ASML Twinscan EXE:5200B, laying the...
Thursday 18 December 2025
Rapidus launches AI design tools to support 2nm semiconductor development
On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company's Rapid...
Thursday 18 December 2025
China's EUV prototype forces a rethink of the AI chip order
China has quietly crossed a psychological and potentially strategic threshold in the global semiconductor race. In a tightly controlled laboratory in Shenzhen, Chinese scientists...
Thursday 18 December 2025
Cyient Semiconductors to acquire majority stake in Kinetic Technologies for US$93 million
Cyient Ltd's wholly owned subsidiary, Cyient Semiconductors Singapore Pte Ltd, has entered into a definitive agreement to acquire over 65% of US-based power semiconductor company...
Thursday 18 December 2025
Advanced packaging drives ABF substrate expansion as Taiwanese companies exit post-pandemic capacity cuts
As more AI GPU, CPU, and ASIC customers ramp up their market push, advanced packaging capacity continues to face tight supply. This has prompted upstream IC packaging substrate makers...
Thursday 18 December 2025
Apple reportedly explores chip assembly in India, signaling supply chain diversification
Apple is reportedly in preliminary talks with Indian chip manufacturers to assemble and package components for the iPhone, potentially marking a first step in shifting part of its...
Thursday 18 December 2025
Taiwan targets four research priorities to maintain semiconductor leadership
Taiwan has long dominated advanced semiconductor manufacturing, with TSMC's global R&D headquarters in Hsinchu alone employing over 10,000 researchers. The government continues...
Wednesday 17 December 2025
UMC backs Unimicron expansion to reinforce IC substrate supply as AI demand rises

United Microelectronics Corporation (UMC) announced on December 17 that it will participate in the capital increase of its affiliate, IC...

Wednesday 17 December 2025
Rapidus unveils glass interposer to challenge TSMC
Rapidus, Japan's state-backed chipmaker, has developed a prototype glass interposer for artificial intelligence chips. The company says the technology could lower production costs...
Wednesday 17 December 2025
Samsung Foundry reportedly wins Intel 8nm order after Nvidia
Samsung Electronics' foundry division is reported to have secured an 8nm manufacturing order from Intel, adding another blue-chip customer to its mature advanced-node portfolio after...
Wednesday 17 December 2025
Advantest, Tokyo Seimitsu to co-develop die-level probers for AI and HPC
Semiconductor test equipment supplier Advantest and Tokyo Seimitsu have announced a joint plan to co-develop a next-generation die-level prober for high-performance computing compo...