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Tuesday 6 January 2026
Chinese chipmakers confront yield challenges despite localization push
China is speeding up efforts to localize its semiconductor supply chain to overcome US restrictions on high-end technology exports. Supply chain sources acknowledge that while Chinese...
Tuesday 6 January 2026
Chang Wah interview: strong lead frame growth despite precious metals shortage
Post-pandemic inventory digestion for mature semiconductor processes has come to an end. Market conditions have rebounded amid tariff-hedging and precautionary stocking, driving Taiwan's...
Monday 5 January 2026
TSMC 2nm leak probe leads to additional indictments for three people and Tokyo Electron

Taiwan's High Prosecutors' Office has filed a supplementary indictment against three additional suspects and the Japanese chip equipment maker Tokyo...

Monday 5 January 2026
Chunghwa Precision Test Tech to build new plant in Taoyuan amid growing semiconductor demand
Chunghwa Precision Test Tech (CHPT), a subsidiary of Chunghwa Telecom, plans to start construction of its third Pingzhen plant in Taoyuan in early 2026, with completion expected by...
Monday 5 January 2026
TSMC kicks off 2nm production with Samsung in hot pursuit
The global foundry race has entered a new phase after TSMC announced it has begun volume production of its 2nm process, intensifying competitive pressure on Samsung Electronics as...
Monday 5 January 2026
Lee Jae-myung's first China visit signals warming South Korea-China ties
According to Bloomberg and The Korea Economic Daily, South Korean President Lee Jae-myung made a four-day trip from January 4-7, 2026, to Beijing and Shanghai, including...
Monday 5 January 2026
Japan's Rapidus to launch advanced packaging pilot line in Hokkaido by spring 2026
Japanese chipmaker Rapidus is advancing its 2nm process technology while developing advanced packaging solutions tailored for AI chips. The company aims to officially start trial production...
Monday 5 January 2026
Nexchip Semiconductor launches US$5.1bn Hefei fab to scale 28nm mature-node capacity

China's domestic foundry expansion gained momentum this week as Nexchip Semiconductor broke ground on its Phase IV project in Hefei, committing...

Monday 5 January 2026
Weekly news roundup: TSMC widens 2 nm edge as South Korea boosts chip spending; Huawei eyes memory bottlenecks
These are the most-read DIGITIMES Asia stories in the week of Dec 29 - Jan 4.
Monday 5 January 2026
ITC launches formal investigation into Samsung and Google over Netlist patent dispute
The US International Trade Commission (ITC) announced it has launched an investigation into alleged semiconductor patent infringement involving Samsung Electronics, Google, and Supermicro,...
Monday 5 January 2026
Taiwan fortifies silicon shield with 2026 push to set global chip agenda
As AI server and semiconductor companies look set to close out a profitable 2025, recent Chinese military encirclement exercises and live-fire drills around Taiwan have once again...
Monday 5 January 2026
DIGITIMES chair warns against head-on competition with China's strength
As global tech companies navigate increasingly complex geopolitical tensions and shifting supply chains, strategic positioning against Chinese competitors has become a critical question...
Monday 5 January 2026
TSMC's CoWoS outsourcing to ASE and Amkor challenges Samsung
As its most advanced packaging lines are operating at full capacity, TSMC has transferred part of its advanced packaging orders to outsourced semiconductor assembly and test (OSAT)...
Monday 5 January 2026
Trump orders divestment of EMCORE chip assets, tightening US scrutiny of foreign semiconductor deals
US President Donald Trump has ordered the divestment of certain semiconductor assets of EMCORE Corporation following a national security review that identified risks linked to foreign...
Monday 5 January 2026
India roundup: OSAT players claim legacy packaging price parity

Indian OSAT players aim for price competitiveness on par with Malaysian rivals, as L&T Semiconductor...