中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    Advanced packaging emerges as new battleground in AI chip race between Taiwan and US
    1h 53min ago
    Samsung's consumer electronics face profit challenges amid cost pressures and competition
    1h 53min ago
    AD Technology targets KRW 1 trillion revenue with 2nm CPU platform by 2029-2030
    1h 53min ago
    South Korean panel profits expected to rise despite chipflation
    1h 53min ago
    AI demand drives MLCC shortages with extended lead times among major manufacturers
    1h 53min ago
    South Korea's Hyundai targets Georgia Tech talent as Taiwan lags in humanoid robot sector
    1h 53min ago
    NEWS TAGGED IC MANUFACTURING
    Thursday 2 April 2026
    TSMC says COUPE platform set for production as Samsung outlines SiPh push

    TSMC said its COUPE silicon photonics platform is set to enter volume production this year, as rising demand for high-speed interconnects...

    Wednesday 1 April 2026
    Samsung auctions 123 chip tools during Xi'an NAND upgrade to V8
    Samsung Electronics is reportedly overhauling its production lines, offering 123 idle semiconductor tools for sale across South Korea and Xi'an as it shifts to more advanced process...
    Wednesday 1 April 2026
    SiPh and advanced packaging shine at Touch Taiwan
    The annual Touch Taiwan exhibition will take place April 8-10, 2026, featuring over 300 companies from 12 countries across 820 booths. Jim Hung, chairman of the TDUA, highlighted that...
    Wednesday 1 April 2026
    Nexchip applies for HK listing amid mature-node expansion
    Chinese semiconductor foundry Nexchip has applied to list on the Hong Kong Stock Exchange's Main Board, Guandian.cn reported on March 31, as the company moves to consolidate...
    Wednesday 1 April 2026
    AMEC acquires Sizone to expand CMP capabilities, outlines 2026 strategy
    Chinese semiconductor equipment maker Advanced Micro-Fabrication Equipment (AMEC) announced on March 30, 2026, plans to acquire a stake in chemical mechanical planarization (CMP) equipment...
    Wednesday 1 April 2026
    TSMC eyes SiPh breakthrough as industry consensus forms
    TSMC is advancing its silicon photonics (SiPh) advanced packaging platform, Compact Universal Photonic Engine (COUPE), shifting from development to commercial mass production. TSMC...
    Wednesday 1 April 2026
    India accelerates semiconductor push with Kaynes plant launch
    India is stepping up its semiconductor ambitions as a new domestic plant begins production, underscoring efforts to build a resilient supply chain and position the country as a global...
    Wednesday 1 April 2026
    Nvidia moves beyond GPUs with three-system push to own the AI stack
    At GTC 2026, Nvidia introduced three new systems simultaneously: the Groq LPX inference rack, the Vera ETL256 CPU rack, and the STX storage reference architecture. These launches extend...
    Wednesday 1 April 2026
    China's AI chip demand drives advanced foundry growth amid geopolitical split
    Under a push to localize capacity, China's leading domestic foundries are well-positioned to leverage their home market and policy advantages to replicate TSMC's growth trajectory...
    Wednesday 1 April 2026
    Samsung's 2nm Exynos 2600 loses to Qualcomm's 3nm on battery and thermals
    Samsung's Exynos 2600 application processor (AP), built on the company's 2nm process, lags in battery endurance behind Qualcomm's Snapdragon 8 Elite Gen 5 — a 3nm chip —...
    Tuesday 31 March 2026
    CEA-Leti bets on Taiwan fabs to turn Europe's chip research into reality
    Europe is tightening its semiconductor research links with Taiwan's manufacturing engine, with French research institute CEA-Leti positioning itself as a gateway between the two ec...
    Tuesday 31 March 2026
    Global Foundry 2.0 market climbs to record US$320 billion in 2025 revenue
    The semiconductor industry has formally entered the Foundry 2.0 era, a phase defined by the deep integration of manufacturing, assembly, and testing, profitably driven by the global...
    Tuesday 31 March 2026
    Samsung targets 1nm production by 2030, challenges TSMC with new chiplet technology
    Samsung Electronics is aiming to launch its 1nm semiconductor process by 2030 as part of a direct technological competition with rival TSMC. The move seeks to secure leadership in...
    Tuesday 31 March 2026
    Flex to acquire Electrical Power Products for US$1.1 billion
    Flex said it has reached a definitive agreement to acquire Electrical Power Products (EP2), a specialist in engineered-to-order electrical control and protection systems, as it expands...
    Tuesday 31 March 2026
    Top 10 chart: Taiwan's AI winners diverge as market corrects ahead of lagging revenue data

    By late March, Taiwan's equity market is offering a more nuanced read of the AI infrastructure boom. While accumulated revenue and year-over-year...

    5/217 pages
    Research Report Database
    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook