With the global semiconductor market projected to exceed US$1 trillion within the next decade, IC packaging and testing leader ASE is accelerating its overseas expansion. The company's...
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes,...
Mark Liu, the former executive chairman of Taiwan Semiconductor Manufacturing Company (TSMC), is spearheading a bold initiative to enhance American technology leadership. According...
Fujifilm is rapidly expanding its production of semiconductor materials in Kyushu, Japan. In addition to increasing the production capacity of chemical mechanical polishing (CMP)...
Pat Gelsinger's exit as Intel's chief executive has laid bare a fundamental clash between his vision and that of the board. Gelsinger pushed to ramp up capital spending, expand advanced...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
Despite technological restrictions from the US and its allies, SMIC and Hua Hong Semiconductor remain dedicated to investment and continue to expand their production capacity, highlighting...
Win Semiconductors (WIN), a GaAs foundry, is reportedly one of the beneficiaries of Apple's in-house RF component initiative. Although the Taiwan-based company has declined to provide...
Taiwan's total IC industry output value—including IC design, IC manufacturing, IC packaging, and IC testing—was NT$1.49 trillion (US$45.5 billion) in the fourth quarter...
Tien Wu, CEO of ASE, stated that while Taiwan-based companies excel in developing the "brain" of robots, key sensor technologies such as those related to vision, hearing, speech,...
SK Hynix has reportedly launched a review of its use of Chinese Electronic Design Automation (EDA) software in response to potential US restrictions targeting Chinese technology in...
Nippon Electric Glass (NEG) is increasing its production of carrier glass for advanced memory and semiconductor packaging due to the growing demand for generative AI, which has boosted...
After Taiwan Semiconductor Manufacturing Company's (TSMC) subsidiary JASM's first wafer fab began mass production at the end of 2024, the Kumamoto Prefectural Government initiated...
