Rising demand for AI, 5G, and high-performance computing (HPC) chips is turning advanced packaging into a key front in the semiconductor race. China's largest OSAT provider and the...
Delta Electronics announced on October 29 that it will acquire a 90.23% stake in Japan's Noda RF Technologies (NRF) via its subsidiary Delta Electronics (Netherlands) B.V. for approximately...
Taiwanese semiconductor group Egis Technology held its annual "2025 Egis Tech Day" on October 28, 2025, unveiling a suite of cutting-edge innovations under the theme of "fully activated...
As US semiconductor companies race to expand domestic manufacturing capacity, Texas Instruments (TI) and Micron Technology are emerging as the most aggressive investors, committing...
Brazil's government has warned of an impending semiconductor shortage that could halt car production within weeks, the latest fallout from the Dutch government's takeover of Chinese-owned...
Leading South Korean conglomerate heads are set to engage in intensive "corporate diplomacy" during the 2025 Asia-Pacific Economic Cooperation (APEC) summit, meeting with global leaders...
In response to the surge in AI- and HPC-driven market demand, WPG Holdings' board of directors has approved an adjustment to its investment structure to further advance its semiconductor...
Taiwan's printed circuit board (PCB) manufacturers and outsourcing semiconductor assembly and test (OSAT) providers are positioned for significant growth driven by artificial intelligence...
Apple's mobile DRAM orders are expected to increase significantly in 2026, and the South Korean industry predicts that Samsung Electronics will be the largest beneficiary. News...
Intel is planning to relocate part of its assembly, packaging, and testing capacity to Vietnam as part of a global strategic adjustment aimed at optimizing its manufacturing layout...
The IEEE Asian Solid-State Circuits Conference (A-SSCC), a major annual event in the semiconductor field, recently announced its paper selection results, with six papers from Taiwan...
Powertech Technology Inc. (PTI), a leading memory packaging and testing provider, is fast-tracking its move into fan-out panel-level packaging (FOPLP). Chairman DK Tsai said the company's...
Samsung Electronics has secured the foundry order for Tesla's AI5 chip, following its earlier win of the next-generation AI6 chip contract. Some industry observers believe this reflects...
Intel, a leader in semiconductor integrated device manufacturing (IDM), is advancing its cutting-edge processes, such as 18A and 2.5D/3D advanced packaging. Taiwanese design service...
