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Monday 19 January 2026
China's Innosilicon launches LPDDR6 IP with commercial shipments
As AI smartphones and AI PCs surge, end devices demand unprecedented memory bandwidth. Recently, Chinese interface IP provider Innosilicon announced that its self-developed LPDDR6/5X...
Monday 19 January 2026
Weekly news roundup: memory shortages, packaging power, TSMC's global pivot
Below are the most-read DIGITIMES Asia stories of the week of January 12-18, 2026.
Monday 19 January 2026
OpenAI taps Cerebras for US$10 billion AI chip buildout
OpenAI said it would partner with the artificial intelligence chip maker Cerebras to build 750 megawatts of ultra-low-latency AI computing capacity, a project that will come online...
Monday 19 January 2026
Commentary: TSMC drives tariff talks as Taiwan eyes 40% chip capacity shift to US
After months of trade negotiations, Taiwan and the US have finalized a reciprocal tariff agreement that lowers rates to 15% without stacking most-favored-nation (MFN) tariffs. The...
Monday 19 January 2026
Commentary: US and Taiwan finalize tariff deal, securing favorable terms for semiconductor exports

The US and Taiwan have formally concluded a tariff agreement that sets a 15% rate on covered goods, alongside a sweeping package of Taiwanese...

Monday 19 January 2026
India roundup: Acer bets on growing PC penetration
Acer and Lenovo are optimistic about India's consumer electronics sector as the global market slows due to rising memory prices.
Monday 19 January 2026
Advantest ATE lead times remain tight as AI and memory markets expand
As demand strengthens in markets such as GPUs and high-bandwidth memory (HBM), Japan-based Advantest said orders for semiconductor automated test equipment (ATE) remain stable, with...
Monday 19 January 2026
Ardentec utilization rate rises through 2025 on chip testing demand from networking, automotive, and storage sectors
Semiconductor testing company Ardentec reported steady utilization growth through 2025, driven by strong chip-testing orders from the networking, automotive, and storage markets. The...
Saturday 17 January 2026
TSMC speeds up US expansion while keeping FX strategy simple
TSMC is speeding up its multibillion-dollar expansion in Arizona after posting strong earnings, signaling confidence in long-term artificial intelligence demand and the US push to...
Saturday 17 January 2026
NIAR launches chip-level advanced packaging platform to boost Taiwan's semiconductor edge
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
Saturday 17 January 2026
Samsung DS rebounds to record KRW20 trillion under new leadership
Samsung Electronics Vice Chairman Jun Young-hyun, since his appointment in May 2024, has spearheaded significant changes at the company's Device Solutions (DS) division, reversing...
Saturday 17 January 2026
Amkor to close longstanding Japan chip plant as EV demand slows

Amkor Technology, the US-based semiconductor packaging and testing company, said it will close its Hakodate plant in northern Japan by...

Saturday 17 January 2026
TSMC sees memory price hikes unlikely to curb demand as Apple and Samsung adapt
Tight memory supply has driven market prices sharply higher, prompting industry expectations that 2026 PC and smartphone end-demand will face downward pressure. However, TSMC stated...
Saturday 17 January 2026
Canon eyes 2027 inkjet wafer planarization launch

Canon said on January 13 that it has developed a new wafer planarization technology designed to uniformly smooth surface irregularities...

Saturday 17 January 2026
TSMC chair confirms long-term AI demand and commitment to US expansion
At its January 15, 2026, earnings call, TSMC chairman C.C. Wei addressed questions on the authenticity of AI demand, capital expenditure plans, and US capacity expansion. Wei stated...